A substrate-integrated device includes a substrate layer with a first dielectric constant and one or more dielectric vias, the one or more dielectric vias each includes a via-hole extending through the substrate layer, and a dielectric material with a second dielectric constant contained within the via-hole. The second dielectric constant is larger than, preferably at least two times, the first dielectric constant.

Systems and methods which provide filtering dielectric resonator antenna (FDRA) configurations implementing radiation cancellation are disclosed. Embodiments of a FDRA provide implementations of dielectric resonator antennas (DRAs) which are configured with a loop feed structure facilitates radiation cancellation to provide radiation nulls at frequencies outside of a desired passband to thereby implement radiation cancellation for filtering functionality of the FDRA. FDRAs of embodiments may be variously polarized, such as to provide linear polarization or circular polarization.

A band-pass filter includes a main body, five resonators, a shield, and a partition. The main body is formed of a dielectric. The partition is formed of a conductor. The five resonators are configured so that capacitive coupling is established between every two of the resonators adjacent to each other in circuit configuration. Each of the five resonators includes a resonator conductor portion. A first stage resonator and a fifth stage resonator are magnetically coupled to each other although not adjacent to each other in circuit configuration. The partition extends to pass between the respective resonator conductor portions of the first stage resonator and the fifth stage resonator, and is electrically connected to the shield.

An integrated filter system, including: a dielectric slab assembly; and a filter circuit arranged on the dielectric slab assembly, where the filter circuit includes a low-pass filter and a band-pass filter connected to one another in series. The present invention further discloses an antenna system. By means of the foregoing implementations, the filter system and the antenna system are integrated and miniaturized and have smaller weights, and the filter system and the antenna system have a simple structure and lower costs, and stable and reliable whole performance.

Disclosed is a chip-to-chip interface using a microstrip circuit and a dielectric waveguide. A board-to-board interconnection device, according to one embodiment of the present invention, comprises: a waveguide which has a metal cladding and transmits a signal from a transmitter-side board to a receiver-side board; and a microstrip circuit which is connected to the waveguide and has a microstrip-to-waveguide transition (MWT), wherein the microstrip circuit matches a microstrip line and the waveguide, adjusts the bandwidth of a predetermined first frequency band among the frequency bands of the signal, and provides same to the receiver.

Aspects of the disclosure are directed to a bandpass filter including a first, second, third and fourth resonators, wherein the second and third resonators are in parallel, wherein the first resonator includes a first and second terminals, wherein the second resonator includes a second resonator top terminal and a second resonator bottom terminal, wherein the third resonator includes a third resonator top terminal and a third resonator bottom terminal, wherein the fourth resonator includes a third terminal and a fourth terminal; wherein the first terminal is coupled to the second resonator top terminal, wherein the second terminal is coupled to the third resonator top terminal, wherein the third terminal is coupled to the third resonator bottom terminal, wherein the fourth terminal is coupled to the second resonator bottom terminal; a first inductor coupled to the first and third terminals; and a second inductor coupled to the second and fourth terminals.

This application provides a dielectric resonator, including a dielectric body disposed in a hollow conductive housing, where the dielectric body includes a first end face and a second end face that are disposed opposite to each other and a circumferential surface connected between the first end face and the second end face. The first end face is provided with a first groove, the second end face is provided with a second groove, the first end face and the second end face are in contact with an inner wall of the conductive housing, and extension directions of the first groove and the second groove are different. This application further provides a filter. This application can implement single-sided installation of the dielectric resonator, so that an objective of miniaturization is achieved and assembly becomes easy. In addition, coupling between resonance modes can be enhanced because the extension directions of the first groove and the second groove are different.

Provided is a dual-band resonator which can be downsized further than conventional ones. A dual-band resonator is provided with a first conductor and a second conductor. The first conductor is configured to be folded at a first folding part at the center so that both extensions are in a prescribed direction and adjacent to one another with a prescribed space therebetween, wherein a conductor part closer to one end side than the first folding part and a conductor part closer to the other end side than the first folding part are further folded at second folding parts between the one end and the first folding part and between the other end and the first folding part, respectively, in a direction in which the one end and the other end are apart from each other. The second conductor extends in a prescribed direction contiguously to the first folding part of the first conductor. The first conductor constitutes a half-wavelength resonator, and odd-mode resonance occurs in the first conductor. The first conductor and the second conductor constitute a half-wavelength resonator, and even-mode resonance occurs in the first conductor and the second conductor.

Disclosed is a chip-to-chip interface using a microstrip circuit and a dielectric waveguide. A board-to-board interconnection device, according to one embodiment of the present invention, comprises: a waveguide which has a metal cladding and transmits a signal from a transmitter-side board to a receiver-side board; and a microstrip circuit which is connected to the waveguide and has a microstrip-to-waveguide transition (MWT), wherein the microstrip circuit matches a microstrip line and the waveguide, adjusts the bandwidth of a predetermined first frequency band among the frequency bands of the signal, and provides same to the receiver.

This resonator has a via electrode part that is formed in a dielectric substrate; a plurality of shielding conductors that are formed so as to surround the via electrode part in the dielectric substrate; and a strip line that is connected to the via electrode part in the dielectric substrate and opposed to at least the shielding conductors, wherein a first input/output terminal and a second input/output terminal are connected to one of the shielding conductors to which a short-circuit end of the via electrode part is connected.