An example of a method of making a printed structure comprises providing a destination substrate, contact pads disposed on the destination substrate, and a layer of adhesive disposed on the destination substrate. A stamp with a component adhered to the stamp is provided. The component comprises a stamp side in contact with the stamp and a post side opposite the stamp side, a circuit, and connection posts extending from the post side. Each of the connection posts is electrically connected to the circuit. The component is pressed into contact with the adhesive layer to adhere the component to the destination substrate and to form a printed structure having a volume defined between the component and the destination substrate. The stamp is removed and the printed structure is processed to fill or reduce the volume.

An example of a method of making a printed structure comprises providing a destination substrate, contact pads disposed on the destination substrate, and a layer of adhesive disposed on the destination substrate. A stamp with a component adhered to the stamp is provided. The component comprises a stamp side in contact with the stamp and a post side opposite the stamp side, a circuit, and connection posts extending from the post side. Each of the connection posts is electrically connected to the circuit. The component is pressed into contact with the adhesive layer to adhere the component to the destination substrate and to form a printed structure having a volume defined between the component and the destination substrate. The stamp is removed and the printed structure is processed to fill or reduce the volume.

A fan-out packaging structure includes a redistribution layer and a positioning sheet formed on the redistribution layer. The positioning sheet defines at least one opening penetrating opposite sides of the positioning sheet. At least one chip is mounted in the at least one opening. The redistribution layer comprises at least one conductive circuit. The at least one chip is electrically coupled to a corresponding one conductive circuit.

The present disclosure relates to a method of manufacturing a semiconductor device package. The method includes: (a) disposing a support structure on a first substrate; (b) electrically connecting a first electronic component on the first substrate, wherein a portion of the first electronic component is separated from the first substrate by the support structure; (c) heating the semiconductor device package; and (d) removing the support structure.

A display device includes a plurality of semiconductor light emitting diodes, first and second electrodes respectively extending from the plurality of semiconductor light emitting diodes to supply an electrical signal to the plurality of semiconductor light emitting diodes, a plurality of pair electrodes disposed on a substrate and having a first electrode and a second electrode, a dielectric layer disposed on the plurality of pair electrodes, and a chemical bond layer disposed between the dielectric layer and the plurality of semiconductor light emitting diodes and forming a covalent bond with the dielectric layer and each of the plurality of semiconductor light emitting diodes. The chemical bond layer bonds the semiconductor light emitting diodes to the dielectric layer when a voltage applied to the plurality of pair electrodes is cut off after the plurality of semiconductor light emitting diodes are assembled on the dielectric layer.

The present invention relates to a display device having a structure in which an assembly substrate on which self-assembly has taken place can be used as a final substrate, and a method for manufacturing same. According to an embodiment of the present invention, first-conductive-type electrodes of vertical-type semiconductor light-emitting elements can be connected to seed metal, which is used as a wiring electrode, via a solder part, and thus there is the effect of directly using, as a final substrate, an assembly substrate on which the vertical-type semiconductor light-emitting elements are self-assembled, without an additional transfer process.

A variable-stiffness module comprises a rigid structure (10) having a first stiffness, an intermediate substrate (20) having a second stiffness less than the first stiffness, and a flexible substrate (30) having a third stiffness less than the second stiffness. The rigid structure (10) is disposed on the intermediate substrate (20) and the intermediate substrate (20) is disposed on the flexible substrate (30). A conductor (40) is disposed partially on the intermediate substrate (21) and partially on the flexible substrate (30) and connected to the rigid structure (10). The conductor (40) extends from the rigid structure (10) to the intermediate substrate (21) to the flexible substrate (30). In some embodiments, a variable-stiffness module comprises any combination of multiple rigid structures, multiple intermediate substrates, and multiple conductors. The conductor (40) can be an optical conductor or an electrical conductor and can be disposed over the rigid structure (10) or between the rigid structure (10) and the intermediate substrate (21).

Methods and systems for a semiconductor device package with a die to interposer wafer first bond are disclosed and may include bonding a plurality of semiconductor die comprising electronic devices to an interposer wafer, and applying an underfill material between the die and the interposer wafer. Methods and systems for a semiconductor device package with a die-to-packing substrate first bond are disclosed and may include bonding a first semiconductor die to a packaging substrate, applying an underfill material between the first semiconductor die and the packaging substrate, and bonding one or more additional die to the first semiconductor die. Methods and systems for a semiconductor device package with a die-to-die first bond are disclosed and may include bonding one or more semiconductor die comprising electronic devices to an interposer die.

A method and apparatus for transferring components. A first substrate is provided with the components. A second substrate is provided with an adhesive layer comprising a hot melt adhesive material. The components on the first substrate are contacted with the adhesive layer on the second substrate while the adhesive layer is melted. The adhesive layer is allowed to solidify to form an adhesive connection between the components and the second substrate. The first and second substrates are moved apart to transfer the components. At least a subset of the components is transferred from the second substrate to a third substrate by radiating light onto the adhesive layer to form a jet of melted material carrying the components.

Provided is a method of manufacturing a ultra-small light-emitting diode (LED) electrode assembly, the method including preparing a base substrate, forming an electrode line including a first electrode and a second electrode on the base substrate, positioning a guide member having a plurality of slit portions therein on the base substrate, and inserting ultra-small LED devices into the plurality of slit portions of the guide member.