Patent classifications
H01L31/035281
Infrared photodetector architectures for high temperature operations
A photo detector having a substrate and a first structure formed on the substrate. The first structure includes an emitter layer formed on the substrate and a base layer formed on the emitter layer. Further, the first structure includes a collector layer formed on the base layer. The collector layer has a plasmonic structure. The plasmonic structure includes a first plurality of mesa structures. Each of the mesa structures of the first plurality of mesa structures includes a second plurality of mesa structures having ridges arranged in a regularly repeating pattern.
Photodetectors including a coupling region with multiple tapers
Structures for a photodetector and methods of fabricating a structure for a photodetector. A photodetector includes a photodetector pad coupled to a waveguide core and a light-absorbing layer coupled to the photodetector pad. The light-absorbing layer has a body, a first taper that projects laterally from the body toward the waveguide core, and a second taper that projects laterally from the body toward the waveguide core. The photodetector pad includes a tapered section that is laterally positioned between the first taper and the second taper of the light-absorbing layer.
Solar cell having a plurality of sub-cells coupled by cell level interconnection
Methods of fabricating solar cells having a plurality of sub-cells coupled by cell level interconnection, and the resulting solar cells, are described herein. In an example, a solar cell includes a plurality of sub-cells. Each of the plurality of sub-cells includes a singulated and physically separated semiconductor substrate portion. Each of the plurality of sub-cells includes an on-sub-cell metallization structure interconnecting emitter regions of the sub-cell. An inter-sub-cell metallization structure couples adjacent ones of the plurality of sub-cells. The inter-sub-cell metallization structure is different in composition from the on-sub-cell metallization structure.
Method For Manufacturing a Semiconductor Structure Having Group III-V Device on Group IV Substrate and Contacts with Liner Stacks
A semiconductor structure includes a group IV substrate and a patterned group III-V device over the group IV substrate. A blanket dielectric layer is situated over the patterned group III-V device. Contact holes in the blanket dielectric layer are situated over the patterned group III-V device. A liner stack having at least one metal liner is situated in each contact hole. Filler metals are situated over each liner stack and fill the contact holes. The patterned group device can be optically and/or electrically connected to group IV devices in the group IV substrate.
SOLAR CELL HAVING A PLURALITY OF SUB-CELLS COUPLED BY CELL LEVEL INTERCONNECTION
Methods of fabricating solar cells having a plurality of sub-cells coupled by cell level interconnection, and the resulting solar cells, are described herein. In an example, a solar cell includes a plurality of sub-cells. Each of the plurality of sub-cells includes a singulated and physically separated semiconductor substrate portion. Each of the plurality of sub-cells includes an on-sub-cell metallization structure interconnecting emitter regions of the sub-cell. An inter-sub-cell metallization structure couples adjacent ones of the plurality of sub-cells. The inter-sub-cell metallization structure is different in composition from the on-sub-cell metallization structure.
SHINGLED SOLAR CELL MODULE
A high efficiency configuration for a solar cell module comprises solar cells conductively bonded to each other in a shingled manner to form super cells, which may be arranged to efficiently use the area of the solar module, reduce series resistance, and increase module efficiency.
Photodetection element
A photodetection element that includes: a substrate with a high infrared transmittance in a desired wavelength region; an electron barrier layer of a type-I superlattice structure, the electron barrier layer being formed above the substrate and lattice-matched to the substrate; and a light-receiving layer of a type-II superlattice structure, formed in contact with the electron barrier layer.
OPTOELECTRONIC DEVICE AND METHOD OF MANUFACTURING AN OPTOELECTRONIC DEVICE
An optoelectronic device comprising an optical waveguide formed in a silicon device layer of a silicon-on-insulator wafer. The optical waveguide including a semiconductor junction comprising a first doped region of semiconductor material and a second doped region of semiconductor material. The second doped region containing dopants of a different species to the first doped region. A first portion of the first doped region extends horizontally on top of the second doped region, a second portion of the first doped region extends vertically along a lateral side of the second doped region and a third portion of the first doped region protrudes as a salient from the first or second portion of the first doped region into the second doped region.
PHOTOELECTRIC CONVERTER AND IMAGING DEVICE
A first photoelectric converter according to an embodiment of the present disclosure includes: a light absorbing layer having a light incidence surface and including a compound semiconductor material; a first electrode that is provided for each of pixels to be opposed to a surface of the light absorbing layer opposite to the light incidence surface; a first semiconductor layer of a first electrical conduction type; a second semiconductor layer of a second electrical conduction type; a diffusion region of the second electrical conduction type; a groove that separates the first semiconductor layer, the second semiconductor layer, and a portion of the light absorbing layer between the adjacent pixels; a first insulating film that is continuously provided on a side wall and a bottom surface of the groove; and a light shielding film that is continuously provided from a side wall of the first semiconductor layer to a side wall of the light absorbing layer with the first insulating film interposed in between. The first semiconductor layer is provided between the light absorbing layer and the first electrode. The second semiconductor layer is provided between the first semiconductor layer and the light absorbing layer. The diffusion region is provided between the adjacent pixels across the second semiconductor layer and the light absorbing layer.
Photodetecting device with enhanced collection efficiency
A photodetecting device includes a substrate, a first photosensitive layer supported by the substrate, and a second photosensitive layer supported by the substrate and adjacent to the first photosensitive layer, each of the first photosensitive layer and the second photosensitive layer being coupled to a first doped portion having a first conductivity type, and a second doped region having a second conductivity type different from the first conductivity type, wherein the first photosensitive layer is separated from the second photosensitive layer, and the first doped portion coupled to the first photosensitive layer is electrically connected to the first doped portion coupled to the second photosensitive layer.