An inkjet printing device includes a stage part including a stage, an inkjet head part including at least one inkjet head that disposes an ink on the stage, the ink including dipoles and a solvent having the dipoles, a heat treatment device that removes the solvent, a first sensing part that measures a position of the ink disposed on the stage, a second sensing part that measures a position of the inkjet head, and a third sensing part that measures a position of each of the dipoles disposed on the stage. A dipole aligning method includes disposing an ink on a substrate, the ink including dipoles and a solvent having the dipoles, generating an electric field on the substrate and disposing the dipoles on the substrate by the electric field, removing the solvent, and measuring a position of each of the dipoles disposed on the substrate.

Provided are a color conversion structure, a display apparatus, and a method of manufacturing a color conversion structure. The color conversion structure includes a bank structure including a groove, a color conversion layer accommodated in the groove, and a cover layer provided on the color conversion layer.

A micro-semiconductor chip transfer apparatus includes: a wet chip supply module configured to supply a plurality of micro-semiconductor chips and liquid onto a transfer substrate; a chip alignment module including an absorber configured to move along a surface of the transfer substrate while absorbing the liquid; and a chip extraction module configured to extract, from the absorber, the micro-semiconductor chips remaining in the absorber.

Embodiments are related to fluidic assembly and, more particularly, to systems and methods for forming physical structures on a substrate.

A liquid-droplet-like ink containing a plurality of vertical semiconductor light emitting element chips 40, each of which has a p-side electrode and an n-side electrode on the upper surface and the lower surface and is configured such that one of the p-side electrode and the n-side electrode is more strongly attracted to a magnetic field than the other is supplied to a chip joining part 421 on a lower electrode 420 on a mounting substrate 400, the semiconductor light emitting element chips 40 in the ink are joined to the chip joining part by applying an external magnetic field such that one of the p-side electrode and the n-side electrode faces to the chip joining part, and thereafter an upper electrode 430 having an upper electrode main line part 431 and a plurality of upper electrode branch line parts 432 which are connected by a thin film fuse 433 each other is formed as the upper layer of the semiconductor light emitting element chips 40 such that the other of the p-side electrode and the n-side electrode of the semiconductor light emitting element chip 40 and the upper electrode branch line part 432 are electrically connected each other.

Embodiments are related to systems and methods for forming and using a top-contact disk.

Embodiments are related to systems and methods for fluidic assembly, and more particularly to diodes offering orientation control properties in a fluidic assembly system.

Provided is a ultra-small light-emitting diode (LED) electrode assembly including a base substrate; an electrode line formed on the base substrate, and including a first electrode and a second electrode formed in a line shape to be interdigitated with each other while being spaced apart from each other; and at least one ultra-small LED device connected to the electrode line. A cross section of at least one of the first and second electrodes in a vertical direction has a height variation such that the first and second electrodes easily come in contact with the at least one ultra-small LED device.

Provided is a micro light emitting semiconductor device including a first semiconductor layer, a light emitting layer provided on the first semiconductor layer, a second semiconductor layer provided on the light emitting layer, and a color conversion layer provided on the second semiconductor layer, the color conversion layer including a porous layer that includes quantum dots, wherein a doping type of the second semiconductor layer is different from a doping type of the color conversion layer.

Discussed are a device for self-assembling semiconductor light-emitting diodes, in which the device includes an assembly chamber having a space for accommodating a fluid; a magnetic field forming part having at least one magnet for applying a magnetic force to the semiconductor light-emitting diodes dispersed in the fluid and a moving part for changing positions of the at least one magnet so that the semiconductor light-emitting diodes move in the fluid; and a substrate chuck having a substrate support part configured to support a substrate, and a vertical moving part for lowering the substrate so that one surface of the substrate is in contact with the fluid in a state in which the substrate is supported by the substrate support part, wherein the vertical moving part provided at the substrate chuck lowers the substrate on to the fluid so that a force of buoyancy by the fluid is applied to the substrate.