An electronic apparatus includes a first electronic part with a first terminal, a second electronic part with a second terminal opposite the first terminal, and a joining portion which joins the first terminal and the second terminal. The joining portion contains a pole-like compound extending in a direction in which the first terminal and the second terminal are opposite to each other. The joining portion contains the pole-like compound, so the strength of the joining portion is improved. When the first terminal and the second terminal are joined, the temperature of one of the first electronic part and the second electronic part is made higher than that of the other. A joining material is cooled and solidified in this state. By doing so, the pole-like compound is formed.

Provided is a flip chip bonder including: a pickup flipping collet configured to flip a chip; and a bonding tool configured to receive the chip flipped with the pickup flipping collet from the pickup flipping collet and to bond the received chip to a circuit board. The pickup flipping collet includes a cooling channel through which cooling air flows to cool the pickup flipping collet. Thus, bonding time can be reduced without lowering bonding quality.

An embodiment bonded integrated circuit (IC) structure includes a first IC structure and a second IC structure bonded to the first IC structure. The first IC structure includes a first bonding layer and a connector. The second IC structure includes a second bonding layer bonded to and contacting the first bonding layer and a contact pad in the second bonding layer. The connector extends past an interface between the first bonding layer and the second bonding layer, and the contact pad contacts a lateral surface and a sidewall of the connector.

A semiconductor package structure includes a first die having a first bonding surface, a second die having a second bonding surface in which the second bonding surface faces the first bonding surface, and an intermediate structure between the first bonding surface and the second bonding surface. The intermediate structure includes a plurality of traces over the first bonding surface, a plurality of microbumps over the second bonding surface, and a plurality of joint parts between the traces and the microbumps, wherein the joint parts include an intermetallic compound.

Aspects of utilizing formate shells for metal structures on integrated circuit components include an integrated circuit device component including one or more metal interconnect structures and a formate shell on each of the one or more metal interconnect structures.