Patent classifications
H
ELECTRICITY
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H01
ELECTRIC ELEMENTS
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H01L
SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/74
Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
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H01L2224/78
Apparatus for connecting with wire connectors
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H01L2224/78821
Upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
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H01L2224/78821

WIRE BONDING SYSTEMS, WIRE BONDING TOOL REPLACEMENT SYSTEMS, AND RELATED METHODS
20250162093 · 2025-05-22 · ·

A wire bonding system is provided. The wire bonding system includes (i) a bond head assembly configured to carry a wire bonding tool; and (il) a wire bonding tool replacement system for replacement of the wire bonding tool with another wire bonding tool.