The present invention relates to the field of semiconductor technology, particularly to a super-junction schottky diode. According to the present invention, the effective area of schottky junction is increased by forming the schottky junction in the trench located in the body of the device. Therefore, the current capacity of this novel schottky diode can be greatly improved. In addition, a super-junction structure is used to improve the device's reverse breakdown voltage and reduce the reverse leakage current. The super-junction schottky diode provided in the present invention can achieve a larger forward current, a lower on-resistance and a better reverse breakdown characteristic.

A semiconductor device may include a semiconductor substrate, and a plurality of field effect transistors (FETs) on the semiconductor substrate. Each FET may include a gate, spaced apart source and drain regions on opposite sides of the gate, upper and lower vertically stacked superlattice layers and a bulk semiconductor layer therebetween between the source and drain regions, and a halo implant having a peak concentration vertically confined in the bulk semiconductor layer between the upper and lower superlattices.

The present invention relates to the field of semiconductor technology, particularly to a super-junction schottky diode. According to the present invention, the effective area of schottky junction is increased by forming the schottky junction in the trench located in the body of the device. Therefore, the current capacity of this novel schottky diode can be greatly improved. In addition, a super-junction structure is used to improve the device's reverse breakdown voltage and reduce the reverse leakage current. The super-junction schottky diode provided in the present invention can achieve a larger forward current, a lower on-resistance and a better reverse breakdown characteristic.

A power semiconductor device includes: a semiconductor body for conducting a load current between first and second load terminals; source and channel regions and a drift volume in the semiconductor body; a semiconductor zone in the semiconductor body and coupling the drift volume to the second load terminal, a first transition established between the semiconductor zone and the drift volume; a control electrode insulated from the semiconductor body and the load terminals and configured to control a path of the load current in the channel region; and a trench extending into the drift volume along an extension direction and including a field electrode. An ohmic resistance of the field electrode is greater than an ohmic resistance of the control electrode. A distance between the field electrode and the first transition is at least 70% of the total extension of the drift volume in the extension direction.

Provided are a semiconductor device and a manufacturing method therefor that can prevent the breakage of an element and in which the control of impurity amounts is less susceptible to variations in manufacturing processes. A semiconductor substrate has a front surface and includes hole portions extending from the front surface to an inside of the substrate. N-type regions are formed in the semiconductor substrate. At wall surfaces of the hole portions, p-type regions are formed to configure p-n junction with the n-type regions. Each of the p-type regions includes a low-concentration region and a high-concentration region formed at the wall surface of each hole portion. A width of the high-concentration region along the wall surface of the hole portion becomes smaller from the front surface toward a deeper position.