A triple-mode dielectric resonator filter includes: a dielectric resonator positioned in a cavity of a housing and formed perpendicular to a longitudinal direction of the housing; a dielectric support coupled to the dielectric resonator through a bonding process and mounted and fixed by a fixing screw passing through a screw fixing mounting hole in the cavity of the housing and fixed to support the dielectric resonator at a predetermined height; and compensation blocks formed to protrude at regular intervals on a side surface of the dielectric resonator to allow the dielectric resonator to operate in three modes. A band pass filter composed of a dielectric resonator and an NRN stub achieves an improved insertion loss, high compression properties and a stable structure compared to a typical band pass filter using an NRN stub.

Aspects of the disclosure are directed to a bandpass filter including a first, second, third and fourth resonators, wherein the second and third resonators are in parallel, wherein the first resonator includes a first and second terminals, wherein the second resonator includes a second resonator top terminal and a second resonator bottom terminal, wherein the third resonator includes a third resonator top terminal and a third resonator bottom terminal, wherein the fourth resonator includes a third terminal and a fourth terminal; wherein the first terminal is coupled to the second resonator top terminal, wherein the second terminal is coupled to the third resonator top terminal, wherein the third terminal is coupled to the third resonator bottom terminal, wherein the fourth terminal is coupled to the second resonator bottom terminal; a first inductor coupled to the first and third terminals; and a second inductor coupled to the second and fourth terminals.

This resonator has a via electrode part that is formed in a dielectric substrate; a plurality of shielding conductors that are formed so as to surround the via electrode part in the dielectric substrate; and a strip line that is connected to the via electrode part in the dielectric substrate and opposed to at least the shielding conductors, wherein a first input/output terminal and a second input/output terminal are connected to one of the shielding conductors to which a short-circuit end of the via electrode part is connected.

Aspects of the disclosure are directed to a bandpass filter including a first, second, third and fourth resonators, wherein the second and third resonators are in parallel, wherein the first resonator includes a first and second terminals, wherein the second resonator includes a second resonator top terminal and a second resonator bottom terminal, wherein the third resonator includes a third resonator top terminal and a third resonator bottom terminal, wherein the fourth resonator includes a third terminal and a fourth terminal; wherein the first terminal is coupled to the second resonator top terminal, wherein the second terminal is coupled to the third resonator top terminal, wherein the third terminal is coupled to the third resonator bottom terminal, wherein the fourth terminal is coupled to the second resonator bottom terminal; a first inductor coupled to the first and third terminals; and a second inductor coupled to the second and fourth terminals.

The present disclosure provides a bandpass filter based on effective localized surface plasmons (ELSPs) and an operation method thereof. The bandpass filter includes a metal ground plane on a lower portion and a dielectric substrate in a middle as well as microstrips and dielectric resonators on an upper portion, where the microstrips at two terminals are symmetric with each other; each dielectric resonator includes a cuboid dielectric body and two metal strips, where the two metal strips each the same as the cuboid dielectric body in length are respectively located in a middle of an upper surface and lower surface of the dielectric body; and two microstrips are respectively connected to the metal strips on lower surfaces of two dielectric resonators, so as to be used as ports for feeding.

The present disclosure relates to a cavity filter and a connecting structure included therein. The cavity filter includes: an RF signal connecting portion spaced apart, by a predetermined distance, from an outer member having an electrode pad provided on a surface thereof; and a terminal portion configured to electrically connect the electrode pad of the outer member and the RF signal connecting portion so as to absorb assembly tolerance existing at the predetermined distance and to prevent disconnection of the electric flow between the electrode pad and the RF signal connecting portion, wherein the terminal portion includes: first side terminal contacted with the electrode pad; and the second side terminal connected to the RF signal connecting portion. Therefore, the cavity filter can efficiently absorb assembly tolerance which occurs through assembly design, and prevents disconnection of an electric flow, thereby preventing degradation in performance of an antenna device.

The present invention relates to a cavity filter. The cavity filter includes: an RF signal connecting portion spaced apart, by a predetermined distance, from an outer member having an electrode pad provided on a surface thereof; and a terminal portion configured to electrically connect the electrode pad of the outer member and the RF signal connecting portion so as to absorb assembly tolerance existing at the predetermined distance and to prevent disconnection of the electric flow between the electrode pad and the RF signal connecting portion, wherein the terminal portion is divided into a first side terminal contacted with the electrode pad and a second side terminal connected to the RF signal connecting portion, absorbs the assembly tolerance existing in a terminal insertion port, in which the terminal portion is provided, through an elastic member provided between the first side terminal and the second side terminal, and prevents disconnection of an electric flow, thereby preventing degradation in performance of an antenna device.

A ceramic dielectric band-pass filter includes a ceramic base, a first input and output electrode, and a second input and output electrode. The ceramic base includes an open surface, a short-circuit surface, and an IO surface. The ceramic base includes first resonant cavities and second resonant cavities penetrating the ceramic base. The first resonant cavities are arranged between the second resonant cavities and are arranged along a length direction of the ceramic base. The first input and output electrode and the second input and output electrode are arranged on the IO surface and extend to the open surface. The first input and output electrode, the second input and output electrode, and the first resonant cavities are coupled to form a sixth-order band-pass filter. The first input and output electrode and the second input and output electrode are coupled with the second resonant cavities to form notch filters.

A multi-layered resonator circuit structure and a multi-layered filter circuit structure. The multi-layered resonator circuit structure includes a multi-layered substrate, a plurality of resonators and a plurality of conductive components. The multi-layered substrate has a top surface, a bottom surface, and a ground layer. The top surface and the bottom surface face away from each other. The ground layer is located between the top surface and the bottom surface. A part of the plurality of resonators is/are disposed on the top surface. Another part of the plurality of resonators is/are disposed on the bottom surface. The plurality of conductive components is located in the multi-layered substrate. The plurality of resonators is electrically connected to the ground layer, respectively, via the plurality of conductive components.

A band pass filter (1) includes two resonators (8) and (10) including respectively linear conductors (9) and (11) disposed inside a dielectric substrate (2), and a pair of input-output lines (13) and (14) to which the two resonators (8) and (10) are connected in parallel. Both ends of the linear conductor (9) of the resonator (8) are left open. The resonator (10) includes vias (12A) and (12B) through which both ends of the linear conductor (11) of the resonator (10) are connected to a ground conductor (6) on a first surface (2A) of the dielectric substrate (2). The pair of input-output lines (13) and (14) include respectively vias (15A) and (15B) for connection to a ground conductor (7) that is disposed on a second surface (2B) of the dielectric substrate (2).