A method is provided for fabricating an encapsulated emissive element. Beginning with a growth substrate, a plurality of emissive elements is formed. The growth substrate top surface is conformally coated with an encapsulation material. The encapsulation material may be photoresist, a polymer, a light reflective material, or a light absorbing material. The encapsulant is patterned to form fluidic assembly keys having a profile differing from the emissive element profiles. In one aspect, prior to separating the emissive elements from the handling substrate, a fluidic assembly keel or post is formed on each emissive element bottom surface. In one variation, the emissive elements have a horizontal profile. The fluidic assembly key has horizontal profile differing from the emissive element horizontal profile useful in selectively depositing different types of emissive elements during fluidic assembly. In another aspect, the emissive elements and fluidic assembly keys have differing vertical profiles useful in preventing detrapment.

Discussed is an assembly substrate used in a display manufacturing method for placing semiconductor light-emitting devices to predetermined positions thereof using an electric field and a magnetic field, the assembly substrate including a base part; a plurality of assembly electrodes extending in one direction and disposed in parallel on the base part; a dielectric layer disposed on the base part to cover the plurality of assembly electrodes; and partition walls disposed on the dielectric layer and defining cells at predetermined intervals along the one direction of the plurality of assembly electrodes so as to overlap portions of the plurality of assembly electrodes, and the semiconductor light-emitting devices being placed into the cells, respectively, wherein a protrusion part protrudes inward from at least one of inner surfaces of each of the cells.

Discussed is an assembly board including: a base portion; a plurality of assembly electrodes extending in one direction and disposed on the base portion at predetermined intervals; a dielectric layer stacked on the base portion to cover the plurality of assembly electrodes; and barrier ribs stacked on the dielectric layer and defining cells in which semiconductor light emitting diodes are seated at the predetermined intervals along an extending direction of the plurality of assembly electrodes so as to overlap a portion of the plurality of assembly electrodes, wherein the plurality of assembly electrodes include first electrodes and second electrodes disposed on different planes on the base portion, and wherein the first electrodes are disposed on one surface of the base portion, and the second electrodes are disposed on one surface of the dielectric layer.

Discussed in an assembly substrate used in a display manufacturing method for placing semiconductor light-emitting devices to predetermined positions thereof using an electric field and a magnetic field, the assembly substrate including: a base part; a plurality of pair electrodes extending in one direction and disposed in parallel on the base part; a dielectric layer disposed on the base part to cover the plurality of pair electrodes; and partition walls disposed on the dielectric layer and defining cells at predetermined intervals along the one direction of the plurality of pair electrodes so as to overlap portions of the plurality of pair electrodes, and the semiconductor light-emitting devices being placed into the cells, respectively, wherein at least one of a recess portion and a concave and convex portion is formed on an upper surface of each of the partition walls.

A display device includes a first electrode and a second electrode, spaced apart from each other; light emitting elements disposed between the first electrode and the second electrode; a first connection electrode electrically contacting the first electrode and first end portions of the light emitting elements; a second connection electrode electrically contacting the second electrode and second end portions of the light emitting elements; and a conductive pattern disposed between the first connection electrode and the second connection electrode. A first end portion of the conductive pattern electrically contacts the first connection electrode, and a second end portion of the conductive pattern electrically contacts the second connection electrode.

According to the present invention, in a display device comprising a substrate and semiconductor light emitting devices mounted on the substrate, the semiconductor light emitting devices are characterized in that the semiconductor light emitting devices include a protective layer and a pattern layer having one surface in contact with the protective layer, another surface in contact with the substrate, and a concave-convex structure on another surface, through such a structure, it is possible to minimize the phenomenon that the semiconductor light emitting device is adsorbed to the surface of the substrate other than the cell.

The present invention relates to a display device, and more particularly, to a display device using semiconductor light-emitting devices of several micrometers to tens of micrometers in size. The present invention provides a display device comprising: a base part; a plurality of assembly electrodes which is arranged on the base part and which generates an electric field when power is applied thereto; a dielectric layer formed to cover the assembly electrodes; and a plurality of semiconductor light-emitting devices arranged on the dielectric layer; wherein each of the semiconductor light-emitting devices comprises: a first assembly control layer formed at a portion of the whole area of one surface facing the dielectric layer; and a second assembly control layer formed at the other portion of the whole area of the one surface facing the dielectric layer, and made of a material different from that of the first assembly control layer.

The present invention relates to a method of manufacturing a display device, and more particularly, to a chip tray for supplying a micro-LED. The present invention provides a chip tray for transporting semiconductor light emitting devices in a fluid contained in an assembly chamber. Specifically, the present invention includes a tray for accommodating a plurality of semiconductor light emitting devices, a chip supply unit configured to supply a plurality of semiconductor light emitting devices to the tray unit and a nozzle unit disposed on the tray unit and configured to supply the semiconductor light emitting devices accommodated in the chip supply unit onto the tray unit. And the nozzle unit includes holes formed at predetermined intervals on the tray unit to supply the semiconductor light emitting devices at predetermined intervals.

Disclosed in the present specification are a substrate for transferring, with high reliability, a semiconductor light emitting element, and a method for manufacturing a display device by using same. Particularly, when a semiconductor light emitting element is self-assembled on an assembly substrate by using an electromagnetic field, an assembly groove in which a semiconductor light emitting element for alignment is assembled is formed in the assembly substrate. The semiconductor light emitting element for alignment, assembled in the assembly groove, is used for alignment in a step of being transferred to a final wiring substrate. Unlike conventional alignment keys, the semiconductor light emitting element for alignment reflects an alignment error of semiconductor light emitting elements that occurs during a transfer process after assembly. Therefore, when semiconductor light emitting elements are transferred to a wiring substrate on the basis of the semiconductor light emitting element for alignment, transfer accuracy can be improved.

The present invention relates to a display device and a method of manufacturing same, and more particularly, to a display device using semiconductor light-emitting elements each having a size that is several to several tens of um, and to a method of manufacturing same. The present invention provides a display device comprising a substrate including a wiring electrode, and a plurality of semiconductor light-emitting elements electrically connected to the wiring electrode, wherein each of the semiconductor light-emitting elements is provided with a plurality of recessed portions formed on a side surface thereof, and at least one of inner walls of each of the recessed portions forms an inclination with respect to one surface of a semiconductor light-emitting element that is in contact with the substrate.