A cover for an electronic circuit package, including: a body having an opening extending therethrough; a first element located in the opening and having a surface continuing planar or rounded shapes of a surface of the cover; and a second element of connection of the first element to the body.

An electronic circuit including a cover crossed by an element and having a planar main inner surface.

An optical sensor including a substrate and a plurality of pixel units are provided. The pixel units are disposed on the substrate, and each of the pixel units includes a light source element, a light sensor element, a circuit unit, and an isolation element. Herein, the light source element emits light, the light sensor element senses an optical image. The circuit unit is configured to drive the light source element to emit light and to drive the light sensor element to sense the optical image. The isolation element isolates the light sensor element from the light source element. In addition, the light source element is disposed between the isolation element of the respective pixel unit and an isolation element of a neighboring pixel unit.

An encapsulation cover for an electronic package includes a frontal wall with a through-passage extending between faces. The frontal wall includes an optical element that allows light to pass through the through-passage. A cover body and a metal insert that is embedded in the cover body, with the cover body being overmolded over the metal insert, defines at least part of the frontal wall.

An optically-controlled switch and a method therefor are provided. The optically-controlled switch includes a printed circuit board (PCB) including upper and lower layers and a dielectric layer between the upper and lower layers, a plurality of vias electrically connected to the upper and lower layers and located in at least two rows, a shunt via electrically connected to the lower layer and separated from the upper layer by a dielectric gap, and a photoconductive semiconductor element (PSE) electrically connected to the upper layer and the shunt via, wherein the PSE includes a dielectric state and a conductor state, and wherein an electromagnetic wave provided to the optically-controlled switch propagates or is blocked through a waveguide formed between the at least two rows.

A light receiving device including: a light receiving element configured to receive at least a portion of light incident from an outside and output an output signal corresponding to amount of received light; a molded resin portion configured to seal at least a portion of the light receiving element; a temperature information acquiring unit configured to acquire temperature information; a humidity information calculating unit configured to calculate humidity information, based on information relating to at least either electrical characteristics or optical characteristics of the light receiving element and the temperature information; and a compensating unit configured to compensate the output signal, based on the temperature information and the humidity information.

An optical coupling device includes a first lead frame, a second lead frame, a first mounting member, a second mounting member, the members respectively provided on the first lead frame and, the second lead frame a light emitter provided on the first mounting member, a light receiver provided on the second mounting member, a first wire and a second wire electrically connecting the light emitter to the first lead frame, and the light receiver to the second lead frame, and an outer resin enclosure enclosing a part of the first lead frame and the second lead frame, the light emitter, and the light receiver, wherein at least the light emitter and the light receiver in the outer resin enclosure are covered with a silicone resin cured material.

A semiconductor device includes a first die pad, a light-receiving element, a light-emitting element, a first sheet, and a resin part. The first die pad has a first obverse surface facing a first side in a thickness direction. The light-receiving element is mounted on the first obverse surface. The light-emitting element is disposed on the first side in the thickness direction with respect to the light-receiving element. The first sheet has light-passing and insulating properties and is interposed between the light-receiving element and the light-emitting element in the thickness direction. The resin part covers the light-receiving element, the light-emitting element and the first sheet. The first sheet includes a first surface facing the first side in the thickness direction and a second surface facing away from the first surface. At least a portion of the first surface and the second surface includes an uneven portion with irregularities.

An infrared (IR) sensor and a method of detecting molecular species in a liquid. In one embodiment, the IR sensor includes: (1) an IR light source configured to emit IR light, (2) a sensing element configured to receive the IR light, the IR light generating an evanescent field about the sensing element as the IR light propagates therethrough, molecules in a subject liquid interacting with the evanescent field and affecting a characteristic of the IR light and (3) an IR light detector configured to receive the IR light from the sensing element and detect the characteristic.

The present invention relates to an apparatus for damping arid monitoring emissions from a light emitting device, particularly a vertical cavity surface emitting laser (VCSEL), comprising: a semi transparent substrate, preferably glass; a light emitting device for generating light emission; a damping layer deposited on a surface of the substrate; and a pair of electrodes, each of which being in direct contact with the damping layer. The damping layer is adapted to decrease the power level of the light emission of the light emitting device by absorption, to a desired level, for instance, to a level that meets eye safety limits. In addition, the damping layer is photosensitive to the light emission of the light emitting device, thereby allowing the pair of electrodes to output an electric signal corresponding to the power level of the light emission of the light emitting device.