A package includes a carrier substrate, a first die, and a second die. The first die and the second die are stacked on the carrier substrate in sequential order. The first die includes a first bonding layer, a second bonding layer, and an alignment mark embedded in the first bonding layer. The second die includes a third bonding layer. A surface of the first bonding layer form a rear surface of the first die and a surface of the second bonding layer form an active surface of the first die. The rear surface of the first die is in physical contact with the carrier substrate. The active surface of the first die is in physical contact with the third bonding layer of the second die.

A system includes an inverter including: a first galvanic isolator separating a low voltage area from a high voltage area, the first galvanic isolator having a first galvanic isolator output path; a second galvanic isolator having a second galvanic isolator output path; an amplifier connected to the first galvanic isolator via the first galvanic isolator output path, and connected to the second galvanic isolator via the second galvanic isolator output path, the amplifier having a first amplifier output path and a second amplifier output path; a comparator connected to the amplifier via the first amplifier output path and the second amplifier output path, the comparator having a first comparator output path and a second comparator output path; and a pulse reshape and envelope detector connected to the comparator via the first comparator output path and the second comparator output path.

A system includes: an inverter configured to convert DC power from a battery to AC power to drive a motor, wherein the inverter includes: a galvanic interface configured to separate a high voltage area from a low voltage area, the galvanic interface including a command channel and a message channel; a low voltage controller in the low voltage area, the low voltage controller configured to receive a PWM signal from a PWM controller; and a high voltage controller in the high voltage area, the high voltage controller configured to receive a control signal from the low voltage controller using the command channel of the galvanic interface, and send a switch state signal to the low voltage controller using the command channel of the galvanic interface, wherein the low voltage controller is configured to control the control signal based on the PWM signal and the switch state signal.

A system comprises an inverter configured to convert DC power from a battery to AC power to drive a motor, wherein the inverter includes: a galvanic isolator separating a high voltage area from a low voltage area; a low voltage phase controller in the low voltage area, the low voltage phase controller configured to receive a clock reference signal; and a high voltage phase controller in the high voltage area, the high voltage phase controller configured to align a clock reference signal of the high voltage phase controller with the clock reference signal of the low voltage phase controller.

A power module includes: a first substrate having an outer surface and an inner surface, the first substrate extending from a first longitudinal end toward a second longitudinal end; a power switch including a semiconductor die, the power switch being coupled to the inner surface of the first substrate; a second substrate having an outer surface and an inner surface, the power switch being coupled to the inner surface of the second substrate, the second substrate extending from a first longitudinal end toward a second longitudinal end, wherein the first longitudinal end of the first substrate is longitudinally offset from the first longitudinal end of the second substrate; a first electrically conductive spacer coupled to inner surface of the first substrate and to the inner surface of the second substrate; and a flex circuit coupled to the power switch.

A package includes a carrier substrate, a first die, and a second die. The first die and the second die are stacked on the carrier substrate in sequential order. The first die includes a first bonding layer, a second bonding layer, and an alignment mark embedded in the first bonding layer. The second die includes a third bonding layer. A surface of the first bonding layer form a rear surface of the first die and a surface of the second bonding layer form an active surface of the first die. The rear surface of the first die is in physical contact with the carrier substrate. The active surface of the first die is in physical contact with the third bonding layer of the second die.

A system includes an inverter configured to convert DC power from a battery to AC power to drive a motor, wherein the inverter includes: one or more controllers configured to provide a test signal to control a gate leakage detection operation, and a power module including: a phase switch including one or more phase power switches, and a point-of-use controller configured to detect a gate leakage of the phase switch based on the test signal.

A system includes: an inverter configured to convert DC power from a battery to AC power to drive a motor, wherein the inverter includes: a power switch including a drain terminal, a source terminal, and a gate terminal; and one or more controllers configured to: receive one or more signals related to an operation of the power switch, update one or more state definitions based on the received one or more signals, and control a gate control signal to the gate terminal based on the updated one or more state definitions.

A system includes: an inverter, wherein the inverter includes: a power module including: a flex layer including a gate trace, a first substrate, a second substrate including a source plane and a gate plane separated from the source plane by a full trench, the source plane including a step trench, and the gate plane including an electrical connection through the gate trace of the flex layer to a gate input connection of the power module, a semiconductor die disposed between the first substrate and the second substrate, the step trench formed in a portion of the source plane corresponding to at an edge of the semiconductor die, and the semiconductor die including a gate connected to the gate plane, and a sinter element disposed between the semiconductor die and the second substrate to connect the semiconductor die to the second substrate; a battery; and a motor.

A system includes: an inverter configured to convert DC power from a battery to AC power to drive a motor, wherein the inverter includes: a power module including: a first phase switch including one or more first phase power switches; a second phase switch including one or more second phase power switches; and one or more controllers configured to detect a gate open condition of the first phase switch or the second phase switch.