A device includes at least one electrically conductive structure and at least one stripline. The stripline includes stripline sections that are connected to one another in a series connection between a first terminal and a second terminal. A first subset of the stripline sections is arranged on a first side of the conductive structure and a second subset of the stripline sections is arranged on a second side of the conductive structure. The device also includes at least one conductive connection between the first subset of the stripline sections and the second subset of the stripline sections, wherein the at least one conductive connection is isolated from the at least one electrically conductive structure.

A power amplifier module includes a first phase shifter, a second phase shifter, and an electromagnetic shield. The first phase shifter includes a first transmission line assembly to shift a first amplified signal by a first phase angle. The second phase shifter includes a second transmission line assembly to shift a second amplified signal by a second phase angle. The electromagnetic shield is arranged to shield the first transmission line assembly from the second transmission line assembly. The power amplifier module may have, for example, Doherty amplifier configuration.

The invention provides a cable assembly having a conductive element and a transmission cable. A strip-shaped opening slot is opened on the conductive element. The transmission cable is embedded in the opening slot. The transmission cable includes a substrate, a ground wire and a signal cable respectively provided on both sides of the substrate. The ground wire is exposed outside the opening of the opening slot. The signal cable is placed in the opening slot. The electronic device comprises the cable assembly described above. The cable assembly and electronic device of the present invention have the advantages of small size and good signal transmission performance. The cable assembly and electronic device of the present invention have the advantages of small size and good signal transmission performance.

The invention provides a transmission cable with a main baseline layer and a superimposed line layer. The main baseline layer includes a superimposed part, and a non-superimposed part. The superimposed line layer and the superimposed part form an unbendable part; the non-superimposed part forms a bendable par. The main baseline layer includes a first grounding layer, a first base layer stacked, a signal line layer, and a second base layer. The superimposed line layer includes a third base layer and a second grounding layer. The bendable part is small in thickness, so that the transmission cable provided by the invention has good bending performance, thereby improving the practicability of the transmission cable and prolonging the service life of the transmission cable.

A flexible cable is provided. The flexible cable includes a first insulation part, a second insulation part disposed on the first insulation part, a first group of ground parts disposed at regular intervals under the first insulation part, at least one transmission line disposed at regular intervals under the first insulation part and alternately arranged with the first group of ground parts, an air gap formed under the first insulation part, a prepreg layer disposed under the first insulation part, and a third insulation part disposed under the air gap and the prepreg layer. The air gap is configured to prevent signals emitted from the at least one transmission line from propagating in a direction of the air gap. Hence, it is possible to shield electromagnetic interference with other electronic components while minimizing the signal loss.

Circuits and methods include transmission lines formed from a conductive cladding on a substrate surface. The transmission line includes additional reference conductors positioned co-planar on the surface, including a gap between the transmission line and each of the reference conductors. The transmission line and the reference conductors are at least partially encapsulated (e.g., sandwiched) between two substrates. Isolation boundaries may be included as ground planes, e.g., above and below the transmission line, on opposing surfaces of the substrates, and Faraday walls, e.g., vertically, through the substrates. Current densities generated by various electromagnetic signals are distributed among the transmission line and the reference conductors (as a tri-conductor arrangement), and may be partially further distributed to the isolation (ground) boundaries.

A radio frequency circuit includes at least one dielectric substrate, a trench formed in the dielectric substrate, and an electrically continuous conductive material in the trench. The radio frequency circuit further may include a first dielectric substrate, a second dielectric substrate, with the trench being formed in the first and second dielectric substrates. A method of fabricating an electromagnetic circuit includes providing at least one dielectric substrate, machining a trench in the at least one dielectric substrate, and filling the trench with an electrically conductive material to form an electrically continuous conductor.

A Printed Circuit Board (PCB) and methods for manufacturing the PCB board are provided. The PCB includes a Radio Frequency (RF) signal transition at a RF signal pad. Multiple conductive layers other than a conductive signal layer of the PCB and conductive portions of the conductive signal layer not in electrical contact with a RF signal transmission trace have common ground connections forming a ground cage structure within the PCB around the RF signal pad and RF the signal transmission trace.

Radio frequency transmission lines in a multi-layer printed circuit board structure include first and second rows of ground vias that extend vertically through the printed circuit board structure. A first transmission line segment extends horizontally along a first portion of the multi-layer printed circuit board structure and a second transmission line segment extends horizontally along a second portion of the multi-layer printed circuit board structure, the second transmission line segment vertically spaced apart from the first transmission line segment. A vertical dielectric structure extends between the first and second transmission line segments and a blind ground via extends vertically through the printed circuit board structure adjacent the vertical dielectric structure.

A high directivity compact size inter-layer coupler that has application for coupling off a pre-distortion coupling signal from a main signal at an output of a power amplifier to a pre-distortion circuit. The coupler includes a main signal line formed on a surface of a first dielectric layer opposite to a second dielectric layer, where the main signal line receives the main signal, and a coupling line formed between the second dielectric layer and a third dielectric layer, where the coupling line is electromagnetically coupled to the main line so as to generate the coupling signal thereon. The coupling line has a general U-shape including a first leg portion, a second leg portion and a transverse portion between the first and second leg portions. The transverse portion includes a plurality of spaced apart blocks coupled together by a narrow line portion.