Provided are an infrared detecting device and an infrared detecting system including the infrared detecting device. The infrared detecting device includes at least one infrared detector, and the at least one infrared detector includes a substrate, a buffer layer, and at least one light absorbing portion. The buffer layer includes a superlattice structure.

The present technique relates to a solid-state imaging device and an imaging apparatus that enable provision of a solid-state imaging device having superior color separation and high sensitivity.

The solid-state imaging device includes a semiconductor layer in which a surface side becomes a circuit formation surface, photoelectric conversion units PD1 and PD2 of two layers or more that are stacked and formed in the semiconductor layer, and a longitudinal transistor Tr1 in which a gate electrode is formed to be embedded in the semiconductor layer from a surface of the semiconductor layer. The photoelectric conversion unit PD1 of one layer in the photoelectric conversion units of the two layers or more is formed over a portion of the gate electrode of the longitudinal transistor Tr1 embedded in the semiconductor substrate and is connected to a channel formed by the longitudinal transistor Tr1.

An electronic device includes a photodiode, a first transistor, a second transistor, a third transistor and a capacitor. The photodiode has a first terminal and a second terminal. The first transistor has a control terminal used to receive a reset signal, a first terminal coupled to the second terminal of the photodiode, and a second terminal. The second transistor has a control terminal coupled to the second terminal of the photodiode, a first terminal and a second terminal. The third transistor has a control terminal used to receive a row selection signal, a first terminal coupled to the second terminal of the second transistor, and a second terminal. The capacitor has a first terminal coupled to the second terminal of the photodiode, and a second terminal coupled to the second terminal of the first transistor.

Structures including multiple photodiodes and methods of fabricating a structure including multiple photodiodes. A substrate has a first trench extending to a first depth into the substrate and a second trench extending to a second depth into the substrate that is greater than the first depth. A first photodiode includes a first light-absorbing layer containing a first material positioned in the first trench. A second photodiode includes a second light-absorbing layer containing a second material positioned in the second trench. The first material and the second material each include germanium.

The invention concerns a hybrid multispectral device comprising a substrate having a first surface and a second surface, at least one first functional element having a first functional layer operable to detect or emit light of a first wavelength range, and at least one second functional element having a second functional layer operable to detect or emit light of a second wavelength range different from the first wavelength range. The first functional element is arranged on the first surface of the substrate, while the second functional element is arranged on the second surface of the substrate. The first functional element is arranged in a first lateral region of the multispectral device, and the second functional element is arranged in a second lateral region of the multispectral device. The first lateral region and the second lateral region are arranged laterally offset from each other such that the light of the second wavelength region reaches the second functional element or the light of the second wavelength region emitted from the second functional element exits the multispectral device on the first surface of the substrate without having passed through the first functional layer.

A light receiving element capable of detecting predetermined light among incident light beams with high sensitivity by a simple structure is provided. A light receiving element 100 that detects ultraviolet rays UV in sunlight SL includes an N-type semiconductor substrate 1, a P-type conductive layer 2 formed on the surface of the semiconductor substrate 1, an N-type ultraviolet absorption layer 3 formed on the surface of the conductive layer 2, transmitting visible rays VL in the sunlight SL, and absorbing the ultraviolet rays UV to excite electrons, and an N-type detection layer 4 formed at a position separated from the ultraviolet absorption layer 3 on the surface of the conductive layer 2 and detecting electrons flowing from the ultraviolet absorption layer 3 as a first photocurrent I.sub.L1.

A CMOS image sensor includes: a substrate containing a potential well stack including: a first p-well, a first n-well disposed below the first p-well, a second p-well disposed below the first n-well, a second n-well disposed below the second p-well, and a third p-well disposed below the second n-well, wherein a first photodiode is formed at the junction between the first p-well and first n-well, a second photodiode is formed at the junction between the first n-well and second p-well, a third photodiode is formed at the junction between the second p-well and the second n-well, and a fourth photodiode is formed at the junction between the second n-well and the third p-well, and each photodiode is disposed at a different respective depth within the substrate; and a plurality of active pixel sensors for converting light received by the photodiodes into electrical charge.

A silicon based photodetector and method of manufacturing the same are provided. The photodetector comprising: a silicon substrate; a buried oxide layer, above the silicon substrate; and a waveguide, above the buried oxide layer. The waveguide includes a silicon, Si, containing region and a germanium tin, GeSn, containing region, both located between a first doped region and a second doped region of the waveguide, thereby forming a PIN diode. The first doped region and the second doped region are respectively connected to first and second electrodes, such that the waveguide is operable as a photodetector.

A photodetector having a small form factor and having high detection efficiency with respect to both visible light and infrared rays may include a first electrode, a collector layer on the first electrode, a tunnel barrier layer on the collector layer, a graphene layer on the tunnel barrier layer, an emitter layer on the graphene layer, and a second electrode on the emitter layer. The photodetector may be included in an image sensor. An image sensor may include a substrate, an insulating layer on the substrate, and a plurality of photodetectors on the insulating layer. The photodetectors may be aligned with each other in a direction extending parallel or perpendicular to a top surface of the insulating layer. The photodetector may be included in a LiDAR system.

A photodetecting device is provided. The photodetecting device includes a first photodetecting component including a substrate having a first absorption region configured to absorb photons having a first peak wavelength and to generate first photo-carriers, and a second photodetecting component including a second absorption region configured to absorb photons having a second peak wavelength different from the first peak wavelength and to generate second photo-carriers. The first photodetecting component further includes two first readout circuits and two first control circuits for the first photo-carriers and electrically coupled to the first absorption region. The second photodetecting component further includes two second readout circuits and two second control circuits for the second photo-carriers and electrically coupled to the second absorption region, wherein the two second readout circuits are separated from the two first readout circuits, and the two second control circuits are separated from the two first control circuit.