A proximity detector device may include a first interconnect layer including a first dielectric layer, and first electrically conductive traces carried thereby, an IC layer above the first interconnect layer and having an image sensor IC, and a light source IC laterally spaced from the image sensor IC. The proximity detector device may include a second interconnect layer above the IC layer and having a second dielectric layer, and second electrically conductive traces carried thereby. The second interconnect layer may have first and second openings therein respectively aligned with the image sensor IC and the light source IC. Each of the image sensor IC and the light source IC may be coupled to the first and second electrically conductive traces. The proximity detector device may include a lens assembly above the second interconnect layer and having first and second lenses respectively aligned with the first and second openings.

The present invention discloses active blue light leakage preventing LED structures. Each of the structure includes a circuit board, at least one blue light LED die, a photo detector and a wavelength transformation layer, wherein the electric circuit on the circuit board receives detection signal from the photo detector and turns off the said blue light LED die accordingly. With the implementation of the present invention, the active blue light leakage preventing LED structure turns off the blue light LED die when it reaches its usage life span limit thus avoiding damage to human from the massive release of blue light.

The present invention discloses active blue light leakage preventing LED structures. Each of the structure includes a circuit board, at least one blue light LED die, a photo detector and a wavelength transformation layer, wherein the electric circuit on the circuit board receives detection signal from the photo detector and turns off the said blue light LED die accordingly. With the implementation of the present invention, the active blue light leakage preventing LED structure turns off the blue light LED die when it reaches its usage life span limit thus avoiding damage to human from the massive release of blue light.

An apparatus includes an optoelectronic module including a light emitting die and a light receiver die mounted on a PCB substrate. The optoelectronic module further includes an optical element on the light emitting die and an optical element on the light receiver die, the optical elements being composed of a first epoxy. A second epoxy laterally surrounds and is in contact with respective side surfaces of the light emitting die, the light receiver die and the optical elements, wherein the second epoxy provides an optical barrier between the light emitting die and the light receiver die. A method of manufacturing such modules is described as well.

An apparatus includes an optoelectronic module including a light emitting die and a light receiver die mounted on a PCB substrate. The optoelectronic module further includes an optical element on the light emitting die and an optical element on the light receiver die, the optical elements being composed of a first epoxy. A second epoxy laterally surrounds and is in contact with respective side surfaces of the light emitting die, the light receiver die and the optical elements, wherein the second epoxy provides an optical barrier between the light emitting die and the light receiver die. A method of manufacturing such modules is described as well.

An efficient monolithic optocoupler device that includes a photovoltaic region, an electrically isolating region, and a light emitting region deposited on a substrate in a single stack. The electrically isolating region (e.g., one or more diodes or resistive semiconductor layers) allows photons to pass from the light emitting region to the photovoltaic region while blocking electrical current between those regions. In some embodiments, the optocoupler device includes a reflector on a side of the light emitting region (opposite the photovoltaic region) that reflects photons emitted by the light emitting region back toward the photovoltaic region. The optocoupler device may also include a reflector on a side of the photovoltaic region (opposite the light emitting region) that reflects photons emitted by the light emitting region back toward the photovoltaic region. In other embodiments, the optocoupler device includes two photovoltaic regions sandwiching the light emitting region.

An efficient monolithic optocoupler device that includes a photovoltaic region, an electrically isolating region, and a light emitting region deposited on a substrate in a single stack. The electrically isolating region (e.g., one or more diodes or resistive semiconductor layers) allows photons to pass from the light emitting region to the photovoltaic region while blocking electrical current between those regions. In some embodiments, the optocoupler device includes a reflector on a side of the light emitting region (opposite the photovoltaic region) that reflects photons emitted by the light emitting region back toward the photovoltaic region. The optocoupler device may also include a reflector on a side of the photovoltaic region (opposite the light emitting region) that reflects photons emitted by the light emitting region back toward the photovoltaic region. In other embodiments, the optocoupler device includes two photovoltaic regions sandwiching the light emitting region.

The present disclosure is directed to a sensor die with an embedded light sensor and an embedded light emitter as well as methods of manufacturing the same. The light emitter in the senor die is surrounded by a resin. The sensor die is incorporated into semiconductor device packages as well as methods of manufacturing the same. The semiconductor device packages include a first optically transmissive structure on the light sensor of the sensor die and a second optically transmissive structure on the light emitter of the sensor die. The first optically transmissive structure and the second optically transmissive structure cover and protect the light sensor and the light emitter, respectively. A molding compound is on a surface of a sensor die and covers sidewalls of the first and second optically transmissive structures on the sensor die.

Techniques are disclosed for fabricating and using a neuromorphic computing device including biological neurons. For example, a method for fabricating a neuromorphic computing device includes forming a channel in a first substrate and forming at least one sensor in a second substrate. At least a portion of the channel in the first substrate is seeded with a biological neuron growth material. The second substrate is attached to the first substrate such that the at least one sensor is proximate to the biological neuron growth material and growth of the seeded biological neuron growth material is stimulated to grow a neuron in the at least a portion of the channel.

Techniques are disclosed for fabricating and using a neuromorphic computing device including biological neurons. For example, a method for fabricating a neuromorphic computing device includes forming a channel in a first substrate and forming at least one sensor in a second substrate. At least a portion of the channel in the first substrate is seeded with a biological neuron growth material. The second substrate is attached to the first substrate such that the at least one sensor is proximate to the biological neuron growth material and growth of the seeded biological neuron growth material is stimulated to grow a neuron in the at least a portion of the channel.