Disclosed is a wire bonding apparatus comprising a capillary, a wire clamp assembly, and a support. The wire clamp assembly includes a first member, a second member, a first contact member, and a second contact member. The first member includes a first body and a first tilting member. The second member includes a second body and a second tilting member. The first contact member is coupled to an inner surface of the first tilting member and extends in an extending direction of the first tilting member. The second contact member is coupled to an inner surface of the second tilting member and extends in an extending direction of the second tilting member. The second member is movable in the second direction.

A method for automatically threading wire in a wire bonding apparatus includes the steps of extending a wire tail of a wire from a wire spool, locating the wire tail in a wire locating device and positioning the wire tail at a straightening location of the wire locating device. The wire tail is straightened at the straightening location with a wire manipulating device and then conveyed to a threading location. With a wire threading device, the straightened wire tail is received at the threading location and is threaded through a capillary of the wire bonding apparatus.

A bonding tool includes a wedge tool that presses a bonding wire against a principal plane of a structure such as an electrode to which the bonding wire is to be bonded. A groove formed in an end portion of a wedge tool body of the wedge tool is inclined along a longitudinal direction of the bonding wire so that a heel side of the groove is closer to the principal plane of the structure than a toe side of the groove. As a result, the wedge tool is inclined at a tilt angle and the bonding wire fits the groove in the end portion of the wedge tool body along the longitudinal direction of the bonding wire. Thus, a corner portion of the wedge tool does not contact the electrode.

A method for automatically threading wire in a wire bonding apparatus includes the steps of extending a wire tail of a wire from a wire spool, locating the wire tail in a wire locating device and positioning the wire tail at a straightening location of the wire locating device. The wire tail is straightened at the straightening location with a wire manipulating device and then conveyed to a threading location. With a wire threading device, the straightened wire tail is received at the threading location and is threaded through a capillary of the wire bonding apparatus.

The present invention comprises: a spool (10); a clamper (22); a torch electrode (31); a high-voltage power source circuit (30); a non-bonding detection circuit (40); a first changeover switch (50) switching a connection between the spool (10) and the high-voltage power source circuit (30) or the non-bonding detection circuit (40); and a relay (53) turning on/off a connection between the clamper (22) and a spool side of the first changeover switch (50), and comprises a control part (60) that sets the first changeover switch (50) to the high-voltage power source circuit side and turns off the relay (53) to generate electric discharge, and that sets the first changeover switch (50) to the non-bonding detection circuit side and turns on the relay (53) to perform non-bonding detection. Due to this configuration, electric corrosion of a wire clamper can be suppressed and non-bonding detection can be carried out with a simple configuration.

Provided is a wire bonding apparatus for electrically connecting an electrode and an aluminum alloy wire to each other by wire bonding. The apparatus includes a wire feeding device which feeds the wire. The wire has a diameter not less than 500 m and not greater than 600 m. The apparatus includes a heating device heats the wire to a temperature that is not lower than 50 C. and not higher than 100 C. The apparatus further includes a pressure device which presses the wire against the electrode. The apparatus further includes an ultrasonic wave generating device which generates an ultrasonic vibration that is applied to the wire that is pressed by the pressure device.

Bonding device for producing bonding connections, in particular wire bonding connections, tape bonding connections and ball bonding connections, on carriers fixed outside the bonding device and having contact surfaces for the bonding connections, in different spatial directions with respect to the respective carrier, the bonding device comprising a base body, a bonding tool which is movable relative to the base body for applying a bonding force to a bonding means placed on the contact surface of the carrier to produce a material bond between the bonding means and the contact surface as a bonding connection, and bonding force generating means for generating a bonding force directed towards the contact surface when the bonding tool is placed on the carrier, wherein the bonding force generating means comprise a bonding force setting device for realizing a predetermined effective bonding force independently of its spatial direction of action.

The present invention comprises: a spool (10); a damper (22); a torch electrode (31); a high-voltage power source circuit (30); a non-bonding detection circuit (40); a first changeover switch (50) switching a connection between the spool (10) and the high-voltage power source circuit (30) or the non-bonding detection circuit (40); and a relay (53) turning on/off a connection between the damper (22) and a spool side of the first changeover switch (50), and comprises a control part (60) that sets the first changeover switch (50) to the high-voltage power source circuit side and turns off the relay (53) to generate electric discharge, and that sets the first changeover switch (50) to the non-bonding detection circuit side and turns on the relay (53) to perform non-bonding detection. Due to this configuration, electric corrosion of a wire damper can be suppressed and non-bonding detection can be carried out with a simple configuration.

A method for replacing a capillary of a wire bonding apparatus that includes a holding unit that holds a capillary includes transferring a capillary replacing unit to the wire bonding apparatus by a mobile robot in response to receiving a capillary replacement start signal from the wire bonding apparatus, separating, by the capillary replacing unit, the capillary corresponding to the replacement signal from the wire bonding apparatus, and installing, by the capillary replacing unit, a new capillary in the wire bonding apparatus.

A method and a device for establishing a wire connection between a first contact surface and at least one further contact surface. A contact end of a wire is positioned in a contact position relative to the first contact surface with a wire guiding tool. Subsequently, a mechanical, electrically conductive connection is established between the first contact surface and the contact end with a first solder material connection, and subsequently the wire guiding tool is moved to the further contact surface thus forming a wire section and establishing a further mechanical, electrically conductive connection between the wire section end and the further contact surface with a further solder material connection.