H01L31/153

Semiconductor component with regions electrically insulated from one another and method for making a semiconductor component

Semiconductor component comprising at least two semiconductor regions are disclosed. In one embodiment the semiconductor regions of the semiconductor component are electrically isolated from one another by an insulator, and a deposited, patterned, metallic layer extends over the semiconductor regions and over the insulator.

Semiconductor component with regions electrically insulated from one another and method for making a semiconductor component

Semiconductor component comprising at least two semiconductor regions are disclosed. In one embodiment the semiconductor regions of the semiconductor component are electrically isolated from one another by an insulator, and a deposited, patterned, metallic layer extends over the semiconductor regions and over the insulator.

Semiconductor device
09773936 · 2017-09-26 · ·

A semiconductor device is provided, which has a wide-bandgap semiconductor element, such as a SiC element, and which includes a sensor capable of responding sufficiently to characteristic requirements for protecting and controlling the semiconductor element. The semiconductor device includes a wide-bandgap semiconductor element mounted on a substrate; and a light-receiving element that receives light emitted from the wide-bandgap semiconductor element when the wide-bandgap semiconductor element is in a conduction state.

Semiconductor device
09773936 · 2017-09-26 · ·

A semiconductor device is provided, which has a wide-bandgap semiconductor element, such as a SiC element, and which includes a sensor capable of responding sufficiently to characteristic requirements for protecting and controlling the semiconductor element. The semiconductor device includes a wide-bandgap semiconductor element mounted on a substrate; and a light-receiving element that receives light emitted from the wide-bandgap semiconductor element when the wide-bandgap semiconductor element is in a conduction state.

Light emitting diode and fabrication method thereof, array substrate and display panel

The present disclosure is related to a light emitting diode. The light emitting diode includes a first transparent electrode layer; a light emitting layer on the first transparent electrode layer; a reflective electrode layer on a surface of the light emitting layer opposite from the first transparent electrode layer, and a second transparent electrode layer. The reflective electrode layer may include transmission hole. The second transparent electrode layer may cover or fill the transmission hole. The transmission hole may be configured to transmit light emitted from the light emitting layer to pass through the second transparent electrode layer.

Full-screen image display and optical assembly thereof
11343419 · 2022-05-24 · ·

A full-screen image display and an optical assembly thereof are provided. The full-screen image display includes a first display module and a second display module. The first display module is an organic LED display, a liquid crystal display or an LED display for providing a first image, and the second display module is an LED display for providing a second image. The first display module and the second display module are adjacent or connected to each other, and the first image and the second image are combined to form a continuous image. The second display module includes a circuit substrate, an image display unit disposed on the circuit substrate, and a plurality of electronic units disposed on the circuit substrate. The image display unit includes a plurality of LED chips disposed on the circuit substrate, and the second image is provided by the LED chips.

Full-screen image display and optical assembly thereof
11343419 · 2022-05-24 · ·

A full-screen image display and an optical assembly thereof are provided. The full-screen image display includes a first display module and a second display module. The first display module is an organic LED display, a liquid crystal display or an LED display for providing a first image, and the second display module is an LED display for providing a second image. The first display module and the second display module are adjacent or connected to each other, and the first image and the second image are combined to form a continuous image. The second display module includes a circuit substrate, an image display unit disposed on the circuit substrate, and a plurality of electronic units disposed on the circuit substrate. The image display unit includes a plurality of LED chips disposed on the circuit substrate, and the second image is provided by the LED chips.

Hybrid electro-optically controlled matrix-addressed systems

An electro-optically controlled active-matrix system comprises a system substrate, row wires extending in a row direction disposed on the system substrate, a row controller providing a row electrical signal to each row wire, column light-pipes extending in a column direction disposed on the system substrate, a column controller providing a column optical signal to each column light-pipe, and pixels disposed over the system substrate. Each pixel can comprise a pixel circuit that is uniquely responsive to a row wire and to a column light-pipe, the pixel circuit receiving the row electrical signal from the row wire and receiving the column optical signal from the column light-pipe. In some embodiments, column wires carrying column electrical signals extend in a column direction over the system substrate and the pixel circuit is capacitively coupled to the row wire, the column wire, or both.

Hybrid electro-optically controlled matrix-addressed systems

An electro-optically controlled active-matrix system comprises a system substrate, row wires extending in a row direction disposed on the system substrate, a row controller providing a row electrical signal to each row wire, column light-pipes extending in a column direction disposed on the system substrate, a column controller providing a column optical signal to each column light-pipe, and pixels disposed over the system substrate. Each pixel can comprise a pixel circuit that is uniquely responsive to a row wire and to a column light-pipe, the pixel circuit receiving the row electrical signal from the row wire and receiving the column optical signal from the column light-pipe. In some embodiments, column wires carrying column electrical signals extend in a column direction over the system substrate and the pixel circuit is capacitively coupled to the row wire, the column wire, or both.

DISPLAY DEVICE

A display device includes a substrate including a first surface, and a second surface positioned at a side opposite to the first surface; a first light-emitting element located at a lateral side of the substrate; a plurality of light-receiving elements located at a second surface side of the substrate; a plurality of second light-emitting elements located on the first surface of the substrate; and a first drive element controlling driving of the second light-emitting elements based on output of the light-receiving elements. A light-emitting surface of the first light-emitting element is oriented in a first direction. The first direction is parallel to a direction from the first surface toward the second surface. Light-emitting surfaces of the second light-emitting elements are oriented in a second direction. The second direction is from the second surface toward the first surface.