A balanced-type circular disk resonator includes a circular conductive layer, a conductive member including a first conductive portion provided on a first surface of the circular conductive layer to enable a first dielectric board, a dielectric property of which is measured, to be placed between the first conductive portion and the circular conductive layer, and a second conductive portion provided on a second surface of the circular conductive layer to enable a second dielectric board, a dielectric property of which is measured, to be placed between the second conductive portion and the circular conductive layer, the second surface being opposite to the first surface with regard to the circular conductive layer, and a temperature adjustment unit coupled to the conductive member and configured to adjust temperatures of the first conductive portion and the second conductive portion.

An aspect of the present invention reduces loss that may occur in cases where electromagnetic waves are guided from one main surface side of a substrate to the other main surface side of the substrate. A waveguide device (10, 10A, 20) includes: a substrate (11); a first conductor layer (12A) and a second conductor layer (12B) which are provided on both main surfaces of the substrate, respectively; a main conductor post (MP) which penetrates between the both main surfaces; and one or more sub-conductor posts (SP) which penetrate between the both main surfaces and which, together with the main conductor post, guide a TEM mode or a quasi-TEM mode.

The present disclosure provides a bandpass filter based on effective localized surface plasmons (ELSPs) and an operation method thereof. The bandpass filter includes a metal ground plane on a lower portion and a dielectric substrate in a middle as well as microstrips and dielectric resonators on an upper portion, where the microstrips at two terminals are symmetric with each other; each dielectric resonator includes a cuboid dielectric body and two metal strips, where the two metal strips each the same as the cuboid dielectric body in length are respectively located in a middle of an upper surface and lower surface of the dielectric body; and two microstrips are respectively connected to the metal strips on lower surfaces of two dielectric resonators, so as to be used as ports for feeding.

This application provides a dielectric resonator, including a dielectric body disposed in a hollow conductive housing, where the dielectric body includes a first end face and a second end face that are disposed opposite to each other and a circumferential surface connected between the first end face and the second end face. The first end face is provided with a first groove, the second end face is provided with a second groove, the first end face and the second end face are in contact with an inner wall of the conductive housing, and extension directions of the first groove and the second groove are different. This application further provides a filter. This application can implement single-sided installation of the dielectric resonator, so that an objective of miniaturization is achieved and assembly becomes easy. In addition, coupling between resonance modes can be enhanced because the extension directions of the first groove and the second groove are different.

A balanced-type circular disk resonator includes a circular conductive layer, a conductive member including a first conductive portion provided on a first surface of the circular conductive layer to enable a first dielectric board, a dielectric property of which is measured, to be placed between the first conductive portion and the circular conductive layer, and a second conductive portion provided on a second surface of the circular conductive layer to enable a second dielectric board, a dielectric property of which is measured, to be placed between the second conductive portion and the circular conductive layer, the second surface being opposite to the first surface with regard to the circular conductive layer, and a temperature adjustment unit coupled to the conductive member and configured to adjust temperatures of the first conductive portion and the second conductive portion.

A printed film RF micros trip bandpass filter includes a plurality of resonators disposed on a dielectric substrate, first and second input/output (I/O) interfaces connected to corresponding first and second resonators flanking one or more intermediate resonators. Opposite ends of the one or more intermediate resonators are connected to a ground plane on an opposite side of the substrate by corresponding conductors. The intermediate resonators have an electrical wavelength that is one-half a wavelength of a center frequency of the filter and the first and second resonators can have an electrical wavelength that is nominally one-half the wavelength of the bandpass filter center frequency.

A ring resonator based T-shaped duplexer for use in communication systems, the T-shaped duplexer comprising a T-shaped microstrip duplexer body having a first rectangular-shaped body section and a second rectangular-shaped body section that extends from the first-rectangular shaped section in a perpendicular position relative to the first rectangular-shaped section, three connection ports including a first connection port disposed at an open end of the second rectangular-shaped body section, a second connection port disposed at one end of the first rectangular-shaped body section, and a third connection port disposed at another end of the first rectangular-shaped body section, and two bandpass filters, each bandpass filter comprising a ring resonator structure having a circular shape, an outer edge of the ring resonator structure being connected to the first rectangular-shaped body section of the T-shaped microstrip duplexer body, wherein each of the two bandpass filters creates an Electromagnetically Induced Transparency (EIT) window within a frequency absorption region of the bandpass filter to allow a signal to pass at a pre-tuned frequency band.

A ring resonator based T-shaped duplexer for use in communication systems, the T-shaped duplexer comprising a T-shaped microstrip duplexer body having a first rectangular-shaped body section and a second rectangular-shaped body section that extends from the first-rectangular shaped section in a perpendicular position relative to the first rectangular-shaped section, three connection ports including a first connection port disposed at an open end of the second rectangular-shaped body section, a second connection port disposed at one end of the first rectangular-shaped body section, and a third connection port disposed at another end of the first rectangular-shaped body section, and two bandpass filters, each bandpass filter comprising a ring resonator structure having a circular shape, an outer edge of the ring resonator structure being connected to the first rectangular-shaped body section of the T-shaped microstrip duplexer body, wherein each of the two bandpass filters creates an Electromagnetically Induced Transparency (EIT) window within a frequency absorption region of the bandpass filter to allow a signal to pass at a pre-tuned frequency band.

Disclosed is a chip-to-chip interface using a microstrip circuit and a dielectric waveguide. A board-to-board interconnection device, according to one embodiment of the present invention, comprises: a waveguide which has a metal cladding and transmits a signal from a transmitter-side board to a receiver-side board; and a microstrip circuit which is connected to the waveguide and has a microstrip-to-waveguide transition (MWT), wherein the microstrip circuit matches a microstrip line and the waveguide, adjusts the bandwidth of a predetermined first frequency band among the frequency bands of the signal, and provides same to the receiver.

A six-pole patch bandpass filter includes a dielectric substrate and six electrically-conductive isosceles-triangle patches disposed thereon. A first pair of the patches is an electrically connected pair. The first pair of patches is capacitively coupled to a first microstrip. A second pair of the patches is also an electrically connected pair. The second pair of patches is capacitively coupled to a second microstrip. A third pair of the patches are nested between and capacitively coupled to the first pair of patches and the second pair of patches.