The present disclosure provides a method for packaging a camera assembly. The method includes: providing a photosensitive chip; mounting an optical filter on the photosensitive chip; temporarily bonding the photosensitive chip and functional components on a carrier substrate, where the photosensitive chip has soldering pads facing away from the carrier substrate and the functional components have soldering pads facing toward the carrier substrate; forming an encapsulation layer covering the carrier substrate, the photosensitive chip, and the functional components, and exposing the optical filter; after the encapsulation layer is formed, removing the carrier substrate; and after the carrier substrate is removed, forming a redistribution layer structure on a side of the encapsulation layer facing away from the optical filter to electrically connect the soldering pads of the photosensitive chip with the soldering pads of the functional components.

The present disclosure provides a camera assembly and a packaging method thereof, a lens module, and an electronic device. The packaging method of the camera assembly includes: providing a carrier substrate and forming a redistribution layer (RDL) structure on the carrier substrate; providing functional components having solder pads; forming a photosensitive unit, including a photosensitive chip and an optical filter mounted on the photosensitive chip, that the photosensitive chip has solder pads facing the optical filter; temporarily bonding the optical filter of the photosensitive unit with the carrier substrate, and placing the functional components on the RDL structure, that each of the solder pads of the photosensitive chip and the solder pads of the functional components faces the RDL structure and electrically connects with the RDL structure; forming an encapsulation layer covering the carrier substrate, that the encapsulation layer is coplanar with a highest top of the photosensitive chip and the functional components; and removing the carrier substrate.

The present disclosure provides a camera assembly and a packaging method thereof, a lens module, and an electronic device. The packaging method of the camera assembly includes: providing a carrier substrate and forming a redistribution layer (RDL) structure on the carrier substrate; providing functional components having solder pads; forming a photosensitive unit, including a photosensitive chip and an optical filter mounted on the photosensitive chip, that the photosensitive chip has solder pads facing the optical filter; temporarily bonding the optical filter of the photosensitive unit with the carrier substrate, and placing the functional components on the RDL structure, that each of the solder pads of the photosensitive chip and the solder pads of the functional components faces the RDL structure and electrically connects with the RDL structure; forming an encapsulation layer covering the carrier substrate, that the encapsulation layer is coplanar with a highest top of the photosensitive chip and the functional components; and removing the carrier substrate.

An integrated circuit package and a system including the integrated circuit package as well as a process for assembling the integrated circuit package are provided. The integrated circuit package includes a first die manufactured on a first wafer utilizing a first node size, a second die manufactured on a second wafer utilizing a second node size, and a substrate coupled to the second die at a plurality of bump sites on a bottom surface of the second die. The first die may be mounted on a top surface of the second die utilizing a hybrid wafer bonding technique, micro bumps, or electrode-less plating.

An embodiment method for forming a semiconductor package includes attaching a first die to a first carrier, depositing a first isolation material around the first die, and after depositing the first isolation material, bonding a second die to the first die. Bonding the second die to the first die includes forming a dielectric-to-dielectric bond. The method further includes removing the first carrier and forming fan-out redistribution layers (RDLs) on an opposing side of the first die as the second die. The fan-out RDLs are electrically connected to the first die and the second die.

A semiconductor package includes a first semiconductor chip including a body portion, a first bonding layer disposed on a first surface of the body portion, and through vias passing through at least a portion of the body portion; and a first redistribution portion disposed in the first semiconductor chip to be connected to the first semiconductor chip through the first bonding layer, the first redistribution portion including first redistribution layers electrically connected to the first semiconductor chip, a first wiring insulating layer disposed between the first redistribution layers, and a second bonding layer connected to the first bonding layer. The first bonding layer and the second bonding layer include first and metal pads disposed to correspond to each other and bonded to each other, respectively, and a first insulating layer and a second bonding insulating layer surrounding the first metal pads and the second metal pads, respectively.

In a general aspect, an apparatus can include a metal layer, a first semiconductor die, a second semiconductor die, a molding compound, a first electrical contact and a second electrical contact. The first semiconductor die can have a first side disposed on the metal layer. The second semiconductor die can have a first side disposed on the metal layer. The metal layer can electrically couple the first side of the first semiconductor die with the first side of the second semiconductor die. The molding compound can at least partially encapsulate the metal layer, the first semiconductor die and the second semiconductor die. The first electrical contact can be to a second side of the first semiconductor die and disposed on a surface of the apparatus. The second electrical contact can be to a second side of the second semiconductor die and disposed on the surface of the apparatus.

A package structure includes a die, an encapsulant, a dam structure, and a redistribution structure. The die has an active surface and a rear surface opposite to the active surface. The encapsulant encapsulates sidewalls of the die. The encapsulant has a first surface and a second surface opposite to the first surface. The first surface is coplanar with the rear surface of the die. The second surface is located at a level height different from the active surface of the die. The dam structure is disposed on the active surface of the die. A top surface of the dam structure is substantially coplanar with the second surface of the encapsulant. The redistribution structure is over the encapsulant, the dam structure, and the die. The redistribution structure is electrically connected to the die.

A semiconductor package includes an organic interposer, a semiconductor chip, a passivation layer, and an underbump metallurgy (UBM) layer. The organic interposer includes insulating layers and wiring layers disposed on the insulating layers. The semiconductor chip is disposed on one surface of the organic interposer. The passivation layer is disposed on another surface of the organic interposer opposing the one surface on which the semiconductor chip is disposed, and has openings extending to portions of the wiring layer. The UBM layer includes UBM pads disposed on the passivation layer and UBM vias disposed in the openings and connecting the UBM pads and the wiring layer to each other. At least one groove portion is disposed in an outer circumferential surface of the UBM pad.

In a general aspect, an apparatus can include a metal layer, a first semiconductor die, a second semiconductor die, a molding compound, a first electrical contact and a second electrical contact. The first semiconductor die can have a first side disposed on the metal layer. The second semiconductor die can have a first side disposed on the metal layer. The metal layer can electrically couple the first side of the first semiconductor die with the first side of the second semiconductor die. The molding compound can at least partially encapsulate the metal layer, the first semiconductor die and the second semiconductor die. The first electrical contact can be to a second side of the first semiconductor die and disposed on a surface of the apparatus. The second electrical contact can be to a second side of the second semiconductor die and disposed on the surface of the apparatus.