A substrate positioning apparatus includes a holder and a rotating device. The holder is configured to hold a substrate. The rotating device is configured to rotate the holder. The rotating device includes a rotation shaft, a bearing member, a base member, a driving unit and a damping device. The rotation shaft is fixed to the holder. The bearing member is configured to support the rotation shaft in a non-contact state. The bearing member is fixed on the base member. The driving unit is configured to rotate the rotation shaft. The damping device includes a rail connected to the base member and a slider connected to the rotation shaft, and is configured to produce a damping force against a relative operation between the rotation shaft and the base member by a resistance generated between the rail and the slider.

A substrate positioning apparatus includes a holder and a rotating device. The holder is configured to hold a substrate. The rotating device is configured to rotate the holder. The rotating device includes a rotation shaft, a bearing member, a base member, a driving unit and a damping device. The rotation shaft is fixed to the holder. The bearing member is configured to support the rotation shaft in a non-contact state. The bearing member is fixed on the base member. The driving unit is configured to rotate the rotation shaft. The damping device includes a rail connected to the base member and a slider connected to the rotation shaft, and is configured to produce a damping force against a relative operation between the rotation shaft and the base member by a resistance generated between the rail and the slider.

Semiconductor packages are disclosed. A semiconductor package includes an integrated circuit, a first die and a second die. The first die includes a first bonding structure and a first seal ring. The first bonding structure is bonded to the integrated circuit and disposed at a first side of the first die. The second die includes a second bonding structure. The second bonding structure is bonded to the integrated circuit and disposed at a first side of the second die. The first side of the first die faces the first side of the second die. A first portion of the first seal ring is disposed between the first side and the first bonding structure, and a width of the first portion is smaller than a width of a second portion of the first seal ring.

Some embodiments include a method in which a first semiconductor wafer and a second semiconductor wafer are bonded with each other. The first semiconductor wafer includes a memory cell array, and the second semiconductor wafer includes a circuit to access the memory cell array. After the bonding, contacts are formed to be associated with the first semiconductor wafer. The contacts are for electrical connections between the first and second semiconductor wafers. The contacts are linked with reference positions, with each of the contacts being linked with an associated one of the reference positions. Each of the contacts is shifted from its associated one of the reference positions to absorb a bonding alignment error between the first and second semiconductor wafers.

A first workpiece includes first active pads, a first test pad, and a second test pad on a primary surface of the first workpiece, the first test pad electrically connected to the second test pad. A second workpiece includes second active pads, a third test pad, and a fourth test pad on a primary surface of the second workpiece. The first and second workpieces are bonded along an interface between the primary surface of the first workpiece and the primary surface of the second workpiece to bond the first active pads with the second active pads, bond the first test pad with the third test pad, and bond the second test pad with the fourth test pad. Connectivity detection circuits test electrical connectivity between the third test pad and the fourth test pad.

A location displacement of an electrode of a device relative to an electrode pad of a semiconductor element is detected based on a conduction state between the electrode pad of the semiconductor element and the electrode of the device. The electrode pad of the semiconductor element is segmented into multiple portions and a first pad through a fourth pad uniformly arranged. A location displacement detector determines that no location displacement has occurred when the electrode pad of the semiconductor element is conductive to the electrode of the device, and determines that a location displacement has occurred when the electrode pad of the semiconductor element is non-conductive to the electrode of the device.

A laser is used to induce bonding of LED contact pads with corresponding substrate contact pads on a display substrate. The wavelength of the laser light and the material used for the contact pads are both selected so that the laser light is capable of melting the contact pads. For example, the laser light has a wavelength of between 220 nm and 1200 nm, and the contact pads are formed of a copper-tin oxide (CuSn). Furthermore, the system may be configured to shine the laser light through a number of other components, such as the pick-up head and the LED itself. These materials can be formed of materials that do not absorb the energy of the laser light. Bonding the contacts with a laser in this manner allows for faster heating and cooling times, avoids reheating of previously bonded contact pads, and reduces thermal expansion of the display substrate.

Discussed is a device for self-assembling semiconductor light-emitting diodes, in which the device includes an assembly chamber having a space for accommodating a fluid; a magnetic field forming part having at least one magnet for applying a magnetic force to the semiconductor light-emitting diodes dispersed in the fluid and a moving part for changing positions of the at least one magnet so that the semiconductor light-emitting diodes move in the fluid; a substrate chuck having a substrate support part configured to support a substrate, and a vertical moving part for lowering the substrate so that one surface of the substrate is in contact with the fluid in a state in which the substrate is supported by the substrate support part; and a controller for controlling a movement of the magnetic field forming part and the substrate chuck, wherein the controller controls a depth at which the substrate is submerged in the fluid based on a degree of warping of the substrate.

Discussed is a device for self-assembling semiconductor light-emitting diodes, in which the device includes an assembly chamber having a space for accommodating a fluid; a magnetic field forming part having at least one magnet for applying a magnetic force to the semiconductor light-emitting diodes dispersed in the fluid and a moving part for changing positions of the at least one magnet so that the semiconductor light-emitting diodes move in the fluid; a substrate chuck having a substrate support part configured to support a substrate, and a vertical moving part for lowering the substrate so that one surface of the substrate is in contact with the fluid in a state in which the substrate is supported by the substrate support part; and a controller for controlling a movement of the magnetic field forming part and the substrate chuck, wherein the controller controls a depth at which the substrate is submerged in the fluid based on a degree of warping of the substrate.

A semiconductor storage device includes first and second chips. The first chip includes memory cells provided on a first substrate in a memory cell region, a plurality of first pads provided on a first surface of the first substrate and disposed in an edge region of the first chip that surrounds the memory cell region, and a first conductive layer provided on the first substrate and electrically connected to the first pads. The second chip includes a first circuit provided on a second substrate in a circuit region, a plurality of second pads provided on the second substrate and disposed in an edge region of the second chip that surrounds the circuit region, and a second conductive layer provided on the second substrate and electrically connected to the second pads. The first pads of the first chip and the second pads of the second chip are bonded facing each other.