The present disclosure provides a silicon controlled rectifier and a manufacturing method thereof. The silicon controlled rectifier comprises: an N-type well 60, an upper portion of which is provided with a P-type heavily doped region 20 and an N-type heavily doped region 28; an N-type well 62, an upper portion of which is provided with a P-type heavily doped region 22 and an N-type heavily doped region 26; and a P-type well 70 connecting the N-type well 60 and 62, an upper portion of which is provided with a P-type heavily doped region 24; wherein a first electrode structure is in mirror symmetry with a second electrode structure with respect to the P-type heavily doped region 24, and active regions of the N-type well 60 and 62 are respectively provided between the P-type heavily doped region 24 and each of the N-type heavily doped region 28 and 26.

An electrostatic discharge (ESD) protection device, incudes an N-type well and a P-type well formed in a semiconductor substrate; a first N-type diffusion region and a first P-type diffusion region formed in the N-type well, separated by a first separation film, and each connected to an Anode terminal; a second N-type diffusion region and a second P-type diffusion region formed in the P-type well, separated by a second separation film, and each connected to a Cathode terminal; a P-type floating region, formed in the P-type well, spaced apart from the second N-type diffusion region and the second P-type diffusion region; and a non-sal layer covering the P-type floating region.

A device includes a first region, a second region disposed on the first region, a third region and a fourth region abutting the third region disposed in the second region, a fifth region disposed in the third region and coupled to a collector disposed above, and a sixth region disposed in the fourth region and coupled to an emitter disposed above. A first isolation is disposed between the collector and the emitter. A seventh region is disposed in the fifth region and coupled to the collector is spaced apart from the first isolation. The first region, the third region, the fifth region, the collector and the emitter have a first conductivity type different from a second conductivity type that the second region, the fourth region, the sixth region and the seventh region have.

A floating base silicon controlled rectifier is provided, which at least comprises a first conductivity type layer; a second conductivity type well formed in the first conductivity type layer; a first conductivity type heavily doped region coupled to a first node and formed in the second conductivity type well; and a second conductivity type heavily doped region coupled to a second node and formed in the first conductivity type layer. The first conductivity type and the second conductivity type are opposite. When the first conductivity type is N type, the second conductivity type is P type. Alternatively, when the first conductivity type is P type, the second conductivity type is N type. By employing the proposed present invention, the floating base silicon controlled rectifier acts as a forward diode, and an input capacitance can be greatly reduced.

The present disclosure relates to semiconductor structures and, more particularly, to improved turn-on voltage of high voltage electrostatic discharge device and methods of manufacture. The structure comprises a high voltage NPN with polysilicon material on an isolation structure located at a base region, the polysilicon material extending to at least one of a collector and emitter of a bipolar junction transistor (BJT), and the polysilicon material completely covering the base region of the BJT.

Provided is a semiconductor device including a gate trench portion and a dummy trench portion adjacent to the gate trench portion. The semiconductor device may include: a drift region of a first conductivity type, provided in a semiconductor substrate; a base region of a second conductivity type, provided above the drift region; an emitter region of the first conductivity type, with a doping concentration higher than the drift region, provided above the base region; and a contact region of the second conductivity type, with a doping concentration higher than the base region, provided above the base region. The contact region may be provided below the lower end on the dummy trench portion side of the emitter region in the mesa portion between the gate trench portion and the dummy trench portion.

A protection device includes a first inductive element connecting first and second terminals and a second inductive element connecting third and fourth terminals. A first component includes a first avalanche diode connected in parallel with a first diode string, anodes of the first avalanche diode and a last diode in the string being connected to ground, cathodes of the first avalanche diode and a first diode in the string being connected, and a tap of the first diode string being connected to the first terminal. A second protection component includes a second avalanche diode connected in parallel with a second diode string, anodes of the second avalanche diode and a last diode in the string being connected to ground, cathodes of the second avalanche diode and a first diode in the string being connected, and a tap of the second diode string being connected to the third terminal.

A protection device includes a first inductive element connecting first and second terminals and a second inductive element connecting third and fourth terminals. A first component includes a first avalanche diode connected in parallel with a first diode string, anodes of the first avalanche diode and a last diode in the string being connected to ground, cathodes of the first avalanche diode and a first diode in the string being connected, and a tap of the first diode string being connected to the first terminal. A second protection component includes a second avalanche diode connected in parallel with a second diode string, anodes of the second avalanche diode and a last diode in the string being connected to ground, cathodes of the second avalanche diode and a first diode in the string being connected, and a tap of the second diode string being connected to the third terminal.

A transient voltage suppressor (TVS) device uses a punch-through silicon controlled rectifier (SCR) structure for the low-side steering diode where the punch-through SCR structure realizes low capacitance at the protected node. In some embodiments, the punch-through silicon controlled rectifier of the low-side steering diode includes a first doped region formed in a first epitaxial layer, a first well formed spaced apart from the first doped region where the first well is not biased to any electrical potential, and a second doped region formed in the first well. The first doped region, the first epitaxial layer, the first well and the second doped region form the punch-through silicon controlled rectifier, with the first doped region forming the anode and the second doped region forming the cathode of the punch-through silicon controlled rectifier.

Disclosed herein are IC devices, packages, and device assemblies that include diodes arranged so that their first and second terminals may be contacted from the opposite faces of a support structure. Such diodes are referred to herein as “vertical diodes” to reflect the fact that the diode extends, in a vertical direction (i.e., in a direction perpendicular to the support structure), between the bottom and the top of support structures. Vertical diodes as described herein may introduce additional degrees of freedom in diode choices in terms of, e.g., high-voltage handling, capacitance modulation, and speed.