A method for the transfer of components from a sender substrate to a receiver substrate includes provision and/or production of the components on the sender substrate, transfer of the components of the sender substrate to the transfer substrate, and transfer of the components from the transfer substrate to the receiver substrate.The components can be transferred selectively by means of bonding means and/or debonding means.

A display includes a pixel electrode disposed on a substrate, a light emitting element disposed on the pixel electrode, a connection electrode disposed on a side surface of the light emitting element, and a common electrode disposed on the light emitting element. The light emitting element includes a first sub light emitting element, a second sub light emitting element disposed on the first sub light emitting element, and a third sub light emitting element disposed on the second sub light emitting element. The connection electrode is disposed on at least one side surface of the first sub light emitting element, the second sub light emitting element, and the third sub light emitting element.

A display device includes a substrate, a plurality of pixel electrodes on the substrate and spaced apart from each other, a plurality of light-emitting elements on the plurality of pixel electrodes, respectively, and a common electrode layer on the plurality of light-emitting elements and to which a common voltage is applied. The plurality of light-emitting elements include a first light-emitting element that is configured to emit first light according to a first driving current and a second light-emitting element that is configured to emit second light according to a second driving current. An active layer of the first light-emitting element is the same as an active layer of the second light-emitting element.

A display device comprises a substrate, a pixel electrode on the substrate, a light emitting element on the pixel electrode, and a common electrode layer on the light emitting element, and configured to receive a common voltage, wherein the light emitting element configured to emit a first light according to a driving current having a first current density, is configured to emit a second light according to a driving current having a second current density, and is configured to emit a third light according to a driving current having a third current density.

A bonding apparatus includes a body part; a vacuum hole disposed in the body part; a first protruding part protruding in a first direction from a first surface of the body part; a second protruding part protruding from the first surface of the body part in the first direction and spaced farther apart from a center of the first surface of the body part than the first protruding part in a second direction intersecting with the first direction; and a trench defined by the first surface of the body part and second surfaces of the first protruding part, the second surfaces protruding in the first direction from the first surface of the body part, and the trench being connected to the vacuum hole, wherein the second protruding part protrudes farther from the first surface of the body part in the first direction than the first protruding part.

A bonding apparatus includes a body part; a vacuum hole disposed in the body part; a first protruding part protruding in a first direction from a first surface of the body part; a second protruding part protruding from the first surface of the body part in the first direction and spaced farther apart from a center of the first surface of the body part than the first protruding part in a second direction intersecting with the first direction; and a trench defined by the first surface of the body part and second surfaces of the first protruding part, the second surfaces protruding in the first direction from the first surface of the body part, and the trench being connected to the vacuum hole, wherein the second protruding part protrudes farther from the first surface of the body part in the first direction than the first protruding part.

An electronic power device including: a first electronic power component in which all the electrodes are arranged at a first main face of the first electronic power component; and an electric contact element in which a first main face is arranged against the first main face of the first electronic power component and which includes plural separate electrically conductive portions to which the electrodes of the first electronic power component are electrically connected. The first electronic power component and the electric contact element together form a stack such that a first lateral face of each of the portions of the electric contact element, substantially perpendicular to the first main face of the electric contact element, is arranged against at least one metallization of a support forming an electric contact of the first electronic power component.

A semiconductor device and method of manufacture are provided wherein semiconductor devices are attached over a semiconductor substrate. An opening is formed within metallization layers over the semiconductor substrate and the semiconductor substrate, and an encapsulant is placed to fill the opening. Once the encapsulant is placed, the semiconductor substrate is singulated to separate the devices. By recessing the material of the metallization layers and forming the opening, delamination damage may be reduced or eliminated.

The present invention discloses an implementation method for stacked connection between isolated circuit components, whose setting is according to at least two circuit components connecting in parallel/series in a circuit, wherein, in accordance with a circuit connection configuration, a plurality of corresponding pins of the components are soldered directly, making the components form an integrated module in accordance with a desired connection configuration of the circuit, and saving circuit boards and wires. Comparing to the circuit limited in a PCB in the prior art, it is possible to construct a circuit unit by welding connection in a way of building-block approach, achieving a circuit in a 3D space through directly welding between components, and owning a wider design space, it may shorten the time used for a circuit from design to process.

The present invention discloses an implementation method for stacked connection between isolated circuit components, whose setting is according to at least two circuit components connecting in parallel/series in a circuit, wherein, in accordance with a circuit connection configuration, a plurality of corresponding pins of the components are soldered directly, making the components form an integrated module in accordance with a desired connection configuration of the circuit, and saving circuit boards and wires. Comparing to the circuit limited in a PCB in the prior art, it is possible to construct a circuit unit by welding connection in a way of building-block approach, achieving a circuit in a 3D space through directly welding between components, and owning a wider design space, it may shorten the time used for a circuit from design to process.