A photovoltaic laminate is disclosed. Embodiments include placing a first encapsulant on a substantially transparent layer that includes a front side of a photovoltaic laminate. Embodiments also include placing a first solar cell on the first encapsulant. Embodiments include placing a metal foil on the first solar cell, where the metal foil uniformly contacts a back side of the first solar cell. Embodiments include forming a metal bond that couples the metal foil to the first solar cell. In some embodiments, forming the metal bond includes forming a metal contact region using a laser source, wherein the formed metal contact region electrically couples the metal foil to the first solar cell. Embodiments can also include placing a backing material on the metal foil. Embodiments can further include forming a back layer on the backing material layer and curing the substantially transparent layer, first encapsulant, first solar cell, metal foil, backing material and back layer to form a photovoltaic laminate.

A process for the preparation of colored solar cells or colored solar cell modules containing a colored polymer film with oriented effect pigments, and colored solar cells or colored solar cell modules prepared by this process.

A blocking diode board (“BDB”) for use with a rollable solar power module (“RSPM”) array is disclosed. The DBD includes a blocking diode, first flat electrical conductor, second flat electrical conductor, first tubular hook, and second tubular hook.

A solar power generation module is provided for maximizing the power generated from the module and minimizing the power degradation inflicted by light obstructions. The module includes solar cells arranged in a matrix of N columns and M rows. At least one pair of neighboring rows of solar cells is mechanically and electrically interconnected by single wide polymer conductor stripe that extends over at least two adjacent columns of the at least one pair of neighboring rows. All solar cells in each pair of neighboring rows of a mutual string, are electrically interconnected in series by at least one respective thin wire conductor embedded inside the polymer conductor stripe. At least one solar cell in each string of solar cells is electrically interconnected in parallel to one or two solar cells, situated in a mutual row of an adjacent string, by a parallelly-connection conductive means.

A solar module includes solar cells that are encapsulated. A back layer is disposed towards back sides of the solar cells and a transparent layer is disposed towards front sides of the solar cells. A protection coating is formed on a surface of the solar cells. The protection coating can be continuous or have a pattern with cutouts that expose the surface of the solar cells.

In accordance with one or more embodiments herein, a method of manufacturing a photovoltaic (PV) top module, to be used together with a PV bottom module, e.g an SI-based PV bottom module, is provided. The method may include monolithically interconnecting a plurality of thin film based PV sub-cells, manufactured using a perovskite material and/or a CIGS material as solar absorbing material, in series on a substrate in order to create a PV top module including at least one first PV top sub-module, and arranging metal grid lines on top and bottom contact layers of the PV top module. The metal grid lines may be arranged either above or below the top and bottom contact layers of the PV top module.

The present invention relates to a method for manufacturing a solar cell, comprising: a seating process of seating, in a processing space for manufacturing a solar cell, a cell in which a plurality of thin film layers are formed; a coating process of spraying a conductive material onto the cell; and a scribing process of irradiating a laser toward the cell to form a cell separation unit for separating the cell into a plurality of unit cells.

A method for manufacturing a solar cell comprising forming a series of transparent electrode layer material films on electroconductive semiconductor layers on the reverse surface side of a substrate; forming metal electrode layers on the transparent electrode layer material films; forming insulation layers covering the entirety of the metal electrode layers except for a first non-insulation region, and insulation layers covering the entirety of the metal electrode layers excluding a second non-insulation region; and forming patterned transparent electrode layers and leaving the insulation layers using an etching technique in which the insulation layers are masks. In the insulation layer formation, the first non-insulation region positioned on a first straight line extending in a first direction is formed in the insulation layers, and the second non-insulation region positioned on a second straight line, different from the first straight line, extending in the first direction is formed in the insulation layers.

A heterojunction battery, a preparation method therefor, and an application thereof are provided. The heterojunction battery includes a substrate, a first intrinsic amorphous silicon layer, an N-type doped amorphous silicon layer or microcrystalline silicon layer or nanocrystalline silicon layer, a first transparent conductive oxide layer, a second intrinsic amorphous silicon layer, a P-type doped amorphous silicon layer or microcrystalline silicon layer or nanocrystalline silicon layer, a second transparent conductive oxide layer, and a dielectric film. The heterojunction battery further includes a metal mesh. The metal mesh penetrates through the dielectric film and is fixedly connected to the first transparent conductive oxide layer and the second transparent conductive oxide layer, respectively. The metal mesh is composed of multiple first metal wires and multiple second metal wires. The first metal wires are perpendicular to the second metal wires.

The present disclosure provides interconnect elements and methods of using interconnect elements. In one embodiment, the interconnect element includes: a first end including at least three members, each member having a pair of parallel gap weld positions for mounting an adjoining first component; a second opposing end including at least two members, each member having a pair of parallel gap weld positions for mounting an adjoining second component; and one or more interconnect connecting portions to attach the first end of the interconnect element to the second end of the interconnect element.