Semiconductor packages and manufacturing methods thereof are provided. One of the semiconductor packages includes a first chip, a second chip and a molding compound. The first chip has at least one first via and a protection layer thereon, and the at least one first via is formed in the protection layer. The second chip has at least one second via thereon. The molding layer encapsulates the first and second chips. The at least one second via is disposed in and contact with the molding layer, and top surfaces of the protection layer, the at least one first via and the at least one second via are substantially coplanar with a top surface of the molding layer.

An integrated circuit package can contain a semiconductor die and provide electrical connections between the semiconductor die and additional electronic components. The integrated circuit package can reduce stress placed on the semiconductor die due to movement of the integrated circuit package due to, for example, temperature changes and/or moisture levels. The integrated circuit package can at least partially mechanically isolate the semiconductor die from the integrated circuit package.

A fan out package may include a plurality of semiconductor dies, each of the semiconductor dies including a first surface and a second surface opposite to the first surface. The fan out package includes a redistribution layer coupled to the first surface of each of the plurality of semiconductor dies, a dieback conductive member coupled to the second surface of each of the plurality of semiconductors dies, and an encapsulation material coupled to the plurality of semiconductor dies and the dieback conductive member.

An integrated circuit package with improved reliability and methods for creating the same are disclosed. More specifically, integrated circuit packages are created using one or more sacrificial layers that provide support for ink printed wires prior to package processing, but are removed during package processing. Once each of the sacrificial layers is removed, molding compound is placed around each ink printed wire, which may have a substantially rectangular cross section that can vary in dimension along a length of a given wire. While substantially surrounding each wire in and of itself improves reliability, removing non-conductive paste, fillets, or other adhesive materials also minimizes adhesion issues between the molding compound and those materials, which increases the bond of the molding compound to the package and its components. The net result is a more reliable integrated circuit package that is less susceptible to internal cracking and wire damage.

The present disclosure provides a method of manufacturing a semiconductor device. The method includes providing an interconnection structure. The method also includes forming a first dielectric layer on the interconnection structure. The method further includes forming a sacrificial pattern on the first dielectric layer. The method also includes forming an RDL on the first dielectric layer and the sacrificial pattern. The method further includes removing the sacrificial pattern to form an air cavity within the RDL.

An electronic package is provided, including: a first circuit structure; an electronic component and a conductive pillar disposed on the first circuit structure; an encapsulation layer encapsulating the electronic component and the conductive pillar; a second circuit structure disposed on the encapsulation layer; and a shielding layer encapsulating the first circuit structure, a side surface of the encapsulation layer, and a side surface of the second circuit structure. The electronic component is surrounded by the shielding layer, and is protected from electromagnetic interference. A method for fabricating the electronic package is also provided.

An integrated circuit package with improved reliability and methods for creating the same are disclosed. More specifically, integrated circuit packages are created using one or more sacrificial layers that provide support for ink printed wires prior to package processing, but are removed during package processing. Once each of the sacrificial layers is removed, molding compound is placed around each ink printed wire, which may have a substantially rectangular cross section that can vary in dimension along a length of a given wire. While substantially surrounding each wire in and of itself improves reliability, removing non-conductive paste, fillets, or other adhesive materials also minimizes adhesion issues between the molding compound and those materials, which increases the bond of the molding compound to the package and its components. The net result is a more reliable integrated circuit package that is less susceptible to internal cracking and wire damage.

The present disclosure relates to the field of fabricating microelectronic device packages and, more particularly, to microelectronic device packages having bumpless build-up layer (BBUL) designs, wherein at least one secondary device is disposed within the thickness (i.e. the z-direction or z-height) of the microelectronic device of the microelectronic device package.

This disclosure relates generally to a semiconductor device and method of making the semiconductor device by pressing an electrical contact of a chip into a bonding layer on a carrier. The bonding layer is cured and coupled, at least in part, to the electrical contact. A molding layer is applied in contact with the chip and a first major surface of the bonding layer. Distribution circuitry is coupled to the electrical contact.

An electrode connection structure includes: a first electrode of an electrical circuit; and a second electrode of the electrical circuit that is electrically connected to the first electrode. The first and second electrodes are oppositely disposed in direct or indirect contact with each other. A plated lamination is substantially uniformly formed by plating process from a surface of a contact region and opposed surfaces of the first and second electrodes. A void near the surface of the contact region is filled by formation of the plated lamination. Portions of the plated lamination formed from the opposed surfaces of the first and second electrodes in a region other than the contact region are not joined together.