Patent classifications
H
ELECTRICITY
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H01
ELECTRIC ELEMENTS
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H01L
SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/80
Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
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H01L2224/80001
by connecting a bonding area directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding
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H01L2224/80213

SUBSTRATE ATTACHMENT FOR ATTACHING A SUBSTRATE THERETO
20180096962 · 2018-04-05 · ·

A method for bonding a first substrate with a second substrate, characterized in that the first substrate and/or the second substrate is/are thinned before the bonding.

Method for bonding substrates
09859246 · 2018-01-02 · ·

A method for bonding a first substrate with a second substrate, characterized in that the first substrate and/or the second substrate is/are thinned before the bonding.