A digital radiographic image sensor includes a flexible first substrate with an image sensor array. A scintillator is formed over the array, and bonding pads in a peripheral region outside the array are connected to the array. A second substrate is attached to a bottom of the first substrate and includes a scribed or perforated break line to enable removal of a peripheral region of the second substrate.

An electronic device comprises plural first substrates, plural photoelectric structures, a third substrate, plural driving units, plural conductive layers and plural first conductive structures. The first substrates are arranged in coplanar in a first direction. The photoelectric structures are arranged in coplanar in the first direction and disposed on the first substrate. Each photoelectric structure has a second substrate, a signal layer and a photoelectric component. The photoelectric component is electrically connected to the signal line of the signal layer. One of the photoelectric structures straddles two adjacent first substrates. The third substrate is connected to the first substrate or the photoelectric structure. The driving units are distributed on the first substrate or the photoelectric structure, and the driving units correspondingly drive the photoelectric components of the photoelectric structures. The optoelectronic structures are electrically connected to the conductive layers via the first conductive structures, respectively.

A process for producing silicon nano-particles from a raw silicon material, the process including steps of alloying the raw silicon material with at least one alloying metal to form an alloy; thereafter, processing the alloy to form alloy nano-particles; and thereafter, distilling the alloying metal from the alloy nano-particles whereby silicon nano-particles are produced.

A thin film radiation detection device includes a photosensitive p-n diode, a polysilicon thin film transistor (TFT), a radiation detection layer, and a substrate. The photosensitive p-n diode and the TFT are formed on the substrate. The radiation detection layer is formed above the substrate and receives multiple radiations. The photosensitive p-n diode receives a conversion output signal from the radiation detection layer and generates a detector signal. The TFT generates an amplified signal based on the detector signal.

A method for manufacturing a photovoltaic module having at least one photovoltaic cell includes a step of encapsulating the photovoltaic cell including the formation of a stack having the photovoltaic cell; an encapsulation film based on a polymer material cross-linked at least at its freezing point; and an adhesion layer based on a crosslinkable polymer material. The adhesion layer is configured to adhere the encapsulation film to the photovoltaic cell. The manufacturing method also includes a cross-linking step including cross-linking the crosslinkable polymer material of the adhesion layer.

A woven fabric with a photovoltaic power generation portion performs photovoltaic power generation by light, such as, e.g., solar light, and has flexibility. The woven fabric is composed of warp yarns and weft yarns. The woven fabric includes at least one functional yarn with a photovoltaic power generation portion as a weft yarn. The functional yarn with a photovoltaic power generation portion includes a photovoltaic power generation portion, a positive electrode conductive wire material connected to a positive electrode of the photovoltaic power generation portion, and a negative electrode conductive wire material connected to a negative electrode of the photovoltaic power generation portion. At least two warp yarns are conductive yarns. One of the conductive yarn is in electric contact with the positive electrode conductive wire material. The other warp yarn is in electric contact with the negative electrode conductive wire material.

The present disclosure relates to electrical connections between shingled solar cells in a solar cell assembly. More particularly, the present disclosure describes the use of low temperature metallic interconnects that reduce resistivity between solar cells and assembly time. In an aspect, an assembly of shingled solar cells is described that includes a first solar cell having an insulating film on a back side, the insulating film having vias that expose a back metal layer of the first solar cell, and a second solar cell having a bus bar on a front side. In this assembly, the back metal layer of the first solar cell is electrically connected to the bus bar of the second solar cell through multiple electrical connections formed by low temperature solder that fills the vias in the insulating film of the first solar cell. A method of fabricating or manufacturing the assembly is also described.

Disclosed is a semiconductor radiation detector assembly including a detector chip having a front side for receiving radiation and a back side; and a flexible substrate including a center portion having its front side attached to the back side of the detector chip and a plurality of strips extending from the center portion and bent to protrude away from the detector chip, wherein the flexible substrate includes a plurality of conductive tracks that extend on a surface of the strips from the center portion towards lateral ends of the strips for electrical coupling and mechanical attachment to one of a plurality of contact pins, and wherein the detector chip is electrically coupled to at least one of the conductive tracks.

A solar cell structure including a solar cell having a front surface and a back surface, a reflective layer disposed proximate the back surface and a flexible support layer disposed between the back surface and the reflective layer.

A flexible circuit that allows a standardized connection interface to connect flexible solar cell(s) for easy integration into electronics devices. This interconnection scheme does not limit the intrinsic solar cell flexibility and may conform to standard design practices in electronic device manufacturing. In an aspect, a solar module is described that includes one or more solar panels and a flexible trace or interconnect having conductive wires inside an insulation material. In another aspect, an electronic device is described that includes a circuit board, one or more solar panels and a flexible trace or interconnect having conductive wires inside an insulation material. The electronic device may be an internet-of-things (IoT) device or an unmanned aerial vehicle (UAV), for example. In yet another aspect, a lighting module is described that includes one or more lighting panels and a flexible trace or interconnect having conductive wires inside an insulation material.