A device of mass transferring chips includes a first substrate, which includes a first surface with a chip-connecting area configured to attach a chip, a second surface opposite to the first surface, and a patterned recess. The patterned recess is disposed on the first surface or the second surface. A projection of at least a portion of the patterned recess on the first surface is spaced apart from the chip-connecting area. The device further includes a second substrate with a third surface. The third surface has a chip-receiving area configured to attach the chip from the first substrate.

Presented herein is a tray for shipping, handling, and/or processing optomechanical components. The tray has a plurality of pockets arranged in an array, wherein each pocket is configured to hold one optomechanical component, and wherein each pocket includes at least one fiducial hole, at least one vacuum hole, a first cradle element configured to support a clip that attaches to one or more optical fibers of the optomechanical component, and a second cradle element configured to support a head of the optomechanical component. Also presented herein is a clip for an optomechanical component that includes a body having a top face and a bottom face, and a plurality of gripping elements arranged in pairs on the bottom face, each pair of gripping elements configured to support a barrel of an optical connector attached to a corresponding optical fiber of the pair of optical fibers.

A semiconductor package structure and a method for manufacturing a semiconductor package structure are provided. The semiconductor package structure includes a device package and a shielding layer. The device package includes an electronic device unit and has a first surface, a second surface opposite to the first surface, and a third surface connecting the first surface to the second surface. The shielding layer is disposed on the first surface and the second surface of the device package. A common edge of the second surface and the third surface includes a first portion exposed from the shielding layer by a first length, and a common edge of the first surface and the third surface includes a second portion exposed from the shielding layer by a second length that is different from the first length.

Provided is a wafer jig including a bottom wall and a ring-shaped side wall. The bottom wall has a supporting surface. The ring-shaped side wall is connected to a periphery of the bottom wall. The ring-shaped side wall includes at least two step portions. The two step portions include a first step portion and a second step portion. The first step portion is connected between the supporting surface and the second step portion, and the first step portion protrudes along a direction toward a center of the bottom wall. The ring-shaped side wall surrounds the center. In addition, a wafer structure and a wafer processing method are also provided.

A process for sputtering a plurality of integrated circuit (“IC”) units, the process having at least the steps of: applying a layer to a holding ring; cutting an array of apertures in the layer; transferring the holding ring to a template positioned within a placement station; aligning the array of apertures with an array of recesses in the template; delivering IC units to the holding ring, each IC unit corresponding to an aligned aperture and recess, and then; applying a sputtering process to the IC units engaged with the holding ring.

An apparatus including a carrier mount having a staircase of steps in an opening in the carrier mount and a plurality of dies, each one of the dies having at least a portion of an edge of a major surface thereof located on one of the steps corresponding to the one of the dies such that the dies form a stack, major surfaces of the dies being substantially parallel in the stack, each of the dies having one or more electro-optical devices thereon.

A carrier tape holding electrical components to a reel around which the carrier tape is wound is provided. Furthermore, the present disclosure is related to a pick-and-place apparatus for receiving this carrier tape and for picking and placing the electrical components arranged in the carrier tape. The carrier tape according to an aspect of the present disclosure includes an adhesive film that forms a bottom wall of the cavities in which a plurality of electrical components is arranged. The adhesive of the adhesive film is configured to substantially release the attachment of the electrical component as a result of heating the adhesive and/or as a result of irradiating the adhesive using light, such as visible light, infrared light, or ultraviolet light, for the purpose of allowing the electrical component to be removed from the cavity using a pick-and-place apparatus.

A transfer device for a micro light-emitting diode (micro LED) of the present application includes a collecting tube and a driving device. The collecting tube has a first end and a second end disposed oppositely, and the collecting tube includes a collecting opening and a storage tube, and the collecting opening is connected to the storage tube, and the collecting opening is disposed at the first end. The driving device is disposed at the second end, and the driving device is configured to provide a driving force, wherein the driving device is configured to provide the driving force to pick up the micro LED from the collecting opening into the storage tube so that the storage tube is able to store and stack at least two micro LEDs.

The present invention relates to a system and a method for confirming the mounted state of picker mounts. Barcodes are formed on corresponding picker mounts while including information for identifying each type of picker mount. A barcode reader is arranged on one side of a variable picker module so as to sequentially read each barcode of the picker mounts moving in the arrangement direction of pickers while mounted on the pickers. A system controller identifies each position and type of the corresponding picker mounts on the basis of information provided from the barcode reader, and then, compares same with confirmation criteria so as to confirm incorrect mounting and non-mounting of the picker mounts.

A method of preparation of a first surface of an electronic component, the first surface being intended to be bonded to another electronic component by a direct bonding and the first surface having previously been submitted to a surface treatment in an atmosphere including nitrogen, for example, a treatment in a nitrogen plasma or an ozone UV treatment, the preparation method including: placing into contact the first surface with an aqueous solution including at least 90% water, for a contacting duration longer than or equal to 30 minutes; and then drying the first surface.