A mass transfer method for Micro-LEDs with a temperature-controlled adhesive layer, including: configuring a self-assembling structure based on Micro-LED dies and a transfer substrate having a self-receiving structure coated on its surface with a temperature-controlled adhesive layer; distributing the Micro-LED dies in water, soaking the transfer substrate in water and heating water to perform self-assembling; carrying out transferring and removing the transfer substrate to separate Micro-LED dies from a transfer substrate then onto a target substrate.

Provided is a bonding method for directly bonding an electrode part of a chip component to a bonding part provided on a substrate that is a bonding target, the method comprising: a step for placing the substrate on a stage inside a liquid vessel; a step for injecting liquid into the liquid vessel; and a step for bonding the electrode part of the chip component to the bonding part (electrode part) of the bonding target by superimposing the chip component held by a bonding head in the liquid stored in the liquid vessel over the bonding target and then applying pressure thereto.

A method for transferring a micro device is provided. The method includes: preparing a carrier substrate with the micro device thereon, wherein an adhesive layer is between and in contact with the carrier substrate and the micro device; picking up the micro-device from the carrier substrate by a transfer head; forming a liquid layer on a receiving substrate; and placing the micro device over the receiving substrate by the transfer head such that the micro device is in contact with the liquid layer and is gripped by a capillary force; and moving the transfer head away from the receiving substrate such that the micro device is detached from the transfer head and is stuck to the receiving substrate.

A method for transferring a micro device includes: preparing a carrier substrate with the micro device thereon in which an adhesive layer is present between and in contact with the carrier substrate and the micro device; picking up the micro-device from the carrier substrate by a transfer head comprising a force-adjustable glue layer thereon; forming a liquid layer on a receiving substrate; reducing the grip force of the force-adjustable glue layer of the transfer head to be smaller than a force attaching the micro device to the receiving substrate; placing the micro device over the receiving substrate such that the micro device is in contact with the liquid layer and is gripped by a capillary force; and moving the transfer head away from the receiving substrate such that the micro device is detached from the transfer head and is stuck to the receiving substrate.

A method for transferring at least one thin film from a first substrate to a second substrate is provided, the thin film having a first side and an opposing second side and the second side of the thin film being arranged on a first side of the first substrate, at least part of the first substrate being subsequently removed and the second substrate being brought into contact, via its first side, with the second side of the thin film, wherein a liquid is supplied to the contact surface and then at least some of the liquid is removed by rotating the thin film and the second substrate.

A guide apparatus configured to transfer light-emitting devices in a liquid onto a substrate is provided. The guide apparatus includes a base configured to support the substrate; and a guide member configured to couple with the base to be seated on a mounting surface of the substrate in a state in which the substrate is supported on a surface of the base, wherein the guide member includes guide holes configured to respectively guide the light-emitting devices in the liquid to be disposed on the mounting surface of the substrate.

A method for transferring at least one thin film from a first substrate to a second substrate is provided, the thin film having a first side and an opposing second side and the second side of the thin film being arranged on a first side of the first substrate, at least part of the first substrate being subsequently removed and the second substrate being brought into contact, via its first side, with the second side of the thin film, wherein a liquid is supplied to the contact surface and then at least some of the liquid is removed by rotating the thin film and the second substrate.

A system that includes a self-assembly module and a bonding module. The self-assembly module has a liquid dispensing unit, with an applicator and a reservoir for a liquid, that dispenses the liquid onto a wafer, a wafer support, an environmental control unit, a die and wafer transport mechanism, and a processor. A method for performing the hybrid bonding includes providing a wafer, patterning the wafer to form a hydrophobic surface with a plurality of hydrophilic regions, disposing the wafer on the wafer support in the self-assembly module of the hybrid bonding system, dispensing the liquid simultaneously or in batches on the plurality of hydrophilic regions on the wafer, positioning dies on the plurality of hydrophilic regions on the wafer, controlling the humidity and bonding the dies to the wafer using a hybrid bonding process.

A process for bonding chips to a substrate by direct bonding includes providing a support with which the chips are in contact, the chips in contact with the support being separate from one another. This bonding process also includes forming a liquid film on one face of the substrate, bringing the chips into contact with the liquid film, where the action of bringing the chips into contact with the liquid film causes attraction of the chips toward the substrate, and evaporating the liquid film in order to bond the chips to the substrate by direct bonding.