The invention provides a method of manufacturing a printed circuit board. The printed circuit board (100) has a conductor layer (ground layer (70)), a signal layer (25) having a signal line (20) provided so as to oppose the conductor layer (ground layer (70)), and an insulating resin layer (60) disposed between the conductor layer (ground layer (70)) and the signal layer (25), the insulating resin layer (60) has voids in an overlapping location, in a plan view, with the signal line (20), and the voids (40) are communicated with the outside of the printed circuit board (100).

Enhanced air core transmission lines and transformers are disclosed. A transmission line or transformer is disposed on a dielectric substrate, with a first planar conductor on the dielectric substrate and a second planar conductor suspended above the first planar conductor. A set of support posts suspends the second planar conductor above the first planar conductor. Thermal performance of the transmission line or transformer is improved by having each of the set of support posts include a width which exceeds any gap between support posts. In some examples, openings are formed in the second planar conductor and may facilitate etching or other processes of forming the transmission line or transformer.

An ultra-wide band (UWB) radio frequency (RF)/optical aperture includes a substrate having a plurality of regions. The plurality of regions may have varying characteristics and properties. In some embodiments, the plurality of regions includes a first region having a first relative dielectric constant and being transparent to signals having a frequency in a first frequency range, a second region contained in the first region and having a second relative dielectric constant and being transparent to signals having a frequency in a second frequency range, and a third region contained within the second region and having a third relative dielectric constant and being transparent to signals having a frequency in a third frequency range.

RF transmission lines that include a conductive ground plane, a conductive strip that extends above the ground plane, one or more plastic strips disposed between the conductive ground plane and the conductive strip, the one or more plastic strips having a combined length that is at least half a length of the conductive strip, and a plurality of dielectric fasteners that maintain the conductive strip at a predetermined distance above the conductive ground plane.

The concepts, systems and methods described herein are directed towards a connectorless radio frequency (RF) interface between an antenna and RF processor. An RF interconnect is provided having a housing having a ridged waveguide portion provided therein, an upper cavity formed in an upper portion of the housing, a lower cavity formed in a lower portion of the housing, a first suspended air stripline (SAS) transmission line disposed in the lower cavity such that at least a portion of the first SAS transmission line crossed a slot formed by the ridged waveguide and a second SAS transmission line disposed in the upper cavity such that at least a portion of the second SAS transmission line crosses the slot formed by the ridged waveguide.

The invention provides a method of manufacturing a printed circuit board. The printed circuit board (100) has a conductor layer (ground layer (70)), a signal layer (25) having a signal line (20) provided so as to oppose the conductor layer (ground layer (70)), and an insulating resin layer (60) disposed between the conductor layer (ground layer (70)) and the signal layer (25), the insulating resin layer (60) has voids in an overlapping location, in a plan view, with the signal line (20), and the voids (40) are communicated with the outside of the printed circuit board (100).

This feeder line includes: a plate-shaped dielectric substrate; a first conductor pattern dividing a first surface of the dielectric substrate into a first area and a second area; a first-area ground conductor pattern formed in the first area; a second-area ground conductor pattern formed in the second area; a second-surface ground conductor pattern formed on a second surface; a second conductor pattern connecting the first conductor pattern and one or both of the first-area ground conductor pattern and the second-area ground conductor pattern; a plurality of conductors and connecting between the second-surface ground conductor pattern, and the first-area ground conductor pattern and the second-area ground conductor pattern; and a conductive member connecting the first-area ground conductor pattern and the second-area ground conductor pattern. A length of the second conductor pattern is an odd multiple of ? of a wavelength of a signal propagating through the first conductor pattern.

An electro-magnetic transmission line system having very low loss, which includes a low dielectric material proximate to a conductor on one side, a conductor on the opposite side and a substrate to which at least one of the conductors are attached. Also an antenna is provided, which incorporate the electro-magnetic transmission line system to transmit the radiation energy.

The concepts, systems and methods described herein are directed towards a connectorless radio frequency (RF) interface between an antenna and RF processor. An RF interconnect is provided having a housing having a ridged waveguide portion provided therein, an upper cavity formed in an upper portion of the housing, a lower cavity formed in a lower portion of the housing, a first suspended air stripline (SAS) transmission line disposed in the lower cavity such that at least a portion of the first SAS transmission line crossed a slot formed by the ridged waveguide and a second SAS transmission line disposed in the upper cavity such that at least a portion of the second SAS transmission line crosses the slot formed by the ridged waveguide.

The disclosure generally relates to shielded transmission lines, electrical systems including the shielded transmission lines, cables using shielded transmission lines, and electrical connectors using shielded transmission lines. In particular, the present disclosure provides transmission lines that include floating shields capable of isolating interference between conductors that can result in reduced crosstalk.