A solder connection may be surrounded by a solder locking layer (1210, 2210) and may be recessed in a hole (1230) in that layer. The recess may be obtained by evaporating a vaporizable portion (1250) of the solder connection. Other features are also provided.

An IC package, an electronic assembly, and methods of preventing warpage of components of an electronic assembly during fabrication of the electronic assembly are shown. An IC package including an adhesive disposed at or near at least one of four corners of a die of the IC package is shown. An electronic assembly including an IC package that includes an adhesive disposed at or near at least one of four corners of a second surface of a first substrate is shown. Methods of preventing warpage of components of an electronic assembly during fabrication of the electronic assembly that include applying an adhesive to at least one of four corners of a first surface of a first component are shown.

An electrode terminal includes a body and a first bonding part. The body includes a first metal material. Then, the first bonding part is bonded to one end of the body, and includes a second metal material which is a clad material other than the first metal material. The first bonding part is ultrasonically bondable to a first bonded member. An elastic part which is elastically deformable is provided between the one end of the body and the other end of the body.

Tools and systems for processing semiconductor devices, and methods of processing semiconductor devices are disclosed. In some embodiments, a method of using a tool for processing semiconductor devices includes a tool with a second material disposed over a first material, and a plurality of apertures disposed within the first material and the second material. The second material comprises a higher reflectivity than the first material. Each of the apertures is adapted to retain a package component over a support during an exposure to energy.

Tools and systems for processing semiconductor devices, and methods of processing semiconductor devices are disclosed. In some embodiments, a method of using a tool for processing semiconductor devices includes a tool with a second material disposed over a first material, and a plurality of apertures disposed within the first material and the second material. The second material comprises a higher reflectivity than the first material. Each of the apertures is adapted to retain a package component over a support during an exposure to energy.

A chip includes a semiconductor substrate, integrated circuits with at least portions in the semiconductor substrate, and a surface dielectric layer over the integrated circuits. A plurality of metal pads is distributed substantially uniformly throughout substantially an entirety of a surface of the chip. The plurality of metal pads has top surfaces level with a top surface of the surface dielectric layer. The plurality of metal pads includes active metal pads and dummy metal pads. The active metal pads are electrically coupled to the integrated circuits. The dummy metal pads are electrically decoupled from the integrated circuits.

A system and method for reworking a flip chip includes use of a mill to remove an old flip chip, and a pick-and-place device for putting a new flip chip in place at the same location. The process may be automated, with the removal and the placement occurring sequentially without need for operator intervention. Other devices and processes may be part of the system/machine and process, for example cleaning following the milling, fluxing prior to the placement, and heating to cause solder reflow, to secure the new flip chip in place. Underfill may be employed to make for a more mechanically robust mounting of the new flip chip.

A system and method for reworking a flip chip includes use of a mill to remove an old flip chip, and a pick-and-place device for putting a new flip chip in place at the same location. The process may be automated, with the removal and the placement occurring sequentially without need for operator intervention. Other devices and processes may be part of the system/machine and process, for example cleaning following the milling, fluxing prior to the placement, and heating to cause solder reflow, to secure the new flip chip in place. Underfill may be employed to make for a more mechanically robust mounting of the new flip chip.

A method of directly transferring a first semiconductor device die to a substrate includes loading a wafer tape into a first frame, loading a substrate into a second frame, arranging at least one of the first frame or the second frame such that a surface of the substrate is adjacent to a first side of the wafer tape, and orienting a needle to a position adjacent to a second side of the wafer tape, the needle extending in a direction toward the wafer tape. The method also includes activating a needle actuator connected to the needle to move the needle to a die transfer position at which the needle contacts the second side of the wafer tape to press the first semiconductor device die into contact with the second semiconductor device die.

In a method of manufacturing an electronic device, a solder paste is coated on a substrate pad of a substrate. An electronic product is disposed on the substrate such that a solder on an input/output pad of the electronic product makes contact with the solder paste. A first microwave is generated toward the solder paste during a reflow stage to heat the solder paste. A phase of the first microwave is changed during the reflow stage. Heating of the solder paste causes the solder to reflow, thereby forming a solder bump between the substrate pad and the input/output pad.