A 12th solar cell and a 13th solar cell are provided to overlap in part as viewed from a side of a light receiving surface 22. A portion of a light receiving surface of the 12th solar cell and a portion of a back surface of the 13th solar cell face each other in an overlapping portion across a wire. The overlapping portion includes a part where a resin is located both between the light receiving surface of the 12th solar cell and the wire and between the back surface of the 13th cell and the wiring member.

Disclosed are a solar cell and a solar cell module comprising same, the solar cell comprising: a solar cell structure having one or more hollows passing therethrough in the height direction, and a plurality of light-concentrating parts disposed in each of the one or more hollows.

A light sensing device includes a semiconductor layer including a distributed Bragg reflector including a first surface of the semiconductor layer, and a photoelectric conversion unit including a second surface of the semiconductor layer, and the distributed Bragg reflector has a plurality of holes each having, in a cross-sectional view, a width gradually changing from a first width to a second width according to a width change period; a first electrode in one region of the semiconductor layer; and a second electrode on the second surface of the semiconductor layer and having a reflective metal.

A solar cell including: a silicon substrate; a back electrode; a doped silicon layer; an upper electrode, wherein the upper electrode includes a plurality of three-dimensional nanostructures extending along a same direction; an electrode lead, wherein a direction of the electrode lead intersects with the direction of the plurality of three-dimensional nanostructures; wherein the three-dimensional nanostructures includes a first rectangular structure, a second rectangular structure, and a triangular prism structure; the first rectangular structure, the second rectangular structure, and the triangular prism structure are stacked, a first width of a bottom surface of the triangular prism structure is equal to a second width of a top surface of the second rectangular structure, and is greater than a third width of a top surface of the first rectangular structure, materials of the first rectangular structure and the triangular prism structure are metal.

An optical semiconductor element having a mesa portion includes a substrate and semiconductor layers on the substrate. The optical semiconductor element further includes a first contact electrode, a second contact electrode on the semiconductor layer, first and second lead-out wires connected to the first and second contact electrodes, respectively, and an insulating film covering at least an upper surface of the semiconductor layer and the second contact electrode. The second lead-out wire is connected to the second contact electrode in an opening of the insulating film. An outer peripheral end of the second contact electrode in at least a portion where the second contact electrode and the second lead-out wire are connected is above and outside an outer peripheral end of a connection portion with the semiconductor layer, and an inner peripheral end is above and inside an inner peripheral end of the connection portion with the semiconductor layer.

A photonic device that includes two electrodes and a two-dimensional (2D) material electrically connecting the two electrodes. The 2D material may be molybdenum ditelluride. Strain may be induced in the 2D material (e.g., by placing the 2D material on a waveguide) to reduce the band gap of the 2D material and increase the efficiency of the photodetector. The photonic device may be a photodetector with 2D material that absorbs light energy and converts it into a photocurrent in a circuit that includes the two electrodes. The photonic device may be an emitter with 2D material that emits light energy in response to an electric field across the two electrodes. The photonic device may be a modulator with 2D material that modulates a property of an optical signal (e.g., the amplitude or phase) by modulating the amount of strain induced in the 2D material.

A solar cell for a solar cell array with one or more grid on a surface thereof, wherein electrical connections are made to the grids in a plurality of locations positioned around the solar cell; and the electrical connections extend to one or more conductors located under the solar cell. The conductors located under the solar cell are buried within a substrate, and each of the conductors comprises a low resistance conducting path that distributes current from the solar cell. The conductors are loops, U-shaped, or have only up or down pathways. The solar cell comprises a full cell that has four cropped corners and the locations are in the cropped corners.

Provided is a solar power generation module, comprising: a lower substrate 100 into which solar cells 200 are inserted; and an upper substrate 300 disposed on the lower substrate 100, wherein the lower substrate 100 comprises piercing parts 110 configured to pass through the lower substrate 100, or spatial groove parts 115 formed in their respective groove shapes in the lower substrate 100, each of the solar cells 200 is disposed in a space between each of the piercing parts 110 or the spatial grove parts 115 of the lower substrate 100, and the upper substrate 300 is disposed at an upper portion of the lower substrate 100 into which the solar cells 200 are inserted.

A photodetector includes: a first conductive type semiconductor layer; a semiconductor light absorption layer provided on the first conductive type semiconductor layer; a scatterer that is provided with a width equal to or less than a wavelength of incident light so as to be in contact with the semiconductor light absorption layer and forms a localized non-uniform electric field inside the semiconductor light absorption layer by scattering the incident light; a second conductive type semiconductor layer provided on the semiconductor light absorption layer so as to be apart from the scatterer; and an extraction electrode that is provided on the second conductive type semiconductor layer so as to be apart from the scatterer and extracts a photocurrent generated in the semiconductor light absorption layer due to formation of the localized non-uniform electric field.

Microstructures of micro and/or nano holes on one or more surfaces enhance photodetector optical sensitivity. Arrangements such as a CMOS Image Sensor (CIS) as an imaging LIDAR using a high speed photodetector array wafer of Si, Ge, a Ge alloy on SI and/or Si on Ge on Si, and a wafer of CMOS Logic Processor (CLP) ib Si fi signal amplification, processing and/or transmission can be stacked for electrical interaction. The wafers can be fabricated separately and then stacked or can be regions of the same monolithic chip. The image can be a time-of-flight image. Bayer arrays can be enhanced with microstructure holes. Pixels can be photodiodes, avalanche photodiodes, single photon avalanche photodiodes and phototransistors on the same array and can be Ge or Si pixels. The array can be of high speed photodetectors with data rates of 56 Gigabits per second, Gbps, or more per photodetector.