A fluidic assembly emissive display panel is presented with a plurality of wells exposing LED interfaces. Each LED interface is made up of a planar first interconnect platform having an x-axis first depth and is configured to accept an axial LED first electrode mounting wing. A planar second interconnect platform has the first depth and is configured to accept an axial LED second electrode mounting wing. A groove is interposed between the first and second interconnect platforms and has an x-axis second depth, greater than the first depth, and is configured to accept an axial LED body locking tooth. The axial LEDs have an inorganic LED body with two symmetrical locking teeth. First and second electrode mounting wings are electrically connected to corresponding LED interface first and second interconnect platforms, and aligned in a plane orthogonal to stacked LED body semiconductor layers.

A light emitting device includes: a substrate; a first electrode and a second electrode on the substrate and spaced apart from each other; a light emitting diode between the first electrode and the second electrode and connected to the first and second electrodes; a first contact on the first electrode; and a second contact on the second electrode. The first contact contacts the first electrode and a first portion of the light emitting diode, and the second contact contacts the second electrode and a second portion of the light emitting diode.

The present disclosure relates a display device including a semiconductor light emitting device, and a substrate having a receiving groove in which the semiconductor light emitting device is accommodated, wherein the semiconductor light emitting device includes a first conductive semiconductor layer, a second conductive semiconductor layer disposed at an upper portion of the first conductive semiconductor layer, a first conductive electrode disposed on the first conductive semiconductor layer, and a second conductive electrode disposed on the second conductive semiconductor layer, and spaced apart from the first conductive electrode along a horizontal direction, wherein when the semiconductor light emitting device is assembled into the receiving groove, the first conductive semiconductor layer has an asymmetrical shape with respect to at least one direction so that the first conductive electrode and the second conductive electrode are arranged at preset positions.

A mass transfer method for Micro-LEDs with a temperature-controlled adhesive layer, including: configuring a self-assembling structure based on Micro-LED dies and a transfer substrate having a self-receiving structure coated on its surface with a temperature-controlled adhesive layer; distributing the Micro-LED dies in water, soaking the transfer substrate in water and heating water to perform self-assembling; carrying out transferring and removing the transfer substrate to separate Micro-LED dies from a transfer substrate then onto a target substrate.

The present disclosure provides a display device, including a substrate, a plurality of semiconductor light emitting devices arranged on the substrate, a first wiring electrode and a second wiring electrode extended from the semiconductor light emitting devices, respectively, to supply an electric signal to the semiconductor light emitting devices, a plurality of pair electrodes arranged on the substrate to generate an electric field when an electric current is supplied, and provided with first and second pair electrodes formed on an opposite side to the first and second wiring electrodes with respect to the semiconductor light emitting devices, and a dielectric layer formed to cover the pair electrodes, wherein the plurality of pair electrodes are arranged in parallel to each other along a direction.

Embodiments are related to substrates having one or more well structures each exhibiting substantially vertical sidewalls and substantially planar bottoms.

A 3D printable feedstock ink is disclosed for use in a 3D printing process where the ink is flowed through a printing nozzle. The ink may be made up of a non-conductive flowable material and a plurality of chiplets contained in the non-conductive flowable material in random orientations. The chiplets may form a plurality of percolating chiplet networks within the non-conductive flowable material as ones of the chiplets contact one another. Each one of the chiplets has a predetermined circuit characteristic which is responsive to a predetermined electrical signal, and which becomes electrically conductive when the predetermined electrical signal is applied to the ink, to thus form at least one conductive signal path through the ink.

A 3D printable feedstock ink is disclosed for use in a 3D printing process where the ink is flowed through a printing nozzle. The ink may be made up of a non-conductive flowable material and a plurality of chiplets contained in the non-conductive flowable material in random orientations. The chiplets may form a plurality of percolating chiplet networks within the non-conductive flowable material as ones of the chiplets contact one another. Each one of the chiplets has a predetermined circuit characteristic which is responsive to a predetermined electrical signal, and which becomes electrically conductive when the predetermined electrical signal is applied to the ink, to thus form at least one conductive signal path through the ink.

Disclosed herein are implementations of a particles-transferring system, particle transferring unit, and method of transferring particles in a pattern. In one implementation, a particles-transferring system includes a first substrate including a first surface to support particles in a pattern, particle transferring unit including an outer surface to be offset from the first surface by a first gap, and second substrate including a second surface to be offset from the outer surface by a second gap. The particle transferring unit removes the particles from the first surface in response to the particles being within the first gap, secures the particles in the pattern to the outer surface, and transports the particles in the pattern. The second substrate removes the particles in the pattern from the particle transferring unit in response to the particles being within the second gap. The particles are to be secured in the pattern to the second surface.

Microperturbation fluidic assembly systems and methods are provided for the fabrication of emissive panels. The method provides an emissive substrate with a top surface patterned to form an array of wells. A liquid suspension is formed over the emissive substrate top surface, comprising a first liquid and emissive elements. Using an array of micropores, a perturbation medium, which optionally includes emissive elements, is injected into the liquid suspension. The perturbation medium may be the first liquid, a second liquid, or a gas. A laminar flow is created in the liquid suspension along the top surface of the emissive substrate in response to the perturbation medium, and emissive elements are captured in the wells. The ejection of the perturbation medium can also be used to control the thickness of the liquid suspension overlying the top surface of the emissive substrate.