A semiconductor device package includes a substrate, a first encapsulant and a second encapsulant. The substrate has an optical region and a surface-mount technology (SMT) device region. The first encapsulant includes a first portion disposed on the optical region and covers the optical region and a second portion disposed on the SMT device region and covers the SMT device region. The second encapsulant is disposed on the substrate and covers at least a portion of the second portion of the first encapsulant and a portion of the first portion of the first encapsulant.

A semiconductor device package includes a substrate, a first encapsulant and a second encapsulant. The substrate has an optical region and a surface-mount technology (SMT) device region. The first encapsulant includes a first portion disposed on the optical region and covers the optical region and a second portion disposed on the SMT device region and covers the SMT device region. The second encapsulant is disposed on the substrate and covers at least a portion of the second portion of the first encapsulant and a portion of the first portion of the first encapsulant.

A detection device includes a substrate, a light-emitter, and a light receiver. The substrate includes a first surface area and a second surface area, in which the first surface area has a first reflectance greater than a second reflectance of the second surface area. The light emitter is disposed on the first surface area, and the light receiver is disposed on the second surface area. The light receiver has a third reflectance which is substantially the same as the second reflectance of the second surface area.

A detection device includes a substrate, a light-emitter, and a light receiver. The substrate includes a first surface area and a second surface area, in which the first surface area has a first reflectance greater than a second reflectance of the second surface area. The light emitter is disposed on the first surface area, and the light receiver is disposed on the second surface area. The light receiver has a third reflectance which is substantially the same as the second reflectance of the second surface area.

A chip package structure includes a substrate having a first surface and a second surface being opposite surfaces of the substrate; a housing disposed on the first surface of the substrate and enclosing a chip region; and a chip set disposed in the chip region and electrically connected to the substrate. The chip set includes a first chip and a second chip, and an active surface of the second chip faces the active surface of the first chip.

An integrated circuit (IC) includes a substrate having a first surface and a second surface opposite the first surface. The substrate has a first region containing a first circuit and a second region containing a second circuit. The first circuit operates at a first supply voltage. The second circuit operates at a second supply voltage. The second supply voltage is higher than the first supply voltage. The IC includes a through wafer trench (TWT) extending from the first surface of the substrate to the second surface of the semiconductor substrate. The TWT separates the first region from the second region. A dielectric material is in the TWT. An interconnect region has layers of dielectric on the first surface of the substrate. The interconnect region is continuous over the first region, the second region, and the TWT. A non-galvanic communication channel is between the first and second circuits.

An integrated circuit (IC) includes a substrate having a first surface and a second surface opposite the first surface. The substrate has a first region containing a first circuit and a second region containing a second circuit. The first circuit operates at a first supply voltage. The second circuit operates at a second supply voltage. The second supply voltage is higher than the first supply voltage. The IC includes a through wafer trench (TWT) extending from the first surface of the substrate to the second surface of the semiconductor substrate. The TWT separates the first region from the second region. A dielectric material is in the TWT. An interconnect region has layers of dielectric on the first surface of the substrate. The interconnect region is continuous over the first region, the second region, and the TWT. A non-galvanic communication channel is between the first and second circuits.

A first SPAD array on which at least one first light beam that is at least one pulse light beam is incident and which is operated in Geiger mode, a second SPAD array on which at least one second light beam resulting from the at least one first light beam reflected by a detection object is incident and which is operated in Geiger mode, a voltage generation unit that applies a reverse bias voltage to the first SPAD array and the second SPAD array, and a SPAD photon detection rate controller that adjusts and controls a SPAD photon detection rate in accordance with a first photon detection rate indicating a rate of the number of at least one pulse signal output by the second SPAD array upon incidence of the at least one second light beam relative to the number of the at least one pulse light beam are included.

A display screen, comprising a panel (1), a light-emitting plate (2), a light blocking film (3) and an image sensor (4) that are stacked sequentially. The light blocking film (3) is provided with a light-transmitting imaging pinhole (31); the light-emitting plate (2) is provided with a plurality of light-emitting units (21) and a circuit network (22) for driving each of the light-emitting units (21), wherein the circuit network (22) divides the light-emitting plate (2) into a plurality of light-transmitting regions (23), and a light path is formed by the panel (1), the light-transmitting region (23) corresponding to a position of the imaging pinhole and the imaging pinhole (31); alternatively, the light-emitting plate (2) is a plane light-emitting plate which is light-transmissive, and a light path is formed by the panel (1), the plane light-emitting plate and the imaging pinhole (31); and a part of light projected by the light-emitting plate (2) toward the panel (1) is reflected by a target object located on or outside the panel (1), and then irradiated onto the image sensor (4) through the light path. According to the principle of pinhole imaging, the light passing through the imaging pinhole (31) can image on the image sensor (4), thereby enabling the display screen to have both a display function and an image acquisition function.

A display screen, comprising a panel (1), a light-emitting plate (2), a light blocking film (3) and an image sensor (4) that are stacked sequentially. The light blocking film (3) is provided with a light-transmitting imaging pinhole (31); the light-emitting plate (2) is provided with a plurality of light-emitting units (21) and a circuit network (22) for driving each of the light-emitting units (21), wherein the circuit network (22) divides the light-emitting plate (2) into a plurality of light-transmitting regions (23), and a light path is formed by the panel (1), the light-transmitting region (23) corresponding to a position of the imaging pinhole and the imaging pinhole (31); alternatively, the light-emitting plate (2) is a plane light-emitting plate which is light-transmissive, and a light path is formed by the panel (1), the plane light-emitting plate and the imaging pinhole (31); and a part of light projected by the light-emitting plate (2) toward the panel (1) is reflected by a target object located on or outside the panel (1), and then irradiated onto the image sensor (4) through the light path. According to the principle of pinhole imaging, the light passing through the imaging pinhole (31) can image on the image sensor (4), thereby enabling the display screen to have both a display function and an image acquisition function.