Provided is a method for bonding an insulated coating wire, which is capable of stably bonding a metal wire in an insulated coating wire and an electrode. One aspect of the present invention provides a method for bonding an insulated coating wire for electrically connecting a first electrode 12 and a second electrode to each other by an insulated coating wire 11 in which a metal wire is coated with an organic substance, the method including: a step (a) for placing the insulated coating wire 11 onto the first electrode 12; a step (b) for exposing a metal wire from the insulated coating wire; and a step (c) for forming a first bump over the exposed metal wire and the first electrode to electrically connect the metal wire to the first electrode.

According to one embodiment, a semiconductor device includes a first electrode, a second electrode, and a wire extending between the first electrode and the second electrode. The wire includes a first conductor in contact with the first electrode and the second electrode, and a second conductor that is provided inside the first conductor and has no contact with the first electrode and the second electrode.

A method includes, receiving a layout design of at least part of an electronic module, the design specifying at least (i) an electronic device coupled to at least a substrate, and (ii) an electrical trace that is connected to the electronic device and has a designed route. A digital input, which represents at least part of an actual electronic module that was manufactured in accordance with the layout design but without at least a portion of the electrical trace, is received. An error in coupling the electronic device to the substrate, relative to the layout design, is estimated based on the digital input. An actual route that corrects the estimated error, is calculated for at least the portion of the electrical trace. At least the portion of the electrical trace is formed on the substrate of the actual electronic module, along the actual route instead of the designed route.

A force sensor for determining a bonding force during wire bonding operations includes: a piezoelectric sensing element mounted in an ultrasonic transducer of an ultrasonic wire bonding device, the piezoelectric sensing element including a first portion and a second portion, and first and second opposing surfaces, wherein the first surface of the first portion has a positive electrode and the second surface of the first portion has a negative electrode respectively, and the first surface of the second portion has a negative electrode and the second surface of the second portion has a positive electrode respectively.

A force sensor for determining a bonding force during wire bonding operations includes: a piezoelectric sensing element mounted in an ultrasonic transducer of an ultrasonic wire bonding device, the piezoelectric sensing element including a first portion and a second portion, and first and second opposing surfaces, wherein the first surface of the first portion has a positive electrode and the second surface of the first portion has a negative electrode respectively, and the first surface of the second portion has a negative electrode and the second surface of the second portion has a positive electrode respectively.

The present invention includes: an ultrasonic horn (14) to which two ultrasonic vibrations can be input to excite a capillary (15) mounted to a front end with different frequencies in a Y-direction and an X-direction; and a control unit (50) which adjusts the respective magnitude of the two ultrasonic vibrations. The Y-direction is a direction in which the ultrasonic horn (14) extends. The control unit (50) adjusts the respective magnitude of the two ultrasonic vibrations to adjust a ratio (ΔY/ΔX) of amplitude of the capillary (15) in the Y-direction and the X-direction. Thus, degradation in the quality of the joining between wires and leads is suppressed.

A wire bonding apparatus includes: a first tensioner which forms, nearer a wire supply side than a bonding tool, a first gas flow for applying a tension toward the wire supply side on a wire; a second tensioner which forms, between the first tensioner and a pressing part of the bonding tool, a second gas flow for applying a tension toward the wire supply side on the wire; and a control part which controls the first tensioner and the second tensioner. The control part implements control, in a predetermined period after a first bonding step for bonding the wire to a first bonding point, to turn off at least the second gas flow of the second tensioner among the first tensioner and the second tensioner or to make at least the second gas flow smaller than in the first bonding step.

The present disclosure relates to a full-automatic deep access ball bonding head device includes: a Z-axis base; a Z-axis sliding stage, which is connected to the Z-axis base in a sliding manner along Z-axis; an EFO mechanism; and a bonding mechanism, which is fixed on the Z-axis sliding stage. The EFO mechanism includes an EFO sliding block, an EFO wand, and a compressed spring. The EFO sliding block is located on the side of the Z-axis sliding stage and connected to the Z-axis base in a sliding manner. The compressed spring is connected between the upper end of the Z-axis sliding stage and the upper end of the EFO sliding block, and the EFO wand is connected to the lower end of the EFO sliding block.

A method of determining a shear strength of a bonded free air ball on a wire bonding machine is provided. The method includes the steps of: (a) providing a free air ball at a working end of a wire bonding tool; (b) bonding the free air ball to a bonding location of a workpiece; (c) moving the wire bonding tool, while in contact with the bonded free air ball, in a direction along the bonding location; (d) monitoring wire bonding process signals during step (c); and (e) determining a shear strength using the wire bonding process signals monitored in step (d).

The present invention is provided with: a base moving linearly relative to a substrate and having a first and second positions that are spaced apart from each other by a predetermined interval a in the movement direction; a linear scale where a plurality of graduations having a predetermined pitch are provided along the movement direction; encoder heads which respectively are disposed at the first and second positions of the base and detect first and second graduation numbers of the linear scale with respect to the first and second positions, wherein, as the base is moved along the linear scale, the first and second graduation numbers are detected in this order in the respective encoder heads, and the movement amount of the base is controlled on the basis of the ratio between the predetermined interval and the distance between the first graduation number and the second graduation number on the scale.