Magnetic structures incorporated into integrated circuit assemblies. In some examples, the magnetic structures may enable local heating and reflow of solder interconnects for the attachment of integrated circuit devices to electronic substrates.

An apparatus and a method for chip-to-wafer integration is provided. The apparatus includes a coating module, a bonding module and a cleaning module. The method includes the steps of placing at least one chip on a wafer to form an integrated product, forming a film on the integrated product, such that the integrated product is substantially fluid-tight, and exerting a predetermined positive pressure on the film during permanent bonding of the at least one chip to the wafer. The method further includes the step of removing the film from the integrated product after permanent bonding of the at least one chip to the wafer.

A method of manufacturing a semiconductor package include providing a substrate on a support plate. A semiconductor chip is placed on the substrate by a pick-up tool. An alternating current voltage is supplied to an induction coil positioned adjacent to the semiconductor chip. The pick-up tool includes an insulating material.

A bonding apparatus includes a plurality of units each having a first holder configured to support a substrate and a second holder above the first holder that is configured to mount a semiconductor chip on the substrate. The plurality of units are arranged in adjacent spaced apart relationship along a first direction. An induction heating system includes an induction coil and an alternating current supplying unit configured to apply an alternating current to the induction coil so as to heat a junction between a substrate and a semiconductor chip at each of the plurality of units by inducing a magnetic field around the induction coil. A transferring unit is configured to position the induction coil adjacent to each of the plurality of units, and the induction heating system is configured to sequentially heat the junction between a substrate and semiconductor chip at each of the plurality of units.