Provided is a bonding apparatus including a table (52), a first reaction member (58A) and a second reaction member (58B), which are each provided movably in a Y axis direction with respect to a pedestal (41). The first and second reaction members are each configured to move in a direction opposite to the table in the Y axis direction when the table moves in the Y axis direction. As viewed in an X axis direction, the first and second reaction members are arranged on both sides of the table, respectively, with the table being interposed between the first and second reaction members, so that the centers of gravity of the first and second reaction members are positioned based on the center of gravity of the table. Consequently, the bonding apparatus can suppress an increase in space, and can improve a weight balance on the pedestal.

The method of manufacturing a functional inlay comprises the steps of: a support layer with at least a first and a second side a wire antenna in said support layer processing said support layer with said embedded wire antenna to a connection station in which said support layer is approached on said first side by a holding device holding a chip with a surface comprising connection pads; said support layer is approached on said second side by a connection device; and said antenna wire is connected to said connection pads by means of a reciprocal pressure exerted between said holding device and said connection device.

The method of manufacturing a functional inlay comprises the steps of: a support layer with at least a first and a second side a wire antenna in said support layer processing said support layer with said embedded wire antenna to a connection station in which said support layer is approached on said first side by a holding device holding a chip with a surface comprising connection pads; said support layer is approached on said second side by a connection device; and said antenna wire is connected to said connection pads by means of a reciprocal pressure exerted between said holding device and said connection device.

Disclosed are a chip bonding apparatus for semiconductor packaging and a semiconductor packaging method using the same. The chip bonding apparatus may include a bonding head, wherein the bonding head may include a plurality of chip holding units, each of which is configured to individually hold a chip, and the bonding head may be configured to adjust the interval between the plurality of chip holding units. The chip bonding apparatus may be configured to bond a plurality of chips to a given target surface at controlled intervals using the plurality of chip holding units according to a multi-chip bonding method. The semiconductor packaging method may include bonding chips to a target surface of a carrier substrate at controlled intervals using the plurality of chip holding units according to the multi-chip bonding method.

A bonding apparatus comprises a chip holding part that disposes a chip part onto a substrate that has been placed on a substrate stage. The bonding apparatus adjusts the inclination of a chip holding surface that releasably holds the chip part. The bonding apparatus comprises: an adjustment controller which stores inclination information pertaining to inclination respectively for locations on a stage main surface having the substrate placed thereon; and a conforming jig which has a conforming surface onto which the chip holding surface is pressed, and in which the inclination of the conforming surface can be changed such that the inclination of the chip holding surface corresponds to the inclination indicated by the inclination information.

An electronic device is provided, including a substrate and a plurality of electronic units disposed on the substrate. The substrate includes a first edge extending along a first direction and a second edge extending along a second direction. The electronic units include first, second, and third electronic units arranged adjacently along the first direction. The first electronic unit is closer to the second edge than the third electronic unit. A pitch between the second and third electronic units is greater than a pitch between the first and second electronic units. The electronic units include fourth, fifth and sixth electronic units arranged adjacently along the second direction. The fourth electronic unit is closer to the first edge than the sixth electronic unit. A pitch between the fourth and fifth electronic units is greater than a pitch between the fifth and sixth electronic units.

A die bonding apparatus includes a head guide extending in a horizontal direction between a first position and a second position, the head guide including an orbital transfer route including a supply path from the first position to the second position and a return path from the second position to the first position, and a die transfer device configured to move along the orbital transfer route of the head guide, the die transfer device including at least one pick-up head configured to pick up a die at the first position and to attach the die on a target object at the second position.