A wet alignment method for a micro-semiconductor chip and a display transfer structure are provided. The wet alignment method for a micro-semiconductor chip includes: supplying a liquid to a transfer substrate including a plurality of grooves; supplying the micro-semiconductor chip onto the transfer substrate; scanning the transfer substrate by using an absorber capable of absorbing the liquid. According to the wet alignment method, the micro-semiconductor chip may be transferred onto a large area.

A wet alignment method for a micro-semiconductor chip and a display transfer structure are provided. The wet alignment method for a micro-semiconductor chip includes: supplying a liquid to a transfer substrate including a plurality of grooves; supplying the micro-semiconductor chip onto the transfer substrate; scanning the transfer substrate by using an absorber capable of absorbing the liquid. According to the wet alignment method, the micro-semiconductor chip may be transferred onto a large area.

A reservoir of a light emitting element includes a storage container accommodating a material in which at least one light emitting element is dispersed. A first electrode and a second electrode are spaced apart from each other in the inside of the storage container. A power supply is electrically coupled to each of the first electrode and the second electrode to apply a power source corresponding to each of the first electrode and the second electrode. Holes are formed in each of the first electrode and the second electrode.

A display device and a method of making the display device are discussed. The display device includes a substrate, a plurality of partition walls disposed on the substrate, a plurality of semiconductor light emitting elements disposed on the substrate and disposed between the plurality of partition walls, and a passivation layer covering at least parts of the plurality of semiconductor light emitting elements and at least parts of the plurality of partition walls, wherein the passivation layer extends from side surfaces of the plurality of partition walls in a direction toward the plurality of semiconductor light emitting elements, so as to cover at least parts of the side surfaces of the plurality of partition walls and at least the parts of the plurality of semiconductor light emitting elements.

A method for manufacturing a display device according to the present invention is characterized by comprising the steps of: supplying semiconductor light-emitting elements in a first chamber containing a fluid; disposing a distribution device, in which a plurality of magnets are arranged, on one side of the first chamber; rotating the distribution device such that the semiconductor light-emitting elements form a continuous pattern along the arrangement direction of the plurality of magnets; and stopping the distribution device such that the semiconductor light-emitting elements are distributed to a plurality of dummies, wherein in the step of stopping the distribution device, the plurality of dummies are formed at positions corresponding to the plurality of magnets.

The disclosure provides a mass transfer method and device for micro light emitting diode chips. The method includes the following steps: performing magnetic pole electroplating on the micro light emitting diode chips obtained by peeling off the sapphire substrate to enable corresponding magnetic poles to be generated at corresponding positions of the micro light emitting diode chips; peeling off the transfer substrate, and placing the micro light emitting diode chips obtained by peeling off the transfer substrate in a dispersion liquid to form a solution in which micro light emitting diode chips are dispersed; and the display substrate picks up the micro light emitting diode chips dispersed under the action of the magnetic field force.

Disclosed herein are implementations of a particles-transferring system, particle transferring unit, and method of transferring particles in a pattern. In one implementation, a particles-transferring system includes a first substrate including a first surface to support particles in a pattern, particle transferring unit including an outer surface to be offset from the first surface by a first gap, and second substrate including a second surface to be offset from the outer surface by a second gap. The particle transferring unit removes the particles from the first surface in response to the particles being within the first gap, secures the particles in the pattern to the outer surface, and transports the particles in the pattern. The second substrate removes the particles in the pattern from the particle transferring unit in response to the particles being within the second gap. The particles are to be secured in the pattern to the second surface.

Discussed are a display device and a method of manufacturing the same, and more particularly, to a display device including a semiconductor light emitting device having a size of several μm to several tens of μm and a method of manufacturing the same. The present disclosure provides a display device, including a base portion, a plurality of transistors disposed on the base portion, a plurality of semiconductor light emitting devices disposed on the base portion, a plurality of wiring electrodes disposed on the base portion, and electrically connected to the plurality of transistors and the plurality of semiconductor light emitting devices, a partition wall disposed on the base portion, and formed to cover the plurality of transistors, and a connection electrode connecting some of the plurality of transistors and some of the plurality of wiring electrodes, wherein the connection electrode is configured to pass through the partition wall.

The present disclosure relates to the structure of a micro light-emitting device and an alignment substrate. The light-emitting device according to one embodiment includes an inclined side surface having a three-dimensional shape. The inclined side surface is formed to protrude from one surface of the micro light-emitting device, has magnetism, and includes two different electrodes formed in one direction. In this case, among the two electrodes, one electrode may be formed on a mesa portion, and the other electrode may be formed on the inclined side surface.

A method is provided for fabricating an encapsulated emissive element. Beginning with a growth substrate, a plurality of emissive elements is formed. The growth substrate top surface is conformally coated with an encapsulation material. The encapsulation material may be photoresist, a polymer, a light reflective material, or a light absorbing material. The encapsulant is patterned to form fluidic assembly keys having a profile differing from the emissive element profiles. In one aspect, prior to separating the emissive elements from the handling substrate, a fluidic assembly keel or post is formed on each emissive element bottom surface. In one variation, the emissive elements have a horizontal profile. The fluidic assembly key has horizontal profile differing from the emissive element horizontal profile useful in selectively depositing different types of emissive elements during fluidic assembly. In another aspect, the emissive elements and fluidic assembly keys have differing vertical profiles useful in preventing detrapment.