Provided is a laser reflow apparatus for reflowing electronic components on a substrate disposed on a stage, the apparatus including: a laser emission unit comprised of a plurality of laser modules for emitting a laser beam having a flat top output profile in at least one section of the substrate on which the electronic components are disposed; a camera unit comprising at least one camera module for capturing a reflowing process of the electronic components performed by the laser beam; and a laser output control unit configured to generate a control signal for independently controlling the respective laser modules of the laser emission unit based on a signal output from the camera unit and apply the control signal to the laser emission unit.

A semiconductor device assembly that includes a substrate having a first side and a second side, the first side having at least one dummy pad and at least one electrical pad. The semiconductor device assembly includes a first semiconductor device having a first side and a second side and at least one electrical pillar extending from the second side. The electrical pillar is connected to the electrical pad via solder to form an electrical interconnect. The semiconductor device assembly includes at least one dummy pillar extending from the second side of the first semiconductor device and a liquid positioned between an end of the dummy pillar and the dummy pad. The surface tension of the liquid pulls the dummy pillar towards the dummy pad. The surface tension may reduce or minimize a warpage of the semiconductor device assembly and/or align the dummy pillar and the dummy pad.

According to one embodiment, there is provided a substrate bonding apparatus including a first chuck stage and a second chuck stage. The first chuck stage includes a first electromagnetic force generation unit. The first chuck stage is chuckable for a first substrate. The second chuck stage includes a second electromagnetic force generation unit. The second electromagnetic force generation unit faces the first electromagnetic force generation unit. The second chuck stage is chuckable for a second substrate.

A parameter adjustment method includes an acquisition process and a parameter changing process. The acquisition process acquires, from an inspection apparatus configured to inspect a combined substrate in which the first substrate and the second substrate are bonded by the bonding apparatus, an inspection result indicating a direction and a degree of distortion occurring in the combined substrate. The parameter changing process changes at least one of multiple parameters including at least one of the gap, an attraction pressure of the first substrate by the first holder, an attraction pressure of the second substrate by the second holder or a pressing force on the first substrate by the striker, based on trend information indicating a tendency of a change in the direction and the degree of the distortion when each of the multiple parameters is changed and the inspection result acquired in the acquiring of the inspection result.

An apparatus and method for bonding alignment are provided. The apparatus for bonding alignment includes a press assembly and an objective lens group (105) disposed on one side of the press assembly. The press assembly includes a first chuck (103) and a rotatable second chuck (104). When support surfaces of the first and second chucks are not parallel to each other, the second chuck is rotated to make the two support surfaces parallel. A first substrate (301) is then loaded on the first chuck, and alignment marks (302) on the first substrate are observed using the objective lens group disposed on one side of the press assembly. A second substrate (501) is loaded on the second chuck, and alignment marks (502) on the second substrate are also observed with the objective lens group. Based on an observation result by the objective lens group, the two substrates are moved so that the alignment marks thereon are aligned and hence the two substrates themselves are aligned. In this method, the chucks are adjusted, prior to the alignment of the substrates. This dispenses with the need for employment of high-precision components and reduces the complexity of the apparatus. Moreover, adjusting the chucks first can ensure control of a global alignment accuracy between the substrates, and in particular, can reduce wedge-shaped errors between the substrates that may result from deformations of the substrates during bonding.

A mounting apparatus (10) serves to place a film between an electronic component and a bottom surface of a mounting head and mount the electronic component. The mounting apparatus includes: a film winding mechanism (18) that rotates a winding reel (26) to wind in a film spanning from a dispensing reel to the winding reel (26), the film winding mechanism (18) executing the winding so that a new film is disposed on the bottom surface of the mounting head each time when an electronic component is mounted; a tension detecting part (38) that detects the tension of the film after the same is wound by the film winding mechanism (18); and a control part (20) that rotates the winding reel (26) by a winding motor (30) to adjust the tension on the basis of the tension detected by the tension detecting part (38). A film supply apparatus is also provided.

A bonding apparatus includes a holding element, holding element actuators, sensors, a controller and bond force adjusting actuators. In use, the holding element holds an electrical component and is moved by the holding element actuators in one or more actuating directions to contact the electrical component with a base member. The sensors measure reaction forces exerted on the holding element in response to contact between the electrical component and the base member. The controller determines bond forces to be exerted on actuating areas of the holding element during a bonding process based on the measured reaction forces, and the bond force adjusting actuators exert these bond forces on the actuating areas of the holding element during the bonding process, so as to adjust a tilt of the electrical component relative to the base member.

Provided are a semiconductor element bonding apparatus and a semiconductor element bonding method that do not cause a bonding material to protrude and also ensure adhesion, even when there are variations in a thickness of a semiconductor element or a workpiece and even when there are projections and depressions on surfaces. A semiconductor element bonding apparatus includes disposing means for disposing a workpiece and a semiconductor element at positions facing each other, moving means for moving the workpiece or the semiconductor element in a vertical direction, displacement measuring means for measuring displacement of the workpiece or the semiconductor element in the vertical direction, load measuring means for measuring a contact load between the workpiece and the semiconductor element with the bonding material interposed therebetween, and elastic modulus calculating means for calculating an elastic modulus from results of the measurement by the displacement measuring means and the load measuring means.

A bonding apparatus includes a holding element, holding element actuators, sensors, a controller and bond force adjusting actuators. In use, the holding element holds an electrical component and is moved by the holding element actuators in one or more actuating directions to contact the electrical component with a base member. The sensors measure reaction forces exerted on the holding element in response to contact between the electrical component and the base member. The controller determines bond forces to be exerted on actuating areas of the holding element during a bonding process based on the measured reaction forces, and the bond force adjusting actuators exert these bond forces on the actuating areas of the holding element during the bonding process, so as to adjust a tilt of the electrical component relative to the base member.

A mounting apparatus (10) serves to place a film between an electronic component and a bottom surface of a mounting head and mount the electronic component. The mounting apparatus includes: a film winding mechanism (18) that rotates a winding reel (26) to wind in a film spanning from a dispensing reel to the winding reel (26), the film winding mechanism (18) executing the winding so that a new film is disposed on the bottom surface of the mounting head each time when an electronic component is mounted; a tension detecting part (38) that detects the tension of the film after the same is wound by the film winding mechanism (18); and a control part (20) that rotates the winding reel (26) by a winding motor (30) to adjust the tension on the basis of the tension detected by the tension detecting part (38). A film supply apparatus is also provided.