Provided is a flip chip bonder including: a pickup flipping collet configured to flip a chip; and a bonding tool configured to receive the chip flipped with the pickup flipping collet from the pickup flipping collet and to bond the received chip to a circuit board. The pickup flipping collet includes a cooling channel through which cooling air flows to cool the pickup flipping collet. Thus, bonding time can be reduced without lowering bonding quality.

Proposed is a method for controlling a boat carrier/substrate strip type solder ball placement system that allows solder ball mounting processes for a boat carrier type of a material and a substrate strip type of a material to be all performed in one system. In specific, the method allows the components or operation setting of the system to be automatically controlled according to the types of materials loaded on a magazine, thereby performing solder ball mounting processes for the two types of materials with high speed and high accuracy. In more specific, the method allows a component applied only to the solder ball mounting process for the boat carrier type of material and a component applied to the solder ball mounting process for the substrate strip type of material to be integrated with each other as a single component in the process of mounting the solder balls on the material on-loaded, thereby making it possible to perform the solder ball mounting processes for the two different types of materials in one system.

A method of manufacturing a semiconductor package includes estimating an error in a solder ball attaching process, determining a specification of a ball tool and a method of the solder ball attaching process, based on the estimated error, manufacturing the ball tool according to the determined specification thereof, and performing the solder ball attaching process based on the method of the solder ball attaching process. The determining of the specification of the ball tool and the method of the solder ball attaching process includes determining a number of a plurality of holders in the ball tool and a position and a width of each of the plurality of holders, determining a number of a plurality of working regions of a substrate and a position and a width of each of the plurality of working regions, and dividing a substrate into the plurality of working regions.