A batch bonding apparatus and bonding method. The bonding apparatus comprises: a chip supply unit (10) for providing a chip (60) to be bonded; a substrate supply unit (20) for providing a substrate; a transfer unit (40) for transferring the chip (60) between the chip supply unit (10) and the substrate supply unit (20); and a pickup unit (30) disposed above the chip supply unit (10), for picking up the chip (60) from the chip supply unit (10) and uploading the chip (60) to the transfer unit (40) after flipping a marked surface of the chip (60) in a required direction. In the present invention pickup of each chip is completed individually, but transfer processes and bonding processes can be carried out for multiple chips at the same time, greatly increasing yield.

Disclosed are a display device and a method of manufacturing a display device. The method of a display device according to an exemplary embodiment of the present disclosure includes: a first transferring step of transferring a plurality of LEDs disposed on a wafer onto a plurality of donors; and a second transferring step of transferring the plurality of LEDs transferred onto the plurality of donors onto a display panel, in which in the second transferring step, an area where one of the plurality of donors overlaps the display panel partially overlaps an area where the other one of the plurality of donors overlaps the display panel. Therefore, the plurality of LEDs having different wavelengths is uniformly transferred to reduce a boundary caused by the difference in wavelengths and improve color uniformity.

Techniques for high speed handling of ultra-small chips (e.g., micro-chips) by selective laser bonding and/or debonding are provided. In one aspect, a method includes: providing a first wafer including chips bonded to a surface thereof; contacting the first wafer with a second wafer, the second wafer including a substrate bonded to a surface thereof, wherein the contacting aligns individual chips with bonding sites on the substrate; and debonding the individual chips from the first wafer using a debonding laser having a small spot size of about 0.5 m to about 100 m, and ranges therebetween. A system is also provided that has digital cameras, a motorized XYZ-axis stage, and a computer control system configured to i) control a spot size of the at least one laser source and ii) adjust a positioning of the sample to align individual chips with a target area of the laser.

Techniques for high speed handling of ultra-small chips (e.g., micro-chips) by selective laser bonding and/or debonding are provided. In one aspect, a method includes: providing a first wafer including chips bonded to a surface thereof; contacting the first wafer with a second wafer, the second wafer including a substrate bonded to a surface thereof, wherein the contacting aligns individual chips with bonding sites on the substrate; and debonding the individual chips from the first wafer using a debonding laser having a small spot size of about 0.5 m to about 100 m, and ranges therebetween. A system is also provided that has digital cameras, a motorized XYZ-axis stage, and a computer control system configured to i) control a spot size of the at least one laser source and ii) adjust a positioning of the sample to align individual chips with a target area of the laser.

Method and system that operates on a server include a time and expense management interface for capturing time and expense reporting. The time and expense reporting is for utility distribution systems, such as electrical power distribution and/or transmission systems, cellular, telecommunications, cable TV, water and sewer, natural gas, and others. These utility distribution systems include a large number of devices or objects that are distributed across a big geographic area. In one example, the authorization to submit the invoice for portions of the mobilization work order that have completed the approval process includes only authorization to submit the invoice for those portions of the mobilization work order i) not already paid or ii) that have been previously submitted and completed the approval process. The invention helps to document time and expense for government agencies, such as public utility commissions. This documentation maybe used with setting special charges on customer invoices.

Method and system that operates on a server include a time and expense management interface for capturing time and expense reporting. The time and expense reporting is for utility distribution systems, such as electrical power distribution and/or transmission systems, cellular, telecommunications, cable TV, water and sewer, natural gas, and others. These utility distribution systems include a large number of devices or objects that are distributed across a big geographic area. In one example, the authorization to submit the invoice for portions of the mobilization work order that have completed the approval process includes only authorization to submit the invoice for those portions of the mobilization work order i) not already paid or ii) that have been previously submitted and completed the approval process. The invention helps to document time and expense for government agencies, such as public utility commissions. This documentation maybe used with setting special charges on customer invoices.

Methods for orientation and placement of computing devices are presented. Aspects include applying, using a viscous material application device, a layer of a viscous material to a surface of an object, the layer of the viscous material having a plurality of computing devices disposed therein. The layer of the viscous material is allowed to dry during a drying period, wherein each of the plurality of computing devices comprises a first material applied to a first side of each of the plurality of computing devices, the first material having a first characteristic. And each of the plurality of computing devices comprises a second material applied to a second side of each of the plurality of computing devices, the second material having a second characteristic. And each of the plurality of computing devices is configured to perform, during the drying period, a self-orientation operation.

Methods for orientation and placement of computing devices are presented. Aspects include applying, using a viscous material application device, a layer of a viscous material to a surface of an object, the layer of the viscous material having a plurality of computing devices disposed therein. The layer of the viscous material is allowed to dry during a drying period, wherein each of the plurality of computing devices comprises a first material applied to a first side of each of the plurality of computing devices, the first material having a first characteristic. And each of the plurality of computing devices comprises a second material applied to a second side of each of the plurality of computing devices, the second material having a second characteristic. And each of the plurality of computing devices is configured to perform, during the drying period, a self-orientation operation.

Disclosed are a display device and a method of manufacturing a display device. The method of a display device according to an exemplary embodiment of the present disclosure includes: a first transferring step of transferring a plurality of LEDs disposed on a wafer onto a plurality of donors; and a second transferring step of transferring the plurality of LEDs transferred onto the plurality of donors onto a display panel, in which in the second transferring step, an area where one of the plurality of donors overlaps the display panel partially overlaps an area where the other one of the plurality of donors overlaps the display panel. Therefore, the plurality of LEDs having different wavelengths is uniformly transferred to reduce a boundary caused by the difference in wavelengths and improve color uniformity.

A transfer device with three transfer bases comprises: a first machine base that carries a substrate; and at least one transfer assembly that is located above the first machine base, wherein the at least one transfer assembly comprises: a second machine base that carries a target device; a third machine base that is located above the second machine base; and a transfer head that is disposed on the third machine base for acquiring the target device from the second machine base and transferring the target device to a prescribed location on the substrate. In this disclosure, since the transfer assembly is located above the first machine base, a path that the transfer head needs to move along to complete the transfer process is shorter, thereby improving the production efficiency.