Provided are a transferring device and a transferring method of a micro light emitting diode. During the transferring process of the micro light emitting diode, the state of the magnetorheological fluid is controlled to achieve the physical connection of the micro light emitting diode and the transferring head to increase the acting force between the micro light emitting diode and the transferring head, thereby preventing damage during the transfer process of the micro light emitting diode for reducing the difficulty of transferring the light emitting diode. Moreover, with the simple electromagnetic device to control the connection and separation of the micro light emitting diode and the transferring head, the transferring operation of the micro light emitting diode is simplified to promote the transferring efficiency of the micro light emitting diode.

Embodiments of the invention relate generally to directed self-assembly (DSA) and, more particularly, to the DSA of electronic components using diamagnetic levitation.

Provided is a method of manufacturing a ultra-small light-emitting diode (LED) electrode assembly, the method including preparing a base substrate, forming an electrode line including a first electrode and a second electrode on the base substrate, positioning a guide member having a plurality of slit portions therein on the base substrate, and inserting ultra-small LED devices into the plurality of slit portions of the guide member.

Provided is a ultra-small light-emitting diode (LED) electrode assembly including a base substrate; an electrode line formed on the base substrate, and including a first electrode and a second electrode formed in a line shape to be interdigitated with each other while being spaced apart from each other; and at least one ultra-small LED device connected to the electrode line. A cross section of at least one of the first and second electrodes in a vertical direction has a height variation such that the first and second electrodes easily come in contact with the at least one ultra-small LED device.

A dipole alignment device includes an electric field forming part including a stage, and a probe part which form an electric field on the stage; an inkjet printing apparatus including at least one inkjet head which sprays ink including dipoles and a solvent with the dipoles dispersed therein onto the stage; a transportation part comprising a first moving part which moves the electric field forming part in at least one direction; and a light irradiation apparatus including a light irradiation part which applies light to the ink sprayed onto the stage.

Discussed is a self-assembly apparatus of a semiconductor light emitting device, the self-assembly apparatus including a fluid chamber configured to accommodate a plurality of semiconductor light emitting devices, each semiconductor light emitting device having a magnetic body; a magnet disposed to be spaced apart from the fluid chamber and configured to apply a magnetic force to the plurality of semiconductor light emitting devices; and a position controller connected to the magnet, and configured to control a position of the magnet; and a power supply configured to induce formation of an electric field on a substrate placed at an assembly position so that the plurality of semiconductor light emitting devices are seated at preset positions on the substrate while being moved due to a positional change of the magnet, wherein the position controller transfers the magnet in one direction while rotating the magnet about a rotation axis for the magnet.

Embodiments are related to scalable surface feature formation in a substrate and, more particularly, to systems and methods for forming displays using mechanically pressed patterns.

A method of forming a charge pattern on a microchip includes depositing a material on the surface of the microchip, and immersing the microchip in a fluid to develop charge in or on the material through interaction with the surrounding fluid.

Embodiments are related to scalable surface structure (e.g., a well or other structure) formation in a substrate and, more particularly, to systems and methods for forming displays using a photo-machinable material layer.

An apparatus including a bumped electrode array and a method of fabricating a bumped electrode array is disclosed. The method includes providing a substrate for the electrode array. The method also includes disposing a plurality of non-planar structures including electrodes above the substrate of the electrode array. The method further includes disposing a dielectric layer above the plurality of non-planar structures having a defined radius of curvature.