A chip packaging method using a hydrophobic surface includes forming superhydrophobic surfaces forming hydrophilic surfaces on predetermined positions of the superhydrophobic surfaces formed on the one of a first chip or the first board and the one of a second chip or a second board, respectively, generating liquid metal balls on the hydrophilic surfaces formed on the one of the first chip or the first board and the one of the second chip or the second board, respectively, and packaging the one of the first chip or the first board and the one of the second chip or the second board by combing the liquid metal ball of the one of the first chip or the first board and the liquid metal ball of the one of the second chip or the second board with each other.

A semiconductor package includes a plurality of semiconductor chips bonded to each other through direct bonding, the plurality of semiconductor chips including a first semiconductor chip and a second semiconductor chip. The first semiconductor chip including: a front insulating layer bonded to a back insulating layer of the second semiconductor chip; a front pad surrounded by the front insulating layer; a device layer on a back surface of the front insulating layer and including an interconnection structure electrically connected to the front pad; a conductive pattern between the interconnection structure and the front pad; and a support insulating layer between the device layer and the front insulating layer and surrounding the conductive pattern, wherein a gap is between a first side surface of the support insulating layer and a second side surface of the conductive pattern that faces the first side surface.

In a method of manufacturing a display device, the method includes forming a first electrode on a substrate, forming an insulating layer over the first electrode, aligning a first light emitting element on the insulating layer, light-exposing the insulating layer, exposing at least a portion of the first electrode by developing the insulating layer, and bonding the first light emitting element to the at least a portion of the first electrode.

An electronic structure includes a packaging structure, a circuit pattern structure, an underfill and a protrusion structure. The circuit pattern structure is disposed over the packaging structure. A gap is between the circuit pattern structure and the packaging structure. The underfill is disposed in the gap. The protrusion structure is disposed in the gap, and is configured to facilitate the distributing of the underfill in the gap.