A method is disclosed for applying an electrical conductor to an electrically insulating substrate, which comprises providing a flexible membrane with a pattern of groove formed on a first surface thereof, and loading the grooves with a composition comprising conductive particles. The composition is, or may be made, electrically conductive. Once the membrane is loaded, the grooved first surface of the membrane is brought into contact with a front or/and back of the substrate. A pressure is then applied between the substrate and the membrane(s) so that the composition loaded to the grooves adheres to the substrate. The membrane(s) and the substrate are separated and the composition in the groove is left on the surface of the electrically insulating substrate. The electrically conductive particles in the composition are then sintered to form a pattern of electrical conductors on the substrate, the pattern corresponding to the pattern formed in the membrane(s).

A multi-layer device and its method of manufacture are disclosed. The multi-layer device comprises a first electrode layer, a first repair layer, a functional layer, and a second electrode layer. The first repair layer comprises a conductive hydrogel film or conductive hydrogel beads, the conductive hydrogel film or the conductive hydrogel beads comprising conductive filler particles dispersed in a cross-linked polymer. The repair layer protects the multi-layer device from electrical short circuits. A multi-layer device is also disclosed including a light-transmissive electrode layer comprising a porous mesh or porous spheres.

A solar electrical generator comprising an outer wall (1, 2) arranged to partially surround a cavity. A hub (3) is provided within the cavity wherein the outer face (4) of the wall is provided with solar cells (5). At least one of the hub (3) and the inner face (6) of the wall are provided with solar cells (5).

Provided is a solar cell including: a crystalline silicon semiconductor substrate having a specific radius of curvature; a plurality of microwire structures that extend from a first surface of the crystalline silicon semiconductor substrate in a vertical direction and are arranged spaced apart from each other; a first layer positioned on the first surface of the crystalline silicon semiconductor substrate and forming a P-N junction with the crystalline silicon semiconductor substrate; a first electrode part positioned on the first layer and connected to the first layer; a second layer positioned on a second surface of the crystalline silicon semiconductor substrate which is opposite the first surface; and a second electrode part positioned on the second layer and connected with the second layer.

A wafer-level process includes providing a set of electronic chips, including a stack with a set of matrix arrays of pixels, an interconnect layer electrically connected to the set of matrix arrays of pixels, and a first layer, including vias electrically connected to the interconnect layer. The wafer-level process further includes forming metal pillars on the first layer, the pillars being electrically connected to the vias, and forming a material integrally with the first layer, around the metal pillars. The wafer-level process also includes dicing the electronic chips so as to release the thermomechanical stresses to which the stack is subjected. Finally, the wafer-level process includes making the metal pillars coplanar after dicing the electronic chips.

A process for producing silicon nano-particles from a raw silicon material, the process including steps of alloying the raw silicon material with at least one alloying metal to form an alloy; thereafter, processing the alloy to form alloy nano-particles; and thereafter, distilling the alloying metal from the alloy nano-particles whereby silicon nano-particles are produced.

A display device includes a display panel including a display region, a terminal region provided with a terminal, and a bending region located between the display region and the terminal region and capable of bending, the terminal region being located on a rear surface side opposite to a display surface side with respect to the display region based on the bending region bent and a protective coating provided on the display surface side of the bending region. When a direction in which the display region, the bending region, and the terminal region are arranged is defined as a first direction and a direction crossing the first direction is defined as a second direction, the bending region includes a bank portion located in the second direction with respect to the protective coating, projecting to the display surface side, and extending in the first direction.

A three-dimensional (3D) solar cell includes an active, rigid, and flat material configured to transform solar energy into electrical energy, wherein the active, rigid, and flat material is shaped as first and second petals, each petal having plural sides, plural electrodes formed on a backside of the active, rigid, and flat material, a flexible transparent substrate coating the backside of the active, rigid, and flat material and the plural electrodes, plural trenches formed in the active, rigid, and flat material, to partially expose the plural electrodes and the substrate, and a transparent polymer configured to attach a side from the first petal to a side from the second petal.

An image sensor (32) includes a plurality of pixel sensing portion (320) that are arranged in columns and rows. Each of the pixel sensing portions (320) includes a thin film transistor (11), and a photodetection diode (13) including n-type (16), intrinsic (15), and p-type semiconductor layers (14). The intrinsic semiconductor layer (15) of the photodetection diode (13) of each of the pixel sensing portions (320) has a crystallinity gradient that varies from an amorphous silicon structure to a microcrystalline silicon structure along a first direction (L1) extending from the p-type semiconductor layer (14) toward the n-type semiconductor layer (16). An image sensing-enabled display apparatus (3) and a method of making the image sensor (32) are also disclosed.

Exemplary embodiments of the present disclosure provide for an integrated, flexible, implantable, optical neural interrogation apparatus, computer-accessible medium, system, and method for use thereof An integrated, flexible, fully-implantable, all-optical neural interrogation apparatus can include, e.g., a 2-dimensional (2D) planar array of optical photodetectors on an integrated electronic chip, the integrated electronic chip including control logic and image-capturing electronic circuitry, an amplitude or phase optical imaging mask for imaging, and a biocompatible packaging.