A bonding method of bonding a third object after bonding a second object to a first object, the method including evaluating a bonding result of bonding the second object to the first object, deciding, based on the bonding result, the third object to be bonded to the first object bonded with the second object from a plurality of the third objects, and bonding, based on the decision in the deciding, the third object to the first object bonded with the second object.

A bonding method includes providing a source substrate, the source substrate includes active side alignment marks on an active side of the source substrate, first non-active side alignment marks and second non-active side alignment marks on a non-active side of the source substrate, and obtaining positions of the active side alignment marks and positions of the first non-active side alignment marks of the source substrate, and determining alignment marks placement errors based on offsets between the positions of the active-side alignment marks and the positions of the first non-active side alignment marks in the X, Y, and directions.

According to an aspect, a manufacturing method of a display device includes: obtaining a first reference position on a surface of a holding substrate based on positions of a plurality of first alignment marks of the holding substrate; and aligning the holding substrate with a transfer destination substrate such that the first reference position on the holding substrate and a second reference position on a surface of the transfer destination substrate coincide. The holding substrate is sectioned into a plurality of first sections and a plurality of second sections when viewed from one direction. Each of the first sections is provided in a part of a gap between the second sections when viewed from the one direction, has a light transmission rate higher than a light transmission rate of the second sections, and forms the first alignment mark through which light passes when viewed from the one direction.

A processing apparatus for an electronic component includes a component holding portion that holds an electronic component, a support portion that supports the component holding portion such that the component holding portion is located on a circular orbit passing through a predetermined inspection position, a transport drive unit that rotates the support portion about a central axis of the circular orbit, an imaging unit that is configured to image an inspection surface of the electronic component held by the component holding portion disposed at the inspection position, a position sensor that acquires position information indicating a position of the inspection surface, and a focus adjustment unit that adjusts a focus of the imaging unit on the inspection surface.

A semiconductor package includes a first semiconductor chip including a first substrate and a first bonding layer disposed on the first substrate, and having a flat first outer surface provided by the first bonding layer; and a second semiconductor chip disposed on the first outer surface of the first semiconductor chip, including a second substrate and a second bonding layer disposed on the second substrate, and having a flat second outer surface provided by the second bonding layer and contacting the first outer surface of the first semiconductor chip. The first bonding layer includes a first outermost insulating layer providing the first outer surface, a first internal insulating layer stacked between the first outermost insulating layer and the first substrate, first external marks disposed in the first outermost insulating layer and spaced apart from each other, and first internal marks interlaced with the first external marks within the first internal insulating layer.

This invention relates to the process of correcting misalignment and filling voids after a microdevice transfer process. The process involves transfer heads, measurement of offset and misalignment in horizontal, vertical, and rotational errors. An execution of the new offset vector for the next transfer corrects the alignment.