A high-frequency signal line includes a dielectric body including a first dielectric layer and one or more other dielectric layers laminated together. A first signal line is provided on a first main surface, which is a main surface located on one side in a direction of lamination, of the first dielectric layer. A second signal line is provided on a second main surface, which is a main surface located on another side in the lamination direction, of the first dielectric layer so as to face the first signal line via the first dielectric layer. The second signal line is electrically connected to the first signal line. A first ground conductor is located on one side in the lamination direction than the first signal line. A second ground conductor is located on another side in the lamination direction than the second signal line.

Techniques regarding an embedded microstrip transmission line implemented in one more superconducting microwave electronic devices are provided. For example, one or more embodiments described herein can comprise an apparatus, which can include a superconducting material layer positioned on a raised portion of a dielectric substrate. The raised portion can extend from a surface of the dielectric substrate. The apparatus can also comprise a dielectric film that covers at least a portion of the superconducting material layer and the raised portion of the dielectric substrate.

A radio frequency (RF) die package includes a switch assembly comprising an RF transmission line and a plurality of conductive mounting pads formed on a first substrate. A switching mechanism selectively couples a first portion of the RF transmission line to a second portion of the RF transmission line. An inverted ground plane assembly is coupled to the plurality of conductive mounting pads such that an electromagnetic field generated between the RF transmission line and the inverted ground plane assembly does not permeate the first substrate in a region of the switch assembly proximate the switching mechanism.

A high-frequency signal line includes a dielectric body including a first dielectric layer and one or more other dielectric layers laminated together. A first signal line is provided on a first main surface, which is a main surface located on one side in a direction of lamination, of the first dielectric layer. A second signal line is provided on a second main surface, which is a main surface located on another side in the lamination direction, of the first dielectric layer so as to face the first signal line via the first dielectric layer. The second signal line is electrically connected to the first signal line. A first ground conductor is located on one side in the lamination direction than the first signal line. A second ground conductor is located on another side in the lamination direction than the second signal line.

A radio frequency (RF) module having a plurality of channels includes a heat sink having at least one tapered edge; a substrate disposed over a surface of the heat sink such that the tapered edge of the heat sink extends past a boundary of the substrate. RF, logic and power circuitry is disposed on the substrate and one or more RF signal ports are formed on an edge of the substrate to allow the RF module to be used in an array antenna having a brick architecture. The tapered edge heat sink provides both a ground plane for RF signal components and a thermal path for heat generating circuits disposed in the substrate.

An ultra-wide band (UWB) radio frequency (RF)/optical aperture includes a substrate having a plurality of regions. The plurality of regions may have varying characteristics and properties. In some embodiments, the plurality of regions includes a first region having a first relative dielectric constant and being transparent to signals having a frequency in a first frequency range, a second region contained in the first region and having a second relative dielectric constant and being transparent to signals having a frequency in a second frequency range, and a third region contained within the second region and having a third relative dielectric constant and being transparent to signals having a frequency in a third frequency range.

A high-frequency signal line includes a dielectric body including a first dielectric layer and one or more other dielectric layers laminated together. A first signal line is provided on a first main surface, which is a main surface located on one side in a direction of lamination, of the first dielectric layer. A second signal line is provided on a second main surface, which is a main surface located on another side in the lamination direction, of the first dielectric layer so as to face the first signal line via the first dielectric layer. The second signal line is electrically connected to the first signal line. A first ground conductor is located on one side in the lamination direction than the first signal line. A second ground conductor is located on another side in the lamination direction than the second signal line.

A radio frequency (RF) die package includes a switch assembly comprising an RF transmission line and a plurality of conductive mounting pads formed on a first substrate. A switching mechanism selectively couples a first portion of the RF transmission line to a second portion of the RF transmission line. An inverted ground plane assembly is coupled to the plurality of conductive mounting pads such that an electromagnetic field generated between the RF transmission line and the inverted ground plane assembly does not permeate the first substrate in a region of the switch assembly proximate the switching mechanism.

A radio frequency (RF) module having a plurality of channels includes a heat sink having at least one tapered edge; a substrate disposed over a surface of the heat sink such that the tapered edge of the heat sink extends past a boundary of the substrate. RF, logic and power circuitry is disposed on the substrate and one or more RF signal ports are formed on an edge of the substrate to allow the RF module to be used in an array antenna having a brick architecture. The tapered edge heat sink provides both a ground plane for RF signal components and a thermal path for heat generating circuits disposed in the substrate.

A RF MEMS package includes a MEMS die assembly having a signal line formed on a top surface of a first mounting substrate, the signal line comprising a MEMS device selectively electrically coupling a first portion of the signal line to a second portion of the signal line, and two pairs of ground pads formed on the top surface of the first mounting substrate adjacent respective portions of the signal line. The pairs of ground pads are positioned adjacent respective sides of the MEMS device. A ground assembly is electrically coupled to the pairs of ground pads and includes a second mounting substrate and a ground region formed on a surface of the second mounting substrate. The ground region faces the top surface of the first mounting substrate and is electrically coupled to the pairs of ground pads. A cavity is formed between the ground region and the signal line.