A cooperative bonding method for a bonding head of a wire bonding machine, including setting an initial height value of the vertical lifting mechanism to be a difference value; upon receiving a bonding instruction, controlling the bonding head to perform an positioning operation on the target processing chip, controlling the vertical lifting mechanism to descend a preset distance; during the positioning operation of the bonding head on the target processing chip, when the acceleration motion and the overshoot is completed, controlling the vertical lifting mechanism to rise back; and during the rise back process, the pad of the chip does not exceed a residual vibration curve of the bonding head. This achieves the technical effect of improving the bonding efficiency of the bonding head within a small searching area while avoiding impacts on the chip caused by the overshoot during high acceleration positioning of the bonding head.

A method of providing a z-axis force profile applied to a plurality of bonding locations during a wire bonding operation is provided. The method includes: (a) determining a z-axis force profile for each of a plurality of bonding locations on an unsupported portion of at least one reference semiconductor device; and (b) applying the z-axis force profile during subsequent bonding of a subject semiconductor device. Methods of: determining a maximum bond force applied to a bonding location during formation of a wire bond; and determining a z-axis constant velocity profile for formation of a wire bond, are also provided.

A wire bonding apparatus comprises an ultrasonic transducer including a capillary, a flexible connecting frame having a first side to which the ultrasonic transducer is connected and at least one electrically-driven actuator which is connected to a second side of the flexible connecting frame that is opposite to the first side thereof, the actuator having a longitudinal actuation direction. An elongated slit located in the flexible connecting frame extends substantially transversely to the actuation direction of the at least one actuator to form at least one pivot point adjacent to an end of the slit about which the flexible connecting frame is rotatable when it is driven by the at least one actuator.

A wire bonding apparatus is provided with: a bonding stage on which a semiconductor chip is mounted; a wire bonding unit including a capillary bonding a bonding wire to the semiconductor chip, a Z-axis drive section reciprocating the capillary, and a tool XY-stage causing the capillary and the Z-axis drive section to be moved along a two-dimensional plane intersecting a direction of reciprocation; and a base having an optical system and an optical system XY-stage causing the optical system to be moved along a two-dimensional plane intersecting a direction of reciprocation, the base having the wire bonding unit attached thereto. The wire bonding unit is attached to a first portion of the base, and the optical system XY-stage is attached to a second portion of the base which is separate from the first portion.

A method of determining a bonding status between a wire and at least one bonding location of a workpiece is provided. The method includes the steps of: (a) bonding a portion of a wire to a bonding location of a workpiece using a bonding tool of a wire bonding machine; (b) determining a motion profile of the bonding tool for determining if the portion of the wire is bonded to the bonding location, the motion profile being configured to result in the wire being broken during the motion profile if the portion of the wire is not bonded to the bonding location; and (c) moving the bonding tool along the motion profile to determine if the portion of the wire is bonded to the bonding location. Other methods of determining a bonding status between a wire and at least one bonding location of a workpiece are also provided.

Quality control testing for a batch of electronic modules. A series of tests are performed on manufactured electronic modules, including tests sensitive to the failure rate of previously tested modules. Specifically, a first test comprised of two phases is performed on the module batch. Further screening is then performed responsive to detection of a wire sweep failure in a subset of failed modules from the first test phase. The further screening is on modules that passed the first test phase and excludes modules that failed the first test phase.

[Problem] To provide a bonding device capable of adequately controlling a leading end of a capillary when a ball formed at a leading end of a wire is pressed and bonded to an electrode of a semiconductor chip with scrub vibration.

[Solution] The bonding device is provided with a vibration driving portion (7), the vibration driving portion (7) including a plurality of piezoelectric elements (10) that are expanded and contracted along an axial direction of a bonding arm (3) respectively with one end thereof fixed to a leading end of the bonding arm (3), a plurality of capillary holding portions (15) that are in contact respectively with a circumferential face of a capillary (20) at a base end side thereof as being fixed correspondingly to the other end of the piezoelectric elements (10), and a pressing-holding portion (21) that sandwiches the capillary (20) as pressing the capillary (20) to the capillary holding portions (15) with at least one end side fixed to the bonding arm (3) and the other end side being in contact with the circumferential face of the capillary (20) at the base end side thereof on a side opposite to the capillary holding portions (15). Here, functional operation of amplitude, phase, frequency, or waveform is performed on drive voltage waveform to the respective piezoelectric elements.

A method of operating a wire bonding system is provided. The method includes the steps of: (a) forming a wire bond between (i) a portion of wire and (ii) a bonding location of a workpiece using a wire bonding tool; and (b) detecting if the portion of wire separates from a wire supply during step (a).

According to one embodiment, a wire bonding apparatus includes a bonding tool configured to feed a wire, a driver configured to drive the bonding tool, and a controller. The controller performs a bonding process of causing a ball formed at a tip of the wire to contact a first bonding point, deforming the ball into a bump, and bonding the bump to the first bonding point. The controller further performs a lowering process of raising the bonding tool while the bonding tool holds the wire connected with the bump, changing a position of the bonding tool in a horizontal direction, and subsequently lowering the bonding tool toward the first bonding point. The controller determines a goodness of the bonding of the bump to the first bonding point based on a detected value detected in the lowering process, the detected value being prescribed.

A method of imaging a wire structure on a wire bonding system is provided. The method includes the steps of: (a) forming the wire structure at a bonding location of a workpiece on the wire bonding system, the wire structure including a bonded portion bonded to the bonding location, and a free end continuous with the bonded portion; and (b) imaging a portion of the wire structure on the wire bonding system using a plurality of distinct focal planes.