There is provided a multilayer directional coupler formed in a wireless communications device formed by stacking a plurality of substrates, comprising a first conductive pattern formed on a first substrate among the plurality of substrates; and a second conductive pattern formed on a second substrate stacked on one surface of the first substrate and having one or more conductive lines overlapping the first conductive pattern when viewed in a plane direction.

A blind mate waveguide flange includes a mating surface for interfacing with a waveguide probe interface. The mating surface includes a choke flange and a first opening to one end of a waveguide transition section. The choke flange includes a choke groove separating a peripheral region of the mating surface from an inner region of the mating surface. The inner region is recessed relative to the peripheral region to provide an air gap upon mating with another mating surface. The first opening has a first shape. The blind mate waveguide flange further includes a waveguide connection interface that includes a second opening at an opposite end of the waveguide transition section for interfacing with a waveguide. The second opening has a second shape such that the waveguide transition section provides a transition from the first shape to the second shape.

Power-combining devices and more particularly spatial power-combining and related structural arrangements are disclosed. Such structural arrangements involve mechanical connections between center waveguide sections and input and/or output coaxial waveguide sections that provide scalable structures for different operating frequency bands, improved mechanical connections, and/or improved assembly. Exemplary structural arrangements include structures that extend through center waveguide sections and into input and/or output coaxial waveguide sections, integrated mechanical structures within the center waveguide section, compression fit arrangements, dielectric inserts arranged within channels of coaxial waveguide sections, and/or various combinations thereof.

An apparatus comprising a first power combiner/divider network and a second power combiner/divider network. The first power combiner/divider network splits a first electromagnetic signal into split signals that are connectable to signal processor(s). The second power combiner/divider network combines processed signals into a second electromagnetic signal. The apparatus includes a three-dimensional coaxial microstructure.

A power coupler includes an input port, first and second output ports and an antenna element that is electrically coupled between the first output port and the second output port or that is electrically coupled to an isolation port of the power coupler. The power coupler is configured to split a radio frequency signal incident at the input port and/or to combine radio signals incident at the respective first and second output ports.

The invention relates to a high frequency amplifier unit comprising several amplifier modules to amplify high frequency input signals into high frequency output signals and a coaxial combiner having an outer conductor and an inner conductor arranged coaxially to this to combine the high frequency output signals of the amplifier modules, wherein the amplifier modules are arranged on the outside of the outer conductor of the coaxial combiner and the amplifier modules are connected to the coaxial inner conductor of the coaxial combiner to transmit the high frequency output signals to the coaxial combiner. The invention additionally relates to an amplifier system.

An improved multi-stage broadband directional coupler with at least one line junction between two successive coupling sections has a) a change in the line thickness (LD) and/or b) a change in the line width (LB) and/or c) a change in the coupling distance (KA) between the adjacent coupling sections of the two coupling lines. An electrically conductive cover connected to the coupler housing is provided adjacent to the at least one line junction.

Provided are coaxial waveguide microstructures. The microstructures include a substrate and a coaxial waveguide disposed above the substrate. The coaxial waveguide includes: a center conductor; an outer conductor including one or more walls, spaced apart from and disposed around the center conductor; one or more dielectric support members for supporting the center conductor in contact with the center conductor and enclosed within the outer conductor; and a core volume between the center conductor and the outer conductor, wherein the core volume is under vacuum or in a gas state. Also provided are methods of forming coaxial waveguide microstructures by a sequential build process and hermetic packages which include a coaxial waveguide microstructure.

Provided are coaxial waveguide microstructures. The microstructures include a substrate and a coaxial waveguide disposed above the substrate. The coaxial waveguide includes: a center conductor; an outer conductor including one or more walls, spaced apart from and disposed around the center conductor; one or more dielectric support members for supporting the center conductor in contact with the center conductor and enclosed within the outer conductor; and a core volume between the center conductor and the outer conductor, wherein the core volume is under vacuum or in a gas state. Also provided are methods of forming coaxial waveguide microstructures by a sequential build process and hermetic packages which include a coaxial waveguide microstructure.

A directional coupler is configured to provide a forward and/or a backward signal derived from a high-frequency signal. The directional coupler comprises a coupling element coupled to a main line, wherein the main line is configured to transport the high frequency signal. The directional coupler further comprises a signal line connecting the coupling element to a measuring port. The signal line comprises a defected ground structure inserted between the coupling element and the measuring port.