A second wiring layer is connected to a first wiring layer via an insulating layer. The second wiring layer comprises pad structures. Each pad structure includes a first metal layer formed on the insulating layer, a second metal layer formed on the first metal layer, and a third metal layer formed on the second metal layer. The pad structures comprises a first pad structure and a second pad structure. A via-wiring diameter of the first pad structure is different from a via-wiring diameter of the second pad structure. A distance from an upper surface of the insulating layer to an upper surface of the second metal layer of the first pad structure is the same as a distance from the upper surface of the insulating layer to an upper surface of the second metal layer of the second pad structure.

A chip package structure is provided. The chip package structure includes a wiring substrate including a substrate, a first pad, and a second pad. The first pad and the second pad are respectively over a first surface and a second surface of the substrate, and the first pad is narrower than the second pad. The chip package structure includes a nickel layer over the first pad. The nickel layer has a T-shape in a cross-sectional view of the nickel layer. The chip package structure includes a chip over the wiring substrate. The chip package structure includes a conductive bump between the nickel layer and the chip.

An example of a method of making a printed structure comprises providing a destination substrate, contact pads disposed on the destination substrate, and a layer of adhesive disposed on the destination substrate. A stamp with a component adhered to the stamp is provided. The component comprises a stamp side in contact with the stamp and a post side opposite the stamp side, a circuit, and connection posts extending from the post side. Each of the connection posts is electrically connected to the circuit. The component is pressed into contact with the adhesive layer to adhere the component to the destination substrate and to form a printed structure having a volume defined between the component and the destination substrate. The stamp is removed and the printed structure is processed to fill or reduce the volume.

An example of a method of making a printed structure comprises providing a destination substrate, contact pads disposed on the destination substrate, and a layer of adhesive disposed on the destination substrate. A stamp with a component adhered to the stamp is provided. The component comprises a stamp side in contact with the stamp and a post side opposite the stamp side, a circuit, and connection posts extending from the post side. Each of the connection posts is electrically connected to the circuit. The component is pressed into contact with the adhesive layer to adhere the component to the destination substrate and to form a printed structure having a volume defined between the component and the destination substrate. The stamp is removed and the printed structure is processed to fill or reduce the volume.

A chip package structure is provided. The chip package structure includes a wiring substrate including a substrate, a first pad, and a second pad. The first pad and the second pad are respectively over a first surface and a second surface of the substrate, and the first pad is narrower than the second pad. The chip package structure includes a conductive adhesive layer over the first pad. The conductive adhesive layer is in direct contact with the first pad. The chip package structure includes a nickel layer over the conductive adhesive layer. The chip package structure includes a chip over the wiring substrate. The chip package structure includes a conductive bump between the nickel layer and the chip. The conductive bump includes gold.

A semiconductor package carrier board, a method for fabricating the same, and an electronic package having the same are provided. The method includes forming on a circuit structure a graphene layer that acts as an insulation heat dissipating layer. Since the heat conductivity of the graphene layer is far greater than the heat conductivity of ink (about 0.4 W/m.Math.k), which is used as solder resist, the heat of the semiconductor package carrier board can be conducted quickly, and thus can avoid the problem that the heat will be accumulated on the semiconductor package carrier board.

A fabrication method of an electronic device bonding structure includes the following steps. A first electronic component including a first conductive bonding portion is provided. A second electronic component including a second conductive bonding portion is provided. A first organic polymer layer is formed on the first conductive bonding portion. A second organic polymer layer is formed on the second conductive bonding portion. Bonding is performed on the first electronic component and the second electronic component through the first conductive bonding portion and the second conductive bonding portion, such that the first electronic component and the second electronic component are electrically connected. The first organic polymer layer and the second organic polymer layer diffuse into the first conductive bonding portion and the second conductive bonding portion after the bonding. An electronic device bonding structure is also provided.

A method for forming a chip package structure is provided. The method includes providing a wiring substrate including a substrate, a pad, and a polymer layer. The polymer layer is over the substrate and the pad, and the polymer layer has a first opening exposing the pad. The method includes forming a conductive adhesive layer over the polymer layer and the pad. The conductive adhesive layer is in direct contact with and conformally covers the polymer layer and the pad. The method includes forming a nickel layer over the conductive adhesive layer. The nickel layer is thicker than the conductive adhesive layer, and the nickel layer and the conductive adhesive layer are made of different materials. The method includes bonding a chip to the wiring substrate through a conductive bump. The conductive bump is between the nickel layer and the chip.

An electronic device includes a first metal plate including a first wiring and a second wiring, an electronic component mounted on a lower surface of the first wiring so as to overlap the second wiring in plan view, a second metal plate including an electrode electrically connected to the lower surface of the first wiring, and an insulation layer filling a space between the first metal plate, the second metal plate, and the electronic component and covering the electronic component. The upper surface of the second wiring is exposed from the insulation layer.

A fabrication method of an electronic device bonding structure includes the following steps. A first electronic component including a first conductive bonding portion is provided. A second electronic component including a second conductive bonding portion is provided. A first organic polymer layer is formed on the first conductive bonding portion. A second organic polymer layer is formed on the second conductive bonding portion. Bonding is performed on the first electronic component and the second electronic component through the first conductive bonding portion and the second conductive bonding portion, such that the first electronic component and the second electronic component are electrically connected. The first organic polymer layer and the second organic polymer layer diffuse into the first conductive bonding portion and the second conductive bonding portion after the bonding. An electronic device bonding structure is also provided.