Provided are an amorphous boron nitride film, and a semiconductor device, a field effect transistor and an image sensor which include the same, and a method of manufacturing the amorphous boron nitride film. The amorphous boron nitride film includes a carbon atom-doped amorphous boron nitride compound, wherein an sp.sup.2 BN bonding structure and an sp.sup.3 BN bonding structure are included in the boron nitride film, an sp.sup.2/sp.sup.3 conjugated C?CC?C dopant structure being distributed in 60% or less of the entire amorphous film.

A semiconductor device includes a substrate including a fin-shaped active region that protrudes from the substrate, a gate insulating film covering a top surface and both side walls of the fin-shaped active region, a gate electrode on the top surface and the both side walls of the fin-shaped active region and covering the gate insulating film, one pair of insulating spacers on both side walls of the gate electrode, one pair of source/drain region on the fin-shaped active region and located on both sides of the gate electrode, and a lower buffer layer between the fin-shaped active region the source/drain region. The source/drain regions include a compound semiconductor material including atoms from different groups. The lower buffer layer includes a compound semiconductor material that is amorphous and includes atoms from different groups.

According to one embodiment, a semiconductor device includes first, second, third nitride members, first, second, third electrodes, and a first insulating member. The first nitride member includes a first face along a first plane, a second face along the first plane, and a third face. The third face is connected with the first and second faces between the first and second faces. The third face crosses the first plane. The first face overlaps a part of the first nitride member. The second nitride member includes a first nitride region provided at the first face. The third nitride member includes a first nitride portion provided at the second face. The first electrode includes a first connecting portion. The second electrode includes a second connecting portion. The third electrode includes a first electrode portion. The first insulating member includes a first insulating region.

Embodiments of the disclosure relate to an enhanced-mode high electron mobility transistor. The enhanced-mode high electron mobility transistor includes a substrate, a first III-V semiconductor layer disposed on the substrate, a second III-V semiconductor layer disposed on the first III-V semiconductor layer, a third III-V semiconductor layer disposed on the second III-V semiconductor layer, an amorphous region extending from the third III-V semiconductor layer into the second III-V semiconductor layer and the first III-V semiconductor layer to serve as an isolation region, and a gate electrode disposed in the amorphous region. The second III-V semiconductor layer and the third III-V semiconductor layer include different materials to form a heterojunction.

A nanoelectronics structure is disclosed which includes a substrate layer which has least a first surface and also has a thickness of less than 100 nm. The nanoelectronics structure also includes a dielectric layer, which is deposited on the first surface of the substrate layer and has a thickness of less than 100 nm. This dielectric layer is made up of at least 90 mole percent amorphous boron nitride. Also disclosed is a method for forming a dielectric layer on a substrate using pulsed laser deposition.