A method of batch transferring micro components comprising steps of: A. arranging multiple probes in array on a carrying unit and extending multiple columns of the multiple probes out of a bottom of the carrying unit; B. providing a temperature control conduit in the carrying unit into which hot water is fed; C. driving the carrying unit so that the multiple columns of the multiple probes dip an adhesive material; D. feeding cold water into the temperature control conduit; E. moving the carrying unit on micro components and pressing the multiple probes of the carrying unit downward; F. moving the carrying unit onto a substrate and pressing the micro components to desired positions respectively; and G. heating adhesive material again as pressing the micro components and controlling the substrate at a low temperature so that the adhesive material freezes among the micro components and the substrate.

A bond head comprises an insulation block, a heater plate attached to the insulation block and a collet located on the heater plate for holding a semiconductor device. The heater plate is operative to heat the semiconductor device that is held by the collet. A flow generation plate that is detachably mounted between the insulation block and the heater plate is configured to direct cooling gas from the insulation block onto the heater plate so as to rapidly cool the heater plate.

A substrate (3) and two or more different chips (1a, 1b) having different heating properties (e.g. caused by different dimensions (surface area and/or thickness), heat capacity (C1, C2), absorptivity, conductivity, number and/or size of solder bonds) are provided. A solder material (2) is disposed between the chips (1a, 1b) and the substrate (3). A flash lamp (5) generates a light pulse (6) for heating the chips (1a, 1b), wherein the solder material (2) is at least partially melted by contact with the heated chips (1a, 1b). A masking device (7) is disposed between the flash lamp (5) and the chips (1a, 1b) causing different light intensities (1a, 1b) in different areas (6a, 6b) of the light pulse (6) passing the masking device (7), thereby heating the chips (1a, 1b) with different light intensities (1a, 1b). This may compensate the different heating properties to reduce a spread in temperature between the chips (1a, 1b) as a result of the heating by the light pulse (6). The chips (1a, 1b) may be releasably carried by a chip carrier disposed between the flash lamp (5) and the substrate (3) before being positioned on the substrate (3), wherein the light (6a, 6b) of the light pulse (6) transmitted by the masking device (7) is projected onto the chips (1a, 1b) held by the chip carrier for heating the chips (1a, 1b), releasing them from the chip carrier and transferring them to the substrate (3), wherein the heated chips (1a, 1b) cause melting of the solder material (2) between the chips (1a, 1b) and the substrate (3) for attaching the chips (1a, 1b) to the substrate (3).

A substrate bonding apparatus that brings a part of a surface of a first substrate and a part of a surface of a second substrate into contact in a state where a temperature difference is generated therebetween, to form contact regions at the parts, and then enlarges the contact regions to bond the first substrate and the second substrate, wherein enlargement of the contact regions starts before positional misalignment between the first substrate and the second substrate exceeds a threshold, and the threshold is set such that positional misalignment after the first substrate and the second substrate are bonded does not exceed a tolerated value.

A wafer-level pulling method includes securing a top holder to a plurality of chips. The method further includes securing a bottom holder to a wafer, wherein the plurality of chips are bonded to the wafer by a plurality of solder bumps. The method further includes softening the plurality of solder bumps. The method further includes stretching the plurality of softened solder bumps, wherein stretching the plurality of softened solder bumps comprises leveling the plurality of chips using a plurality of levelling devices separated from the plurality of chips, and a first levelling device of the plurality of levelling devices has a different structure from a second levelling device of the plurality of levelling devices.

A manufacturing apparatus of a semiconductor device includes a stage, a head unit configured to face the stage, a driving unit configured to move the head unit towards and away from the stage, a heating unit configured to heat the head unit, and a control unit configured to control the driving unit to move the head unit away from the stage when the heating unit heats the head unit.

The present invention relates to a sintering device or diffusion soldering device for connecting components of at least one electronic assembly by means of pressure sintering, comprising an evacuatable process chamber in which an upper tool and a lower tool are arranged, between which the assembly is held and which are displaceable relative to one another in their distance apart to exert a press force, wherein the process chamber comprises a base body having on its upper side an access opening and a cover which is adjustable between a closed position in which the access opening is closed by the cover and an open position, wherein the upper tool is supported on the cover in the closed position of the cover at least during the exertion of the press force.

A bond head assembly for bonding a semiconductor element to a substrate is provided. The bond head assembly includes a base structure, a heater, and a clamping system securing the heater to the base structure. The clamping system includes a plurality of elastic elements constraining the heater along a plurality of axes.

A method and apparatus for soldering a chip (1a) to a substrate (3). A chip carrier (8) is provided between a flash lamp (5) and the substrate (3). The chip (1a) is attached to the chip carrier (8) on a side of the chip carrier (8) facing the substrate (3). A solder material (2) is disposed between the chip (1a) and the substrate (3). The flash lamp (5) generates a light pulse (6) for heating the chip (1a). The heating of the chip (1a) causes the chip (1a) to be released from the chip carrier (8) towards the substrate (3). The solder material (2) is at least partially melted by contact with the heated chip (1a) for attaching the chip (1a) to the substrate (3).

A wafer-level pulling method includes securing a top holder to a plurality of chips. The method further includes securing a bottom holder to a wafer, wherein the plurality of chips are bonded to the wafer by a plurality of solder bumps. The method further includes softening the plurality of solder bumps. The method further includes stretching the plurality of softened solder bumps, wherein stretching the plurality of softened solder bumps comprises leveling the plurality of chips using a plurality of levelling devices separated from the plurality of chips, and a first levelling device of the plurality of levelling devices has a different structure from a second levelling device of the plurality of levelling devices.