Provided is a display apparatus including a plurality of subpixels and configured to emit light based on each of the plurality of subpixels, the display apparatus including a substrate, a driving layer provided on the substrate and including a driving element which is configured to apply current to the display apparatus, a first electrode electrically connected to the driving layer, a first semiconductor layer provided on the first electrode, an active layer provided on the first semiconductor layer, a second semiconductor layer provided on the active layer, a second electrode provided on the second semiconductor layer, and a reflective layer provided on the second semiconductor layer, wherein light emitted from the active layer resonates between the first electrode and the reflective layer.

The application is related to a UV LED package structure for improving light extraction efficiency. An UV LED chip is set on a substrate with an anti-flare film for increasing upward light extraction to concentrate the emitted light by an optical element. Because no glue is filled between the UV LED chip and the optical element, it will be prevented the glue from spoiling and deteriorating by the UV light from the UV LED chip. Thereby, the UV LED package structure can prevent from the light performance reducing.

A light-emitting device may include a semiconductor body having a first conductivity type, with a front side and a back side. The light-emitting device may also include a porous-silicon region which extends in the semiconductor body at the front side, and a cathode region in direct lateral contact with the porous-silicon region. The light-emitting device may further include a barrier region of electrically insulating material, which extends in direct contact with the cathode region at the bottom side of the cathode region so that, in use, an electric current flows in the semiconductor body through lateral portions of the cathode region.

A light-emitting material, a method for producing the light-emitting material and a display apparatus are provided. An average particle size of the light-emitting material is 0.1 m to 30 m, and an average distance between outermost quantum dots of a particle of the light-emitting material and a surface of the particle of the light-emitting material is 0.5 nm to 25 nm, or a minimum distance between the outermost quantum dots of a particle of the light-emitting material and the surface of the particle of the light-emitting material is 0.1 nm to 20 nm.

A light-emitting material, a method for producing the light-emitting material and a display apparatus are provided. An average particle size of the light-emitting material is 0.1 m to 30 m, and an average distance between outermost quantum dots of a particle of the light-emitting material and a surface of the particle of the light-emitting material is 0.5 nm to 25 nm, or a minimum distance between the outermost quantum dots of a particle of the light-emitting material and the surface of the particle of the light-emitting material is 0.1 nm to 20 nm.

A high output lamp is made with LED filaments (i.e., LED chips mounted on a long narrow substrate and encapsulated in silicone). High output is enabled by structurally minimizing thermal resistance between filaments and bulb. The bulb is generally tubular and contains a mount structure with longitudinally extended LED filaments electrically and mechanically connected between ring or disc shaped end connectors, and spaced apart around the structure's perimeter. An outer surface of the LED filaments defines a mount structure perimeter that is held adjacent to an inner surface of the bulb, separated by a total diameter difference gap of substantially zero to three millimeters maximum. End connectors may have a cut out portion enabling resiliently compressible diameter. The bulb may be filled with pure helium, or pure hydrogen, or a mixture of the two. A contaminant cleaner inside the bulb may be an oxygen dispenser.

A wavelength converting layer may have a glass or a silicon porous support structure. The wavelength converting layer may also have a cured portion of wavelength converting particles and a binder laminated onto the porous glass or silicon support structure.

A high output lamp is made with LED filaments (i.e., LED chips mounted on a long narrow substrate and encapsulated in silicone). High output is enabled by structurally minimizing thermal resistance between filaments and bulb. The bulb is generally tubular and contains a mount structure with longitudinally extended LED filaments electrically and mechanically connected between ring or disc shaped end connectors, and spaced apart around the structure's perimeter. An outer surface of the LED filaments defines a mount structure perimeter that is held adjacent to an inner surface of the bulb, separated by a total diameter difference gap of substantially zero to three millimeters maximum. End connectors may have a cut out portion enabling resiliently compressible diameter. The bulb may be filled with pure helium, or pure hydrogen, or a mixture of the two. A contaminant cleaner inside the bulb may be an oxygen dispenser.

A wavelength converting layer may have a glass or a silicon porous support structure. The wavelength converting layer may also have a cured portion of wavelength converting particles and a binder filling the porous glass or silicon support structure.

A luminous body includes a first moiety including a plurality of first ligands combined to a surface of an inorganic emitting particle; and a second moiety including silsesquioxanes connected to a second ligand connected to one of the first ligands, wherein one of the first and second ligands is a polar ligand, and the other one of the first and second ligands is a non-polar ligand.